component
MCP6009-E
Public Made by Adomby adom
Microchip Tech Operational Amplifier, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownMCP6009-E
Microchip Tech · Operational Amplifier · SOIC-14
MCP6009-E from Microchip Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTA | output | Analog output of op amp A, a low-impedance voltage source. |
| 2 | VINA- | input | Inverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 3 | VINA+ | input | Noninverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 4 | VDD | power_in | Positive power supply; VDD is 1.8V to 5.5V higher than VSS and needs bypass capacitors. |
| 5 | VINB+ | input | Noninverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 6 | VINB- | input | Inverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 7 | VOUTB | output | Analog output of op amp B, a low-impedance voltage source. |
| 8 | VOUTC | output | Analog output of op amp C, a low-impedance voltage source. |
| 9 | VINC- | input | Inverting input of op amp C, a high-impedance CMOS input with low bias current. |
| 10 | VINC+ | input | Noninverting input of op amp C, a high-impedance CMOS input with low bias current. |
| 11 | VSS | power_in | Negative power supply; in single-supply use VSS is connected to ground. |
| 12 | VIND+ | input | Noninverting input of op amp D, a high-impedance CMOS input with low bias current. |
| 13 | VIND- | input | Inverting input of op amp D, a high-impedance CMOS input with low bias current. |
| 14 | VOUTD | output | Analog output of op amp D, a low-impedance voltage source. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-14 |
| Category | Amplifiers/Comparators |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | -1.6 | 1.6 | mV | 2 | ||
| Power Supply Rejection Ratio | PSRR | 80 | 95 | dB | 2 | ||
| Common-Mode Rejection Ratio | CMRR | 60 | 76 | dB | VDD = 5.5V, VCM = -0.3V to 5.8V | 3 | |
| DC Open-Loop Gain (Large Signal) | AOL | 105 | 126 | dB | 0.2 < VOUT < (VDD, 0.2V) | 3 | |
| Supply Voltage | VDD | 1.8 | 5.5 | V | 3 | ||
| Quiescent Current per Amplifier | IQ | 50 | 70 | µA | IO = 0 | 3 | |
| Voltage between VDD and VSS (absolute maximum) | VDD, VSS | 6 | V | 2 | |||
| Current at Analog Input Pins (VIN+, VIN-) | -5 | 5 | mA | 2 | |||
| ESD Protection on All Pins (HBM) | 3 | kV | 2 | ||||
| ESD Protection on All Pins (CDM) | 2 | kV | 2 | ||||
| ESD Protection on All Pins (MM) | 300 | V | 2 | ||||
| Maximum Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Operating Temperature Range | TA | -40 | 125 | °C | Note 1: internal junction temperature (TJ) must not exceed +150°C | 4 | |
| Storage Temperature Range | TA | -65 | 150 | °C | 4 | ||
| Thermal Resistance, 14-Lead SOIC | θJA | 120 | °C/W | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] A A2 | 29 |
CAD (KiCad official)
- Symbol:
MCP6009-E - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
mcp6009-e-etched.step/mcp6009-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp6009-e.step/mcp6009-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (46 pp, sha256
7c968389591ae617, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).