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Contents

README

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MCP6061T-E

Microchip Tech · Precision Op Amps · SOT-23-5

MCP6061T-E from Microchip Tech, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT output Analog output of the op amp; the output pins are low-impedance voltage sources.
2 VSS power_in Negative power supply; in single-supply operation VSS is connected to ground, and all other pins must stay between VSS and VDD for normal operation.
3 VIN+ power_in Non-inverting input, a high-impedance CMOS input with low bias current.
4 VIN- power_in Inverting input, a high-impedance CMOS input with low bias current.
5 VDD power_in Positive power supply, 1.8V to 6.0V higher than VSS; VDD requires bypass capacitors.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-5
Category Amplifiers/Comparators
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS -150 150 µV VDD = 3.0V, VCM = VDD/3 3
Power Supply Rejection Ratio PSRR 70 87 dB VCM = VSS 3
Input Bias Current IB 1 100 pA 3
Input Bias Current IB 1100 5000 pA TA = +125°C 3
Common Mode Rejection Ratio CMRR 72 89 dB VCM = -0.15V to 1.95V, VDD = 1.8V 3
Common Mode Rejection Ratio CMRR 74 91 dB VCM = -0.3V to 6.3V, VDD = 6.0V 3
Common Mode Rejection Ratio CMRR 72 87 dB VCM = 3.0V to 6.3V, VDD = 6.0V 3
Common Mode Rejection Ratio CMRR 74 89 dB VCM = -0.3V to 3.0V, VDD = 6.0V 3
DC Open-Loop Gain (Large Signal) AOL 95 115 dB 0.2V < VOUT < (VDD-0.2V), VCM = VSS 4
Supply Voltage VDD 1.8 6 V 4
Quiescent Current per Amplifier IQ 30 60 90 µA IO = 0, VDD = 6.0V, VCM = 0.9VDD 4
Operating Temperature Range TA -40 125 °C Note 1: TJ must not exceed +150°C 4
Thermal Resistance, 5L-SOT-23 θJA 220.7 °C/W 4
Current at Input Pins -2 2 mA 3
Current at Output and Supply Pins -30 30 mA 3
Storage Temperature -65 150 °C 3
Maximum Junction Temperature (TJ) TJ 150 °C 3
ESD protection, HBM 4 kV HBM; all pins 3
ESD protection, MM 400 V MM; all pins 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin SL = Plastic SOIC (150 mil Body), 14-lead SN = Plastic SOIC, (150 mil Body), 8-lead 37

CAD (KiCad official)

  • Symbol: MCP6061T-E
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: mcp6061t-e-etched.step / mcp6061t-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp6061t-e.step / mcp6061t-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (40 pp, sha256 006a7e95e8e3f128, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF