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MCP3008T-I
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Microchip Tech Analog To Digital Converters (ADC), SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MCP3008T-I
Microchip Tech · Analog To Digital Converters (ADC) · SOIC-16
MCP3008T-I from Microchip Tech, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CH0 | input | Analog input channel 0, usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH1. |
| 2 | CH1 | input | Analog input channel 1, usable as a single-ended input or as the IN- of a pseudo-differential pair with CH0. |
| 3 | CH2 | input | Analog input channel 2, usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH3. |
| 4 | CH3 | input | Analog input channel 3, usable as a single-ended input or as the IN- of a pseudo-differential pair with CH2. |
| 5 | CH4 | input | Analog input channel 4 (MCP3008 only), usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH5. |
| 6 | CH5 | input | Analog input channel 5 (MCP3008 only), usable as a single-ended input or as the IN- of a pseudo-differential pair with CH4. |
| 7 | CH6 | input | Analog input channel 6 (MCP3008 only), usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH7. |
| 8 | CH7 | input | Analog input channel 7 (MCP3008 only), usable as a single-ended input or as the IN- of a pseudo-differential pair with CH6. |
| 9 | DGND | power_in | Digital ground connection to the internal digital circuitry. |
| 10 | CS/SHDN | input | Chip select/shutdown: pulling low starts communication, pulling high ends a conversion and enters low-power standby, and it must be high between conversions. |
| 11 | DIN | input | SPI serial data input used to load channel configuration data into the device. |
| 12 | DOUT | output | SPI serial data output that shifts out the A/D conversion result; data changes on the falling edge of each clock. |
| 13 | CLK | input | SPI serial clock that initiates a conversion and clocks out each bit of the result; clock speed constraints are given in Section 6.2. |
| 14 | AGND | power_in | Analog ground connection to the internal analog circuitry. |
| 15 | VREF | power_in | Reference voltage input for the A/D converter. |
| 16 | VDD | power_in | Positive power supply, +2.7V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-16 |
| Category | Data Acquisition |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| All inputs and outputs w.r.t. VSS | -0.6 | V | 3 | ||||
| Storage temperature | -65 | 150 | °C | 3 | |||
| Ambient temperature with power applied | -65 | 150 | °C | 3 | |||
| Soldering temperature of leads | 300 | °C | 10 seconds | 3 | |||
| ESD protection on all pins (HBM) | 4 | kV | 3 | ||||
| Operating voltage | VDD | 2.7 | 5.5 | V | 5 | ||
| Specified temperature range | TA | -40 | 85 | °C | 5 | ||
| Operating temperature range | TA | -40 | 85 | °C | 5 | ||
| Storage temperature range | TA | -65 | 150 | °C | 5 | ||
| Thermal resistance, 16L-SOIC | θJA | 90 | °C/W | 5 | |||
| Integral nonlinearity | INL | -1 | 0.5 | 1 | LSB | 3 | |
| Differential nonlinearity | DNL | -1 | 0.25 | 1 | LSB | No missing codes over temperature | 3 |
| Offset error | -1.5 | 1.5 | LSB | 3 | |||
| Gain error | -1 | 1 | LSB | 3 | |||
| Conversion time | tCONV | 10 | clock cycles | 3 | |||
| Throughput rate | fSAMPLE | 200 | ksps | VDD = VREF = 5V | 3 | ||
| Throughput rate | fSAMPLE | 75 | ksps | VDD = VREF = 2.7V | 3 | ||
| Reference voltage range | VREF | 0.25 | V | Note 2 | 3 | ||
| Reference current drain | 100 | 150 | µA | CS = VDD = 5V | 3 | ||
| Reference current drain (second printed value) | 0.001 | 3 | µA | CS = VDD = 5V | 3 | ||
| Pseudo-differential IN- input voltage range (relative to VSS) | VIN- | -100 | 100 | mV | 3 | ||
| Leakage current (analog input) | -1 | 0.001 | 1 | µA | 4 | ||
