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MCP6024-E

Microchip Tech · General Purpose Amplifiers · SOIC-14

MCP6024-E from Microchip Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Analog output of op amp A, a low-impedance voltage source.
2 VINA- input Inverting input of op amp A, a high-impedance CMOS input with low bias current.
3 VINA+ input Non-inverting input of op amp A, a high-impedance CMOS input with low bias current.
4 VDD power_in Positive power supply, 2.5V to 5.5V higher than VSS, and it needs a bypass capacitor.
5 VINB+ input Non-inverting input of op amp B, a high-impedance CMOS input with low bias current.
6 VINB- input Inverting input of op amp B, a high-impedance CMOS input with low bias current.
7 VOUTB output Analog output of op amp B, a low-impedance voltage source.
8 VOUTC output Analog output of op amp C, a low-impedance voltage source.
9 VINC- input Inverting input of op amp C, a high-impedance CMOS input with low bias current.
10 VINC+ input Non-inverting input of op amp C, a high-impedance CMOS input with low bias current.
11 VSS power_in Negative power supply, connected to ground in single-supply use.
12 VIND+ input Non-inverting input of op amp D, a high-impedance CMOS input with low bias current.
13 VIND- input Inverting input of op amp D, a high-impedance CMOS input with low bias current.
14 VOUTD output Analog output of op amp D, a low-impedance voltage source.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-14
Category Amplifiers
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage (Extended Temp) VOS -250 250 µV VCM = 0V, VDD = 5.0V 3
Input Offset Voltage (Extended Temp, full temp) VOS -2.5 2.5 mV VCM = 0V, VDD = 5.0V, TA = -40°C to +125°C 3
Power Supply Rejection Ratio PSRR 74 90 dB VCM = 0V 3
Input Bias Current (Extended Temp) IB 640 5000 pA TA = +125°C 3
Common-Mode Input Range VCMR -0.3 0.3 V VSS, 0.3 to VDD + 0.3 (min relative to VSS, max relative to VDD) 3
Common-Mode Rejection Ratio CMRR 74 90 dB VDD = 5V, VCM = -0.3V to 5.3V 3
Common-Mode Rejection Ratio CMRR 70 85 dB VDD = 5V, VCM = 3.0V to 5.3V 3
DC Open-Loop Gain (Large Signal) AOL 90 110 dB VCM = 0V, VOUT = VSS + 0.3V to VDD, 0.3V 3
Maximum Output Voltage Swing VOL, VOH 15 20 mV 0.5V input overdrive; VSS + 15 mV to VDD, 20 mV 3
Supply Voltage VDD 2.5 5.5 V 3
Quiescent Current per Amplifier IQ 0.5 1 1.35 mA IO = 0 3
Input Offset Voltage Temperature Drift ΔVOS/ΔTA 3.5 µV/°C TA = -40°C to +125°C (±3.5) 3
Input Bias Current IB 1 pA 3
Input Offset Current IOS 1 pA ±1 3
Output Short Circuit Current ISC 30 mA VDD = 2.5V (±30) 3
Output Short Circuit Current ISC 22 mA VDD = 5.5V (±22) 3
Gain Bandwidth Product GBWP 10 MHz 4
Phase Margin PM 65 ° G = +1 V/V 4
Slew Rate SR 7 V/µs 4
Input Noise Voltage Density eni 8.7 nV/√Hz f = 10 kHz 4
Supply Voltage Differential VDD-VSS 7 V 3
Current Analog Input Pins VIN+, VIN- -2 2 mA ±2 mA 3
Analog Inputs Voltage VIN+, VIN- -1 1 V VSS, 1.0V to VDD + 1.0V 3
All Other Inputs and Outputs -0.3 0.3 V VSS, 0.3V to VDD + 0.3V 3
Current at Output and Supply Pins -30 30 mA ±30 mA 3
Storage Temperature -65 150 °C 3
Maximum Junction Temperature TJ 150 °C 3
ESD Protection (HBM) 2 kV All pins, HBM; MM 200V 3
Extended Temperature Range TA -40 125 °C 5
Operating Temperature Range TA -40 125 °C Note 1 5
Thermal Resistance, 14L-SOIC θJA 120 °C/W 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin P = Plastic DIP (300 mil Body), 8-Lead, 14-Lead SN = Plastic SOIC (150 mil Body), 8-Lead 51

CAD (KiCad official)

  • Symbol: MCP6024-E
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mcp6024-e-etched.step / mcp6024-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp6024-e.step / mcp6024-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (54 pp, sha256 3bc34ce81d9fe7bb, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF