component
MCP6007T-E
Public Made by Adomby adom
Microchip Tech Operational Amplifier, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 11d ago |
| viewers | 11d ago |
| mcp6007t-e-etched.glb | 11d ago |
| mcp6007t-e-etched.step | 11d ago |
| mcp6007t-e-hero.glb | 11d ago |
| mcp6007t-e-hero.overlay.json | 11d ago |
| mcp6007t-e.glb | 11d ago |
| mcp6007t-e.kicad_mod | 11d ago |
| mcp6007t-e.kicad_sym | 11d ago |
| mcp6007t-e.lbr | 11d ago |
| mcp6007t-e.step | 11d ago |
| package.json | 11d ago |
| page.json | 11d ago |
| README.md | 11d ago |
MCP6007T-E
Microchip Tech · Operational Amplifier · MSOP-8
MCP6007T-E from Microchip Tech, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTA | output | Analog output of op amp A, a low-impedance voltage source. |
| 2 | VINA- | input | Inverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 3 | VINA+ | input | Noninverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 4 | VSS | power_in | Negative power supply, connected to ground in single-supply use; VDD is 1.8V to 5.5V above VSS. |
| 5 | VINB+ | input | Noninverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 6 | VINB- | input | Inverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 7 | VOUTB | output | Analog output of op amp B, a low-impedance voltage source. |
| 8 | VDD | power_in | Positive power supply, 1.8V to 5.5V above VSS, and it needs bypass capacitors. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | MSOP-8 |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 1.8 | 5.5 | V | 3 | ||
| Quiescent Current per Amplifier | IQ | 140 | 170 | µA | IO = 0 | 3 | |
| Input Offset Voltage | VOS | -1.6 | 1.6 | mV | 2 | ||
| Power Supply Rejection Ratio | PSRR | 80 | 95 | dB | 2 | ||
| Common-Mode Rejection Ratio (VDD=5.5V, VCM up to 5.8V) | CMRR | 60 | 76 | dB | VDD = 5.5V, VCM = -0.3V to 5.8V | 3 | |
| Common-Mode Rejection Ratio (VDD=1.8V) | CMRR | 60 | 76 | dB | VDD = 1.8V, VCM = -0.3V to 2.1V | 3 | |
| DC Open-Loop Gain (Large Signal) | AOL | 105 | 126 | dB | 0.2 < VOUT < (VDD, 0.2V) | 3 | |
| Operating Temperature Range | TA | -40 | 125 | °C | Note 1 | 4 | |
| Supply Voltage (VDD, VSS) | VDD, VSS | 6 | V | 2 | |||
| Current at Analog Input Pins | VIN+, VIN- | -5 | 5 | mA | 2 | ||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Maximum Junction Temperature | TJ | 150 | °C | 2 | |||
| ESD Protection HBM | 3 | kV | All pins, HBM | 2 | |||
| ESD Protection CDM | 2 | kV | All pins, CDM | 2 | |||
| ESD Protection MM | 300 | V | All pins, MM | 2 | |||
| Thermal Resistance, 8-Lead MSOP | θJA | 206 | °C/W | 4 | |||
| Input Offset Drift with Temperature | ΔVOS/ΔTA | 0.6 | µV/°C | TA = -40°C to +125°C | 2 | ||
| Gain Bandwidth Product | GBWP | 3 | MHz | 3 | |||
| Phase Margin | PM | 65 | ° | G = +1 V/V | 3 | ||
| Slew Rate | SR | 3.2 | V/µs | VDD = 5.5V | 3 | ||
| Start-up Time | tstart | 6 | µs | VDD = 0V to 5.5V | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | 8-Lead SOIC (MCP6477) SN 2031 | 21 |
CAD (KiCad official)
- Symbol:
MCP6007T-E - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
mcp6007t-e-etched.step/mcp6007t-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp6007t-e.step/mcp6007t-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (46 pp, sha256
893faa50a7796ddd, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).