| High level output voltage | VOH | 4.1 | V | IOH = -1 mA, VDD = 4.5V | 4 | ||
| Low level output voltage | VOL | 0.4 | V | IOL = 1 mA, VDD = 4.5V | 4 | ||
| Input leakage current | ILI | -10 | 10 | µA | VIN = VSS or VDD | 4 | |
| Output leakage current | ILO | -10 | 10 | µA | VOUT = VSS or VDD | 4 | |
| Pin capacitance (all inputs/outputs) | CIN, COUT | 10 | pF | VDD = 5.0V (Note 1); TA = 25°C, f = 1 MHz | 4 | ||
| Clock frequency | fCLK | 3.6 | MHz | VDD = 5V (Note 3) | 4 | ||
| Clock frequency | fCLK | 1.35 | MHz | VDD = 2.7V (Note 3) | 4 | ||
| Clock high time | tHI | 125 | ns | 4 | |||
| Clock low time | tLO | 125 | ns | 4 | |||
| CS fall to first rising CLK edge | tSUCS | 100 | ns | 4 | |||
| CS fall to falling CLK edge | tCSD | 0 | ns | 4 | |||
| Data input setup time | tSU | 50 | ns | 4 | |||
| Data input hold time | tHD | 50 | ns | 4 | |||
| CLK fall to output data valid | tDO | 125 | ns | VDD = 5V, See Figure 1-2 | 4 | ||
| CLK fall to output data valid | tDO | 200 | ns | VDD = 2.7V, See Figure 1-2 | 4 | ||
| CLK fall to output enable | tEN | 125 | ns | VDD = 5V, See Figure 1-2 | 4 | ||
| CLK fall to output enable | tEN | 200 | ns | VDD = 2.7V, See Figure 1-2 | 4 | ||
| CS rise to output disable | tDIS | 100 | ns | See Test Circuits, Figure 1-2 | 4 | ||
| CS disable time | tCSH | 270 | ns | 4 | |||
| DOUT rise time | tR | 100 | ns | See Test Circuits, Figure 1-2 | 4 | ||
| DOUT fall time | tF | 100 | ns | See Test Circuits, Figure 1-2 | 4 | ||
| Operating current | IDD | 550 | µA | VDD = VREF = 5V, DOUT unloaded | 5 | ||
| Standby current | IDDS | 0.005 | 2 | µA | CS = VDD = 5.0V | 5 |
CAD (KiCad official)
- Symbol:
MCP3008T-I - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
mcp3008t-i-etched.step/mcp3008t-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp3008t-i.step/mcp3008t-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (40 pp, sha256
e6c2231de727395f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MCP3008T-I
**Microchip Tech** · Analog To Digital Converters (ADC) · SOIC-16
MCP3008T-I from Microchip Tech, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CH0 | input | Analog input channel 0, usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH1. |
| 2 | CH1 | input | Analog input channel 1, usable as a single-ended input or as the IN- of a pseudo-differential pair with CH0. |
| 3 | CH2 | input | Analog input channel 2, usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH3. |
| 4 | CH3 | input | Analog input channel 3, usable as a single-ended input or as the IN- of a pseudo-differential pair with CH2. |
| 5 | CH4 | input | Analog input channel 4 (MCP3008 only), usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH5. |
| 6 | CH5 | input | Analog input channel 5 (MCP3008 only), usable as a single-ended input or as the IN- of a pseudo-differential pair with CH4. |
| 7 | CH6 | input | Analog input channel 6 (MCP3008 only), usable as a single-ended input or as the IN+ of a pseudo-differential pair with CH7. |
| 8 | CH7 | input | Analog input channel 7 (MCP3008 only), usable as a single-ended input or as the IN- of a pseudo-differential pair with CH6. |
| 9 | DGND | power_in | Digital ground connection to the internal digital circuitry. |
| 10 | CS/SHDN | input | Chip select/shutdown: pulling low starts communication, pulling high ends a conversion and enters low-power standby, and it must be high between conversions. |
| 11 | DIN | input | SPI serial data input used to load channel configuration data into the device. |
| 12 | DOUT | output | SPI serial data output that shifts out the A/D conversion result; data changes on the falling edge of each clock. |
| 13 | CLK | input | SPI serial clock that initiates a conversion and clocks out each bit of the result; clock speed constraints are given in Section 6.2. |
