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MCP6021-I

Microchip Tech · Operational Amplifier · SOIC-8

MCP6021-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection.
2 VIN- power_in Inverting input of the op amp, a high-impedance CMOS input with low bias current.
3 VIN+ power_in Non-inverting input of the op amp, a high-impedance CMOS input with low bias current.
4 VSS power_in Negative power supply pin, connected to ground in single-supply use; VDD must be 2.5V to 5.5V above it.
5 VREF power_in Mid-supply reference voltage from an unbuffered, internal resistor voltage divider.
6 VOUT output Analog op amp output, a low-impedance voltage source.
7 VDD power_in Positive power supply pin, 2.5V to 5.5V above VSS, and needs a bypass capacitor.
8 NC unconnected No internal connection.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Amplifiers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage (Industrial) VOS -500 500 µV VCM = 0V 3
Power Supply Rejection Ratio PSRR 74 90 dB VCM = 0V 3
Input Bias Current (Industrial) IB 30 150 pA TA = +85°C 3
Common-Mode Rejection Ratio CMRR 74 90 dB VDD = 5V, VCM = -0.3V to 5.3V 3
Common-Mode Rejection Ratio CMRR 70 85 dB VDD = 5V, VCM = 3.0V to 5.3V 3
VREF Accuracy (VREF, VDD/2) VREF_ACC -50 50 mV 3
DC Open-Loop Gain (Large Signal) AOL 90 110 dB VCM = 0V, VOUT = VSS + 0.3V to VDD, 0.3V 3
Supply Voltage VDD 2.5 5.5 V 3
Quiescent Current per Amplifier IQ 0.5 1 1.35 mA IO = 0 3
Industrial Temperature Range TA -40 85 °C 5
Storage Temperature Range TA -65 150 °C 5
Supply Voltage VDD, VSS VDD-VSS 7 V 3
Current Analog Input Pins (VIN+, VIN-) -2 2 mA 3
Current at Output and Supply Pins -30 30 mA 3
Maximum Junction Temperature TJ 150 °C 3
ESD Protection on All Pins (HBM) 2 kV HBM 3
ESD Protection on All Pins (MM) 200 V MM 3
Thermal Resistance, 8L-SOIC θJA 163 °C/W 5
Input Offset Voltage Temperature Drift ΔVOS/ΔTA 3.5 µV/°C TA = -40°C to +125°C; printed as ±3.5 3
VREF Temperature Drift ΔVREF/ΔTA 100 µV/°C TA = -40°C to +125°C; printed as ±100 3
Input Bias Current IB 1 pA 3
Input Offset Current IOS 1 pA printed as ±1 3
Output Short Circuit Current ISC 30 mA VDD = 2.5V; printed as ±30 3
Output Short Circuit Current ISC 22 mA VDD = 5.5V; printed as ±22 3
Gain Bandwidth Product GBWP 10 MHz 4
Phase Margin PM 65 ° G = +1 V/V 4
Slew Rate SR 7 V/µs 4
Settling Time, 0.2% tSETTLE 250 ns G = +1 V/V, VOUT = 100 mVp-p 4
Input Noise Voltage Density eni 8.7 nV/√Hz f = 10 kHz 4
Input Noise Voltage Eni 2.9 µVp-p f = 0.1 Hz to 10 Hz 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin P = Plastic DIP (300 mil Body), 8-Lead, 14-Lead SN = Plastic SOIC (150 mil Body), 8-Lead 51

CAD (KiCad official)

  • Symbol: MCP6021-I
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mcp6021-i-etched.step / mcp6021-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp6021-i.step / mcp6021-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (54 pp, sha256 899b5ff27b9b1a7b, retrieved 2026-10-24, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF