component
MCP609-I
Public Made by Adomby adom
Microchip Tech Operational Amplifier, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownMCP609-I
Microchip Tech · Operational Amplifier · SOIC-14
MCP609-I from Microchip Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTA | output | Output of op amp A, a low-impedance voltage source with outputs held between VSS and VDD in normal operation. |
| 2 | VINA- | input | Inverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 3 | VINA+ | input | Non-inverting input of op amp A, a high-impedance CMOS input that operates between VSS - 0.3V and VDD + 0.3V in normal operation. |
| 4 | VDD | power_in | Positive power supply, which the datasheet states is 2.5V to 5.5V higher than VSS and requires bypass capacitors. |
| 5 | VINB+ | input | Non-inverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 6 | VINB- | input | Inverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 7 | VOUTB | output | Output of op amp B, a low-impedance voltage source. |
| 8 | VOUTC | output | Output of op amp C, a low-impedance voltage source (the pin table labels this as op amp B, which appears to be a typo). |
| 9 | VINC- | input | Inverting input of op amp C, a high-impedance CMOS input with low bias current. |
| 10 | VINC+ | input | Non-inverting input of op amp C, a high-impedance CMOS input with low bias current. |
| 11 | VSS | power_in | Negative power supply, connected to ground in typical single-supply operation. |
| 12 | VIND+ | input | Non-inverting input of op amp D, a high-impedance CMOS input with low bias current. |
| 13 | VIND- | input | Inverting input of op amp D, a high-impedance CMOS input with low bias current. |
| 14 | VOUTD | output | Output of op amp D, a low-impedance voltage source. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-14 |
| Category | Amplifiers/Comparators |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 2.5 | 6 | V | 3 | ||
| Quiescent Current per Amplifier | IQ | 18.7 | 25 | µA | IO = 0 | 3 | |
| Input Offset Voltage | VOS | -250 | 250 | µV | 3 | ||
| Power Supply Rejection Ratio | PSRR | 80 | 93 | dB | 3 | ||
| Input Bias Current at Temperature | IB | 80 | pA | TA = +85°C | 3 | ||
| Common Mode Rejection Ratio | CMRR | 75 | 91 | dB | VDD = 5V, VCM = -0.3V to 3.9V | 3 | |
| DC Open-Loop Gain (Large-signal) | AOL | 105 | 121 | dB | RL = 25 kΩ to VL, VOUT = 50 mV to VDD, 50 mV | 3 | |
| DC Open-Loop Gain (Large-signal) | AOL | 100 | 118 | dB | RL = 5 kΩ to VL, VOUT = 0.1V to VDD, 0.1V | 3 | |
| Specified Temperature Range | TA | -40 | 85 | °C | 5 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | Note 1 | 5 | |
| Storage Temperature Range | TA | -65 | 150 | °C | 5 | ||
| Thermal Resistance, 14L-SOIC | θJA | 95.3 | °C/W | 5 | |||
| Supply Voltage (absolute maximum) | VDD -VSS | 7 | V | 3 | |||
| Current at Input Pins | -2 | 2 | mA | 3 | |||
| Current at Output and Supply Pins | -30 | 30 | mA | 3 | |||
| Maximum Junction Temperature | TJ | 150 | °C | 3 | |||
| ESD Protection on All Pins (HBM) | 3 | kV | HBM | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | P = Plastic DIP (300 mil Body), 8-lead, 14-lead SN = Plastic SOIC (3.90 mm body), 8-lead | 39 |
CAD (KiCad official)
- Symbol:
MCP609-I - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
mcp609-i-etched.step/mcp609-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp609-i.step/mcp609-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (42 pp, sha256
d6c54507be187971, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).