component
MCP6023-I
Public Made by Adomby adom
Microchip Tech Operational Amplifier, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownMCP6023-I
Microchip Tech · Operational Amplifier · SOIC-8
MCP6023-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection on this pin for the MCP6023 in the 8-lead PDIP, SOIC and TSSOP packages. |
| 2 | VIN- | power_in | Inverting input of the op amp, a high-impedance CMOS input with low bias current. |
| 3 | VIN+ | power_in | Non-inverting input of the op amp, a high-impedance CMOS input with low bias current. |
| 4 | VSS | power_in | Negative power supply pin; VDD must be 2.5V to 5.5V higher than VSS, and in single-supply use VSS is connected to ground. |
| 5 | VREF | power_in | Mid-supply reference voltage from an unbuffered internal resistor voltage divider, provided on the MCP6023. |
| 6 | VOUT | output | Analog output of the op amp, a low-impedance voltage source. |
| 7 | VDD | power_in | Positive power supply pin, 2.5V to 5.5V higher than VSS, which needs a bypass capacitor. |
| 8 | CS | input | Chip Select, a CMOS Schmitt-triggered input that places the part into Low-Power mode when asserted. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage (Industrial Temperature Parts) | VOS | -500 | 500 | µV | VCM = 0V | 3 | |
| Power Supply Rejection Ratio | PSRR | 74 | 90 | dB | VCM = 0V | 3 | |
| Input Bias Current (Industrial Temperature Parts) | IB | 30 | 150 | pA | TA = +85°C | 3 | |
| Common-Mode Rejection Ratio | CMRR | 74 | 90 | dB | VDD = 5V, VCM = -0.3V to 5.3V | 3 | |
| Common-Mode Rejection Ratio | CMRR | 70 | 85 | dB | VDD = 5V, VCM = 3.0V to 5.3V | 3 | |
| Common-Mode Input Range | VCMR | -0.3 | 0.3 | V | 3 | ||
| VREF Accuracy (VREF - VDD/2) | VREF_ACC | -50 | 50 | mV | 3 | ||
| DC Open-Loop Gain (Large Signal) | AOL | 90 | 110 | dB | VCM = 0V, VOUT = VSS + 0.3V to VDD - 0.3V | 3 | |
| Maximum Output Voltage Swing | VOL, VOH | 15 | -20 | mV | 0.5V input overdrive | 3 | |
| Supply Voltage | VDD | 2.5 | 5.5 | V | 3 | ||
| Quiescent Current per Amplifier | IQ | 0.5 | 1 | 1.35 | mA | IO = 0 | 3 |
| CS Logic Threshold, Low | VIL | 0.2 | V | value is a multiple of VDD | 4 | ||
| CS Logic Threshold, High | VIH | 0.8 | V | value is a multiple of VDD | 4 | ||
| CS Input Current, Low | ICSL | -1 | 0.01 | µA | CS = VSS | 4 | |
| CS Input Current, High | ICSH | 0.01 | 2 | µA | CS = VDD | 4 | |
| GND Current | ISS | -2 | -0.05 | µA | CS = VDD | 4 | |
| CS Low to Amplifier Output Turn-on Time | tON | 2 | 10 | µs | G = +1, VIN = VSS, CS = 0.2 VDD to VOUT = 0.45 VDD | 4 | |
| Industrial Temperature Range | TA | -40 | 85 | °C | 5 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | (Note 1) | 5 | |
| Storage Temperature | TA | -65 | 150 | °C | 3 | ||
| Maximum Junction Temperature | TJ | 150 | °C | 3 | |||
| VDD - VSS | VDD-VSS | 7 | V | 3 | |||
| Current Analog Input Pins (VIN+, VIN-) | -2 | 2 | mA | 3 | |||
| Analog Inputs (VIN+, VIN-) | -1 | 1 | V | 3 | |||
| All Other Inputs and Outputs | -0.3 | 0.3 | V | 3 | |||
| Current at Output and Supply Pins | -30 | 30 | mA | 3 | |||
| Output Short Circuit Current | ISC | 30 | mA | VDD = 2.5V | 3 | ||
| Output Short Circuit Current | ISC | 22 | mA | VDD = 5.5V | 3 | ||
| Thermal Resistance, 8L-SOIC | θJA | 163 | °C/W | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | P = Plastic DIP (300 mil Body), 8-Lead, 14-Lead SN = Plastic SOIC (150 mil Body), 8-Lead | 51 |
CAD (KiCad official)
- Symbol:
MCP6023-I - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
mcp6023-i-etched.step/mcp6023-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp6023-i.step/mcp6023-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (54 pp, sha256
899b5ff27b9b1a7b, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).