component
MCP6002-E
Public Made by Adomby adom
Microchip Tech Microcontroller Units (MCUs/MPUs/SOCs), MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Contents
README
markdownMCP6002-E
Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · MSOP-8
MCP6002-E from Microchip Tech, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTA | output | Analog output of Op Amp A, a low-impedance voltage source. |
| 2 | VINA- | input | Inverting input of Op Amp A, a high-impedance CMOS input with low bias current. |
| 3 | VINA+ | input | Noninverting input of Op Amp A, a high-impedance CMOS input with low bias current. |
| 4 | VSS | power_in | Negative power supply, normally connected to ground in single-supply use. |
| 5 | VINB+ | input | Noninverting input of Op Amp B, a high-impedance CMOS input with low bias current. |
| 6 | VINB- | input | Inverting input of Op Amp B, a high-impedance CMOS input with low bias current. |
| 7 | VOUTB | output | Analog output of Op Amp B, a low-impedance voltage source. |
| 8 | VDD | power_in | Positive power supply, 1.8V to 6.0V higher than VSS, and needs bypass capacitors. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | MSOP-8 |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | -4.5 | 4.5 | mV | VCM = VSS | 3 | |
| Common-Mode Input Range | VCMR | -0.3 | 0.3 | V | VSS, 0.3 to VDD + 0.3 (min is VSS, 0.3V, max is VDD + 0.3V) | 3 | |
| Common-Mode Rejection Ratio | CMRR | 60 | 76 | dB | VCM = -0.3V to 5.3V, VDD = 5V | 3 | |
| DC Open-Loop Gain (Large Signal) | AOL | 88 | 112 | dB | VOUT = 0.3V to VDD, 0.3V, VCM = VSS | 3 | |
| Maximum Output Voltage Swing | VOL, VOH | 25 | 25 | mV | VDD = 5.5V, 0.5V input overdrive; VSS + 25 (max) / VDD, 25 (min) | 3 | |
| Supply Voltage | VDD | 1.8 | 6 | V | Note 2 | 3 | |
| Quiescent Current per Amplifier | IQ | 50 | 100 | 170 | µA | IO = 0, VDD = 5.5V, VCM = 5V | 3 |
| Operating Temperature Range | TA | -40 | 125 | °C | Extended; Note 1 | 4 | |
| Storage Temperature Range | TA | -65 | 150 | °C | 4 | ||
| Supply Voltage VDD, VSS | VDD, VSS | 7 | V | 3 | |||
| Current at Analog Input Pins | -2 | 2 | mA | VIN+, VIN- | 3 | ||
| Current at Output and Supply Pins | -30 | 30 | mA | 3 | |||
| Maximum Junction Temperature | TJ | 150 | °C | 3 | |||
| Storage Temperature | -65 | 150 | °C | 3 | |||
| Thermal Resistance, 8-Lead MSOP | θJA | 206 | °C/W | 4 | |||
| Input Offset Drift with Temperature | ΔVOS/ΔTA | 2 | µV/°C | TA= -40°C to +125°C, VCM = VSS | 3 | ||
| Power Supply Rejection Ratio | PSRR | 86 | dB | VCM = VSS | 3 | ||
| Output Short-Circuit Current | ISC | 6 | mA | VDD = 1.8V | 3 | ||
| Output Short-Circuit Current | ISC | 23 | mA | VDD = 5.5V | 3 | ||
| Gain Bandwidth Product | GBWP | 1 | MHz | 4 | |||
| Phase Margin | PM | 90 | ° | G = +1 V/V | 4 | ||
| Slew Rate | SR | 0.6 | V/µs | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] A A2 | 31 |
CAD (KiCad official)
- Symbol:
MCP6002-E - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
mcp6002-e-etched.step/mcp6002-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp6002-e.step/mcp6002-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (50 pp, sha256
4f879ab31115ecfa, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).