component
MCP6032-E
Public Made by Adomby adom
Microchip Tech Operational Amplifier, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownMCP6032-E
Microchip Tech · Operational Amplifier · MSOP-8
MCP6032-E from Microchip Tech, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTA | output | Analog output of op amp A; the output pins are low-impedance voltage sources. |
| 2 | VINA- | input | Inverting input of op amp A; a high-impedance CMOS input with low bias current. |
| 3 | VINA+ | input | Non-inverting input of op amp A; a high-impedance CMOS input with low bias current, and the device operates with VCM up to 300 mV above VDD and 300 mV below VSS. |
| 4 | VSS | power_in | Negative power supply; typically connected to ground in single-supply operation, with VDD 1.8V to 5.5V higher than VSS. |
| 5 | VINB+ | input | Non-inverting input of op amp B; a high-impedance CMOS input with low bias current. |
| 6 | VINB- | input | Inverting input of op amp B; a high-impedance CMOS input with low bias current. |
| 7 | VOUTB | output | Analog output of op amp B; the output pins are low-impedance voltage sources. |
| 8 | VDD | power_in | Positive power supply, 1.8V to 5.5V higher than VSS; VDD will need bypass capacitors. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | -150 | 150 | µV | VDD = 3.0V, VCM = VDD/3 | 2 | |
| Power Supply Rejection Ratio | PSRR | 70 | 88 | dB | VCM = VSS | 2 | |
| Input Bias Current | IB | 1 | 100 | pA | 2 | ||
| Input Bias Current at TA = +125°C | IB | 2000 | 5000 | pA | TA = +125°C | 2 | |
| Common Mode Rejection Ratio | CMRR | 70 | 95 | dB | VCM = -0.3V to 2.1V, VDD = 1.8V | 2 | |
| Common Mode Rejection Ratio | CMRR | 72 | 93 | dB | VCM = -0.3V to 5.8V, VDD = 5.5V | 2 | |
| Common Mode Rejection Ratio | CMRR | 70 | 89 | dB | VCM = 2.75V to 5.8V, VDD = 5.5V | 2 | |
| DC Open-Loop Gain (Large Signal) | AOL | 95 | 115 | dB | 0.2V < VOUT < (VDD, 0.2V), RL = 50 kΩ to VL | 2 | |
| Common Mode Input Voltage Range | VCMR | -0.3 | V | 2 | |||
| Maximum Output Voltage Swing (VOL, VOH) | VOL, VOH | 10 | mV | RL = 50 kΩ to VL, 0.5V input overdrive | 3 | ||
| Supply Voltage | VDD | 1.8 | 5.5 | V | 3 | ||
| Quiescent Current per Amplifier | IQ | 0.4 | 0.9 | 1.35 | µA | IO = 0, VCM = VDD, VDD = 5.5V | 3 |
| Operating Temperature Range | TA | -40 | 125 | °C | 5 | ||
| Storage Temperature Range | TA | -65 | 150 | °C | 5 | ||
| Thermal Resistance, 8L-MSOP | θJA | 206 | °C/W | 5 | |||
| Current at Input Pins | -2 | 2 | mA | 2 | |||
| Analog Inputs (VIN+, VIN-) | -1 | V | 2 | ||||
| All Other Inputs and Outputs | -0.3 | V | 2 | ||||
| Current at Output and Supply Pins | -30 | 30 | mA | 2 | |||
| Maximum Junction Temperature | TJ | 150 | °C | 2 | |||
| ESD Protection, HBM | 4 | kV | HBM | 2 | |||
| ESD Protection, MM | 400 | V | MM | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | SL = Plastic SOIC (150 mil Body), 14-lead SN = Plastic SOIC, (150 mil Body), 8-lead | 31 |
CAD (KiCad official)
- Symbol:
MCP6032-E - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
mcp6032-e-etched.step/mcp6032-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp6032-e.step/mcp6032-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (34 pp, sha256
02bc216237cb3668, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).