| 14 | AGND | power_in | Analog ground connection to the internal analog circuitry. |
| 15 | VREF | power_in | Reference voltage input for the A/D converter. |
| 16 | VDD | power_in | Positive power supply, +2.7V to 5.5V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-16 |
| Category | Data Acquisition |
| Pins | 16 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| All inputs and outputs w.r.t. VSS | | -0.6 | | | V | | 3 |
| Storage temperature | | -65 | | 150 | °C | | 3 |
| Ambient temperature with power applied | | -65 | | 150 | °C | | 3 |
| Soldering temperature of leads | | | | 300 | °C | 10 seconds | 3 |
| ESD protection on all pins (HBM) | | 4 | | | kV | | 3 |
| Operating voltage | VDD | 2.7 | | 5.5 | V | | 5 |
| Specified temperature range | TA | -40 | | 85 | °C | | 5 |
| Operating temperature range | TA | -40 | | 85 | °C | | 5 |
| Storage temperature range | TA | -65 | | 150 | °C | | 5 |
| Thermal resistance, 16L-SOIC | θJA | | 90 | | °C/W | | 5 |
| Integral nonlinearity | INL | -1 | 0.5 | 1 | LSB | | 3 |
| Differential nonlinearity | DNL | -1 | 0.25 | 1 | LSB | No missing codes over temperature | 3 |
| Offset error | | -1.5 | | 1.5 | LSB | | 3 |
| Gain error | | -1 | | 1 | LSB | | 3 |
| Conversion time | tCONV | | | 10 | clock cycles | | 3 |
| Throughput rate | fSAMPLE | | | 200 | ksps | VDD = VREF = 5V | 3 |
| Throughput rate | fSAMPLE | | | 75 | ksps | VDD = VREF = 2.7V | 3 |
| Reference voltage range | VREF | 0.25 | | | V | Note 2 | 3 |
| Reference current drain | | | 100 | 150 | µA | CS = VDD = 5V | 3 |
| Reference current drain (second printed value) | | | 0.001 | 3 | µA | CS = VDD = 5V | 3 |
| Pseudo-differential IN- input voltage range (relative to VSS) | VIN- | -100 | | 100 | mV | | 3 |
| Leakage current (analog input) | | -1 | 0.001 | 1 | µA | | 4 |
| High level output voltage | VOH | 4.1 | | | V | IOH = -1 mA, VDD = 4.5V | 4 |
| Low level output voltage | VOL | | | 0.4 | V | IOL = 1 mA, VDD = 4.5V | 4 |
| Input leakage current | ILI | -10 | | 10 | µA | VIN = VSS or VDD | 4 |
| Output leakage current | ILO | -10 | | 10 | µA | VOUT = VSS or VDD | 4 |
| Pin capacitance (all inputs/outputs) | CIN, COUT | | | 10 | pF | VDD = 5.0V (Note 1); TA = 25°C, f = 1 MHz | 4 |
| Clock frequency | fCLK | | | 3.6 | MHz | VDD = 5V (Note 3) | 4 |
| Clock frequency | fCLK | | | 1.35 | MHz | VDD = 2.7V (Note 3) | 4 |
| Clock high time | tHI | 125 | | | ns | | 4 |
| Clock low time | tLO | 125 | | | ns | | 4 |
| CS fall to first rising CLK edge | tSUCS | 100 | | | ns | | 4 |
| CS fall to falling CLK edge | tCSD | | | 0 | ns | | 4 |
| Data input setup time | tSU | 50 | | | ns | | 4 |
| Data input hold time | tHD | 50 | | | ns | | 4 |
| CLK fall to output data valid | tDO | | | 125 | ns | VDD = 5V, See Figure 1-2 | 4 |
| CLK fall to output data valid | tDO | | | 200 | ns | VDD = 2.7V, See Figure 1-2 | 4 |
| CLK fall to output enable | tEN | | | 125 | ns | VDD = 5V, See Figure 1-2 | 4 |
| CLK fall to output enable | tEN | | | 200 | ns | VDD = 2.7V, See Figure 1-2 | 4 |
| CS rise to output disable | tDIS | | | 100 | ns | See Test Circuits, Figure 1-2 | 4 |
| CS disable time | tCSH | 270 | | | ns | | 4 |
| DOUT rise time | tR | | | 100 | ns | See Test Circuits, Figure 1-2 | 4 |
| DOUT fall time | tF | | | 100 | ns | See Test Circuits, Figure 1-2 | 4 |
| Operating current | IDD | | | 550 | µA | VDD = VREF = 5V, DOUT unloaded | 5 |
| Standby current | IDDS | | 0.005 | 2 | µA | CS = VDD = 5.0V | 5 |
## CAD (KiCad official)
- Symbol: `MCP3008T-I`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files: `mcp3008t-i-etched.step` / `mcp3008t-i-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mcp3008t-i.step` / `mcp3008t-i.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589040153084243968) (40 pp, sha256 `e6c2231de727395f`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mcp3008t-i-datasheet.pdf)