MCP3427T-E from Microchip Tech, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CH1+	input	Positive differential analog input pin of channel 1, with a range of VSS-0.3V to VDD+0.3V.
2	CH1-	input	Negative differential analog input pin of channel 1, which can be tied to VSS for single-ended operation, with a range of VSS-0.3V to VDD+0.3V.
3	VSS	power_in	Ground pin and current return path of the device, to be connected to a low-impedance ground plane.
4	CH2+	input	Positive differential analog input pin of channel 2, with a range of VSS-0.3V to VDD+0.3V.
5	CH2-	input	Negative differential analog input pin of channel 2, with a range of VSS-0.3V to VDD+0.3V.
6	VDD	power_in	Positive supply voltage pin, 2.7V to 5.5V, bypassed with about 0.1 µF ceramic to ground (plus 10 µF tantalum recommended).
7	SDA	bidirectional	Bidirectional serial data pin of the I2C interface, open-drain N-channel driver needing a pull-up resistor to VDD.
8	SCL	input	Serial clock pin of the I2C interface (slave only), open-drain N-channel needing a pull-up resistor to VDD.
9	Adr0	input	I2C address selection pin (see Section 5.3.2).
10	Adr1	input	I2C address selection pin (see Section 5.3.2).

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	MSOP-10
Category	ADC/DAC/Data Conversion
Pins	10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Absolute max supply voltage	VDD			7	V		5
Current at input pins		-2		2	mA	±2 mA	5
Current at output and supply pins		-10		10	mA	±10 mA	5
Storage temperature		-65		150	°C		5
Ambient temp. with power applied		-55		125	°C		5
Maximum junction temperature	TJ			150	°C		5
Resolution and no missing codes		12			Bits	DR = 240 SPS	5
Resolution and no missing codes		14			Bits	DR = 60 SPS	5
Resolution and no missing codes		16			Bits	DR = 15 SPS	5
Data rate	DR	176	240	328	SPS	12 bits mode	5
Data rate	DR	44	60	82	SPS	14 bits mode	5
Data rate	DR	11	15	20.5	SPS	16 bits mode	5
Supply voltage range	VDD	2.7		5.5	V		6
Supply current during conversion	IDDA		145	180	µA	VDD = 5.0V	6
Supply current during conversion	IDDA		135		µA	VDD = 3.0V	6
Supply current during standby mode	IDDS		0.3	1	µA	VDD = 5.0V	6
High level input voltage	VIH	0.7		1	V	at SDA and SCL pins; min 0.7VDD, max VDD (values in multiples of VDD)	6
Low level input voltage	VIL			0.3	V	at SDA and SCL pins; max 0.3VDD (multiple of VDD)	6
Low level output voltage	VOL			0.4	V	IOL = 3 mA	6
Hysteresis of Schmidt trigger for inputs	VHYST	0.05			V	fSCL = 100 kHz; min 0.05VDD (multiple of VDD)	6
Supply current when I2C bus line is active	IDDB			10	µA	Device is in standby mode while I2C bus is active	6
Input leakage current high	IILH			1	µA	VIH = 5.5V	6
Input leakage current low	IILL	-1			µA	VIL = GND	6
Addr_Low voltage (Adr0, Adr1)	Addr_Low	0		0.2	V	VSS to 0.2VDD (max multiple of VDD); device reads logic low	6
Addr_High voltage (Adr0, Adr1)	Addr_High	0.75		1	V	0.75VDD to VDD (multiples of VDD); device reads logic high	6
Addr_Float voltage (Adr0, Adr1)	Addr_Float	0.35		0.6	V	0.35VDD to 0.6VDD (multiples of VDD); voltage applied to address pin (Note 9)	6
Pin capacitance	CPIN		4	10	pF		6
I2C bus capacitance	Cb			400	pF		6
Specified temperature range	TA	-40		85	°C		7
Operating temperature range	TA	-40		125	°C		7
Storage temperature range	TA	-65		150	°C		7
Thermal resistance, 10L-MSOP	θJA		202		°C/W		7
Differential full scale input voltage range	FSR		2.048		V	±2.048/PGA; VIN = [CHn+ - CHn-]	5
Differential input impedance	ZIND		2.25		MΩ	2.25/PGA; during normal mode operation	5
Common mode input impedance	ZINC		25		MΩ	PGA = 1, 2, 4, 8	5
Output noise			2.5		µVRMS	TA = +25°C, DR =15 SPS, PGA = 1, VIN+ = VIN- = GND	5
Integral non-linearity	INL		10		ppm of FSR	DR = 15 SPS	5
Internal reference voltage	VREF		2.048		V		5
Gain error			0.1		%	PGA = 1, DR = 15 SPS	5
PGA gain error match			0.1		%	Between any 2 PGA settings	5
Gain error drift			15		ppm/°C	PGA=1, DR=15 SPS	5
Offset error	VOS		30		µV	PGA = 1, DR = 15 SPS	6
Offset drift vs. temperature			50		nV/°C		6
Common-mode rejection			105		dB	at DC and PGA =1	6
Common-mode rejection			110		dB	at DC and PGA =8, TA = +25°C	6
Gain vs. VDD			5		ppm/V	TA = +25°C, VDD = 2.7V to 5.5V, PGA = 1	6
Power supply rejection at DC input			100		dB	TA = +25°C, VDD = 2.7V to 5.5V, PGA = 1	6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	MS = Plastic Micro Small Outline (MSOP), 8-lead SN = Plastic Small Outline SOIC, 8-lead	53

CAD (KiCad official)

Symbol: MCP3427T-E
Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
3D model: MSOP-10 (KiCad packages3D, STEP)
3D model files: mcp3427t-e-etched.step / mcp3427t-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp3427t-e.step / mcp3427t-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (56 pp, sha256 3d9cc322b8fd7415, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

MCP3427T-E

Verified MCP3427T-E

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README