main
Download ZIP Propose a change
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 9d ago
viewers mcp6022-e: viewers · Ray 9d ago
mcp6022-e-etched.glb Publish 0.1.0 · Ray 9d ago
mcp6022-e-etched.step mcp6022-e: factory component page (tier=lcsc) · Ray 9d ago
mcp6022-e-hero.glb mcp6022-e: hero GLB from the etched model (keeps the MPN mark) · Ray 9d ago
mcp6022-e-hero.overlay.json Publish 0.1.0 · Ray 9d ago
mcp6022-e.glb Publish 0.1.0 · Ray 9d ago
mcp6022-e.kicad_mod Publish 0.1.0 · Ray 9d ago
mcp6022-e.kicad_sym Publish 0.1.0 · Ray 9d ago
mcp6022-e.lbr Publish 0.1.0 · Ray 9d ago
mcp6022-e.step Publish 0.1.0 · Ray 9d ago
package.json Publish 0.1.0 · Ray 9d ago
page.json Set visibility: public · Ray 9d ago
README.md Publish 0.1.0 · Ray 9d ago

MCP6022-E

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-8

MCP6022-E from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Analog output of op amp A, which acts as a low-impedance voltage source.
2 VINA- input Inverting input of op amp A, a high-impedance CMOS input with low bias currents.
3 VINA+ input Non-inverting input of op amp A, a high-impedance CMOS input with low bias currents.
4 VSS power_in Negative power supply pin; in typical single-supply use it is connected to ground, and all other pins stay between VSS and VDD.
5 VINB+ input Non-inverting input of op amp B, a high-impedance CMOS input with low bias currents.
6 VINB- input Inverting input of op amp B, a high-impedance CMOS input with low bias currents.
7 VOUTB output Analog output of op amp B, which acts as a low-impedance voltage source.
8 VDD power_in Positive power supply pin, which must be 2.5 V to 5.5 V above VSS and needs a bypass capacitor.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-8
Category Single Chip Microcomputer/Microcontroller
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage (Extended Temperature Parts) VOS -250 250 µV VCM = 0V, VDD = 5.0V 3
Input Offset Voltage over temperature (Extended Temperature Parts) VOS -2.5 2.5 mV VCM = 0V, VDD = 5.0V, TA = -40°C to +125°C 3
Power Supply Rejection Ratio PSRR 74 90 dB VCM = 0V 3
Input Bias Current (Extended Temperature Parts) IB 640 5000 pA TA = +125°C 3
Common-Mode Rejection Ratio CMRR 74 90 dB VDD = 5V, VCM = -0.3V to 5.3V 3
Common-Mode Rejection Ratio CMRR 70 85 dB VDD = 5V, VCM = 3.0V to 5.3V 3
DC Open-Loop Gain (Large Signal) AOL 90 110 dB VCM = 0V, VOUT = VSS + 0.3V to VDD, 0.3V 3
Output Short Circuit Current (VDD = 2.5V) ISC -30 30 mA VDD = 2.5V 3
Output Short Circuit Current (VDD = 5.5V) ISC -22 22 mA VDD = 5.5V 3
Supply Voltage VDD 2.5 5.5 V 3
Quiescent Current per Amplifier IQ 0.5 1 1.35 mA IO = 0 3
Extended Temperature Range TA -40 125 °C 5
Operating Temperature Range TA -40 125 °C Note 1 5
Storage Temperature Range TA -65 150 °C 5
Supply Voltage (VDD, VSS) absolute maximum VDD, VSS 7 V 3
Current at Analog Input Pins (VIN+, VIN-) VIN+, VIN- -2 2 mA 3
Current at Output and Supply Pins -30 30 mA 3
Maximum Junction Temperature TJ 150 °C 3
ESD Protection on All Pins (HBM) 2 kV HBM 3
ESD Protection on All Pins (MM) 200 V MM 3
Thermal Resistance, 8L-TSSOP θJA 124 °C/W 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin P = Plastic DIP (300 mil Body), 8-Lead, 14-Lead SN = Plastic SOIC (150 mil Body), 8-Lead 51

CAD (KiCad official)

  • Symbol: MCP6022-E
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: mcp6022-e-etched.step / mcp6022-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp6022-e.step / mcp6022-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (54 pp, sha256 899b5ff27b9b1a7b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF