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Contents

README

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MCP47CVB12-E

Microchip Tech · Digital To Analog Converters (DACs) · DFN-10-EP(3x3)

MCP47CVB12-E from Microchip Tech, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply voltage pin, 2.7V to 5.5V for full specifications (1.8V to 2.7V reduced), with about 0.1 µF ceramic bypass recommended close to the pin.
2 A0 input I2C slave address bit 0 pin (Schmitt Trigger input) that sets the lowest bit of the 7-bit slave address.
3 VREF power_in Analog voltage reference input (buffered or unbuffered) or output when the internal band gap is selected; disconnected when VDD is the reference.
4 VOUT0 output Buffered analog voltage output of DAC0, with about 1 Ω DC impedance in normal mode and 1 kΩ, 100 kΩ or open in power-down.
5 VOUT1 output Buffered analog voltage output of DAC1, with about 1 Ω DC impedance in normal mode and 1 kΩ, 100 kΩ or open in power-down.
6 LAT/HVC input Latch pin that transfers volatile wiper and configuration values to both DAC outputs when taken to VIL, and high-voltage command pin for MTP programming (7.5V, at least 6.4 mA, above 5.5V only during programming).
7 VSS power_in Ground reference pin for all circuitry on the device, to be connected to a low-impedance ground plane.
8 A1 input I2C slave address bit 1 pin (Schmitt Trigger input) that sets the second-lowest bit of the 7-bit slave address.
9 SCL input I2C serial clock input (Schmitt Trigger) supporting Standard 100 kHz, Fast 400 kHz and High-Speed up to 3.4 MHz modes.
10 SDA bidirectional I2C serial data input/output (Schmitt Trigger) with slope-controlled output driver.
11 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package DFN-10-EP(3x3)
Category ADC/DAC/Data Conversion
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDD 2.7 5.5 V Full specifications 6
Supply Voltage (reduced) VDD 1.8 2.7 V DAC operation (reduced analog specifications) and serial interface 6
Operating Temperature TA -40 125 °C Extended 6
Voltage on VDD VDD -0.6 6.5 V with respect to VSS 5
Input clamp current IIK -20 20 mA VI < 0, VI > VDD, VI > VPP on HV pins 5
Output clamp current IOK -20 20 mA VO < 0 or VO > VDD 5
Max current out of VSS pin 100 mA Dual 5
Max current into VDD pin 100 mA Dual 5
Max current sourced by VOUT pin 20 mA 5
Max current sunk by VOUT pin 20 mA 5
Total power dissipation 400 mW 5
Storage temperature -65 150 °C 5
Ambient temperature with power applied -55 125 °C 5
Maximum Junction Temperature TJ 150 °C 5
Soldering temperature of leads 300 °C 10 seconds 5
ESD HBM 6 kV all pins 5
Power-on Reset VDD (rising) VPOR 1.75 V VDD voltages greater than the VPOR limit ensure that the device is out of Reset 6
Brown-out Reset VDD (falling) VBOR 1.61 V RAM retention voltage: (VRAM)<VBOR 6
Power-on Reset to Output-Driven Delay TPOR2OD 145 µs VDD rising, VDD >VPOR, dual output 6
Supply Current, dual, 100 kHz IDD 330 µA Dual 100 kHz, serial interface active, VRxB:VRxA = 10, VOUT unloaded, VREF = VDD = 5.5V, mid-scale 7
Supply Current, dual, 400 kHz IDD 410 µA Dual 400 kHz, serial interface active, VRxB:VRxA = 10, VOUT unloaded, VREF = VDD = 5.5V, mid-scale 7
Supply Current, dual, 1.7 MHz IDD 560 µA Dual 1.7 MHz, serial interface active, VRxB:VRxA = 10, VOUT unloaded, VREF = VDD = 5.5V, mid-scale 7
