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MCP3208-CI
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Microchip Tech Analog To Digital Converters (ADC), SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMCP3208-CI
Microchip Tech · Analog To Digital Converters (ADC) · SOIC-16
MCP3208-CI from Microchip Tech, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CH0 | input | Analog input for multiplexed channel 0; each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 2 | CH1 | input | Analog input for multiplexed channel 1; each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 3 | CH2 | input | Analog input for multiplexed channel 2; each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 4 | CH3 | input | Analog input for multiplexed channel 3; each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 5 | CH4 | input | Analog input for multiplexed channel 4 (MCP3208 only); each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 6 | CH5 | input | Analog input for multiplexed channel 5 (MCP3208 only); each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 7 | CH6 | input | Analog input for multiplexed channel 6 (MCP3208 only); each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 8 | CH7 | input | Analog input for multiplexed channel 7 (MCP3208 only); each channel pair can be programmed as two single-ended channels or as one pseudo-differential input. |
| 9 | DGND | power_in | Digital ground connection to the internal digital circuitry; if no ground plane is used it must be connected to VSS on the board, and with a ground plane it should be tied to the analog ground plane. |
| 10 | CS/SHDN | input | Pulling low initiates communication with the device, and pulling high ends a conversion and places the device in low-power standby; it must be pulled high between conversions. |
| 11 | DIN | input | SPI serial data input used to load channel configuration data into the device. |
| 12 | DOUT | output | SPI serial data output used to shift out the A/D conversion results; data always changes on the falling edge of each clock. |
| 13 | CLK | input | SPI serial clock that initiates a conversion and clocks out each bit of the conversion; clock speed constraints are given in Section 6.2. |
| 14 | AGND | power_in | Analog ground connection to the internal analog circuitry; connect to the analog ground plane when one is available. |
| 15 | VREF | power_in | Reference voltage input for the A/D converter. |
| 16 | VDD | power_in | Power supply input, +2.7V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-16 |
| Category | Data Acquisition |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Integral Nonlinearity (MCP3204/3208-C) | INL | -2 | 1 | 2 | LSB | MCP3204/3208-C | 2 |
| Differential Nonlinearity | DNL | -1 | 0.5 | 1 | LSB | No missing codes over-temperature | 2 |
| Offset Error | -3 | 1.25 | 3 | LSB | 2 | ||
| Gain Error | -5 | 1.25 | 5 | LSB | 2 | ||
| Throughput Rate | fSAMPLE | 100 | ksps | VDD = VREF = 5V | 2 | ||
| Throughput Rate | fSAMPLE | 50 | ksps | VDD = VREF = 2.7V | 2 | ||
| Conversion Time | tCONV | 12 | clock cycles | 2 | |||
| Reference Voltage Range | 0.25 | V | Note 2 | 2 | |||
| Reference Current Drain | 100 | 150 | µA | CS = VDD = 5V | 2 | ||
| Reference Current Drain | 0.001 | 3 | µA | 2 | |||
| Analog Input Leakage Current | -1 | 0.001 | 1 | µA | 3 | ||
| High Level Output Voltage | VOH | 4.1 | V | IOH = -1 mA, VDD = 4.5V | 3 | ||
| Low Level Output Voltage | VOL | 0.4 | V | IOL = 1 mA, VDD = 4.5V | 3 | ||
| Input Leakage Current | ILI | -10 | 10 | µA | VIN = VSS or VDD | 3 | |
| Output Leakage Current | ILO | -10 | 10 | µA | VOUT = VSS or VDD | 3 | |
| Pin Capacitance (All Inputs/Outputs) | CIN,COUT | 10 | pF | VDD = 5.0V (Note 1), TA = 25°C, f = 1 MHz | 3 | ||
| Clock Frequency | fCLK | 2 | MHz | VDD = 5V (Note 3) | 3 | ||
| Clock Frequency | fCLK | 1 | MHz | VDD = 2.7V (Note 3) | 3 | ||
| Clock High Time | tHI | 250 | ns | 3 | |||
| Clock Low Time | tLO | 250 | ns | 3 | |||
| CS Fall To First Rising CLK Edge | tSUCS | 100 | ns | 3 | |||
| Data Input Setup Time | tSU | 50 | ns | 3 | |||
| Data Input Hold Time | tHD | 50 | ns | 3 | |||
| CLK Fall To Output Data Valid | tDO | 200 | ns | See Figures 1-2 and 1-3 | 3 | ||
| CLK Fall To Output Enable | tEN | 200 | ns | See Figures 1-2 and 1-3 | 3 | ||
| CS Rise To Output Disable | tDIS | 100 | ns | See Figures 1-2 and 1-3 | 3 | ||
| CS Disable Time | tCSH | 500 | ns | 3 | |||
| DOUT Rise Time | tR | 100 | ns | See Figures 1-2 and 1-3 (Note 1) | 3 | ||
| DOUT Fall Time | tF | 100 | ns | See Figures 1-2 and 1-3 (Note 1) | 3 | ||
| Operating Voltage | VDD | 2.7 | 5.5 | V | 3 | ||
| Operating Current | IDD | 320 | 400 | µA | VDD=VREF = 5V, DOUT unloaded | 3 | |
| Standby Current | IDDS | 0.5 | 2 | µA | CS = VDD = 5.0V | 3 | |
| Specified Temperature Range | TA | -40 | 125 | °C | 4 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | 4 | ||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Ambient Temperature with Power Applied | -65 | 125 | °C | Power applied | 2 | ||
| Supply Voltage | VDD | 7 | V | 2 | |||
| All Inputs and Outputs w.r.t. VSS | -0.6 | V | 2 | ||||
| Soldering Temperature of Leads | 300 | °C | 10 seconds | 2 | |||
| ESD Protection on All Pins | 4 | kV | ESD protection on all pins | 2 | |||
| Thermal Resistance, 16L-SOIC | θJA | 86.1 | °C/W | 4 |
CAD (KiCad official)
- Symbol:
MCP3208-CI - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
mcp3208-ci-etched.step/mcp3208-ci-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp3208-ci.step/mcp3208-ci.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (40 pp, sha256
89bc1e17c35e2bb1, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).