Supply Current, dual, 3.4 MHz IDD 720 µA Dual 3.4 MHz, serial interface active, VRxB:VRxA = 10, VOUT unloaded, VREF = VDD = 5.5V, mid-scale 7
Supply Current, dual, interface inactive IDD 280 µA Dual, serial interface inactive, VRxB:VRxA = 10, VOUT unloaded, VREF = VDD = 5.5V, mid-scale 7
Power-Down Current IDDP 0.65 3.8 µA PDxB:PDxA = 01, VRxB:VRxA = 10, VOUT not connected 7
Resistor Ladder Resistance RL 63.9 71 78.1 kΩ VRxB:VRxA = 10, VREF = VDD 8
Nominal VOUT Match 0.016 0.3 % 1.8V ≤ VDD ≤ 5.5V 8
VOUT Tempco ΔVOUT/ΔT 3 ppm/°C Code = Mid-Scale, VRxB:VRxA = 00, 10 and 11 8
Zero-Scale Error, 10-bit EZS 1.5 LSb 10-bit VRxB:VRxA = 10, G = 0, VREF = VDD, no load 9
Offset Error EOS -6 0.4 6 mV VRxB:VRxA = 10, Gx = 0, no load, 10-bit: Code = 16 9
Offset Voltage Temperature Coefficient VOSTC 5 µV/°C 9
Full-Scale Error, 10-bit EFS 9 LSb 10-bit VRxB:VRxA = 10, G = 0, VREF = VDD, no load 9
Gain Error, 10-bit EG -1 0.1 1 % of FSR 10-bit VRxB:VRxA = 10, G = 0, Code = 1008, VREF = VDD, no load 9
Gain Error Drift ΔG/°C -6 ppm/°C 9
Total Unadjusted Error, 10-bit ET -9 3 LSb 10-bit VRxB:VRxA = 10, G = 0, VREF = VDD, no load 10
Integral Nonlinearity, 10-bit INL -0.25 0.25 LSb 10-bit VRxB:VRxA = 10, G = 0, VREF = VDD, no load 10
Differential Nonlinearity, 10-bit DNL -0.25 0.25 LSb 10-bit VRxB:VRxA = 10, G = 0, VREF = VDD, no load 10
-3 dB Bandwidth BW 60 kHz VREF = 3.00V ± 2V, VRxB:VRxA = 10, Gx = 0 11
Phase Margin PM 58 °C RL = ∞ 11
Slew Rate SR 0.15 V/µs RL = 2k 11
Short-Circuit Current (op amp), to VSS ISC_OA 6 10 14 mA Short to VSS, DAC code = Full Scale 11
Short-Circuit Current (op amp), to VDD ISC_OA 6 10 14 mA Short to VDD, DAC code = Zero Scale 11
Settling Time tSETTLING 16 µs RL = 2 k 11
Band Gap Voltage VBG 1.18 1.214 1.26 V 1.8V ≤ VDD ≤ 5.5V 11
Band Gap Short-Circuit Current, to VSS ISC_BG 6 10 14 mA Short to VSS 11
Band Gap Short-Circuit Current, to VDD ISC_BG 6 10 14 mA Short to VDD 11
Band Gap Voltage Temperature Coefficient VBGTC 16 ppm/°C 1.8V ≤ VDD ≤ 5.5V 11
Current through VREF IVREF 172.15 µA Mathematically from RVREF(min) spec (at 5.5V) 12
Input Capacitance (VREF) CREF 29 pF VRxB:VRxA = 10 (Unbuffered mode) 12
Total Harmonic Distortion THD -76 dB VREF = 2.048V ± 0.1V, VRxB:VRxA = 10, Gx = 0, Frequency = 1 kHz 12
Schmitt Trigger High Input Threshold (LAT/HVC, A0, A1) VIH 0.45 V 1.8V ≤ VDD ≤ 5.5V; min is 0.45 VDD 13
Schmitt Trigger Low Input Threshold (LAT/HVC, A0, A1) VIL 0.2 V max is 0.2 VDD 13
Input Leakage Current (LAT/HVC, A0, A1) IIL -1 1 µA VIN = VDD and VIN = VSS 13
SDA Output Low Voltage VOL 0.4 V VDD ≥ 2.0V, IOL = 3 mA 13
SDA/SCL Input High Voltage VIH 0.7 V 1.8V ≤ VDD ≤ 5.5V; min is 0.7 VDD 13
SDA/SCL Input Low Voltage VIL 0.3 V 1.8V ≤ VDD ≤ 5.5V; max is 0.3 VDD 13
SDA/SCL Input Leakage IL -1 1 µA SCL = SDA = VSS or SCL = SDA = VDD 13
Power Supply Sensitivity PSS 0.001 0.0035 %/% Code = Mid-Scale 13
LAT Pin Pulse Width tLAT 20 ns 16
Power-on Reset Delay, dual tPOR2SIA 145 µs Dual 17
SCL Pin Frequency, Standard mode FSCL 0 100 kHz Cb = 400 pF, 1.8V-5.5V 19
SCL Pin Frequency, Fast mode FSCL 0 400 kHz Cb = 400 pF, 2.7V-5.5V 19

CAD (KiCad official)

  • Symbol: MCP47CVB12-E
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: mcp47cvb12-e-etched.step / mcp47cvb12-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp47cvb12-e.step / mcp47cvb12-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (124 pp, sha256 00ea6d555e34c774, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF