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MCP2562FDT-H

Microchip Tech · CAN ICs · SOIC-8

MCP2562FDT-H from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmitter data input: when TXD is Low, CANH and CANL are in the Dominant state, and when High they are Recessive unless another node drives Dominant; it has an internal pull-up of nominal 33 k to VIO on the MCP2562FD.
2 VSS power_in Ground supply pin; it is recommended to connect the exposed thermal pad to VSS on DFN variants.
3 VDD power_in Positive supply voltage pin that supplies the transmitter and receiver, including the wake-up receiver, with typical undervoltage threshold of 4V.
4 RXD output CMOS-compatible receive data output that is High when the CAN bus is Recessive and Low in the Dominant state, supplied by VIO on the MCP2562FD.
5 VIO power_in Supply for the digital I/O pins (TXD, RXD and STBY) on the MCP2562FD, with typical undervoltage threshold of 1.2V and RXD transferring data down to 1.8V on VIO.
6 CANL bidirectional CAN Low-level voltage I/O that drives the Low side of the CAN differential bus and disconnects from the bus when the device is not powered.
7 CANH bidirectional CAN High-level voltage I/O that drives the High side of the CAN differential bus and disconnects from the bus when the device is not powered.
8 STBY input Standby mode input that selects Standby mode when High and Normal mode when Low, with an internal MOS pull-up to VIO of typically 660 k at 5V, 1.1 M at 3.3V and 4.4 M at 1.8V.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD Pin Voltage Range VDD 4.5 5.5 V 9
Digital Supply Voltage Range VIO 1.8 5.5 V 9
Supply Current IDD 5 10 mA Recessive; VTXD = VDD 9
Supply Current IDD 45 70 mA Dominant; VTXD = 0V 9
Standby Current IDDS 5 15 µA MCP2562FD; Includes IIO 9
High Level of the POR Comparator VPORH 3.8 4.3 V 9
Low Level of the POR Comparator VPORL 3.4 4 V 9
Hysteresis of POR Comparator VPORD 0.3 0.8 V 9
Supply Current on VIO IIO 4 30 µA Recessive; VTXD = VIO 9
Supply Current on VIO IIO 85 500 µA Dominant; VTXD = 0V 9
Standby Current IDDS 0.3 1 µA Note 1 9
Recessive Bus Output Voltage VO(R) 2 3 V VTXD = VDD; No load 9
Bus Output Voltage in Standby VO(S) -0.1 0 0.1 V STBY = VTXD = VDD; No load 9
Recessive Output Current IO(R) -5 5 mA -24V < VCAN < +24V 9
CANH Dominant Output Voltage VO(D) 2.75 3.5 4.5 V TXD = 0; RL = 50 to 65 9
CANL Dominant Output Voltage VO(D) 0.5 1.5 2.25 V RL = 50 to 65 9
Symmetry of Dominant Output Voltage (VDD - VCANH - VCANL) VO(D)(M) -400 0 400 mV VTXD = VSS (Note 1) 9
Dominant Differential Output Voltage VO(DIFF) 1.5 2 3 V VTXD = VSS; RL = 50 to 65 9
Recessive Differential Output Voltage VO(DIFF) -120 0 12 mV VTXD = VDD 9
Recessive Differential Output Voltage VO(DIFF) -500 0 50 mV VTXD = VDD, no load. 9
CANH Short Circuit Output Current IO(SC) -120 85 mA VTXD = VSS; VCANH = 0V; CANL: floating 10
CANL Short Circuit Output Current IO(SC) 75 120 mA VTXD = VSS; VCANL = 18V; CANH: floating 10
Recessive Differential Input Voltage VDIFF(R)(I) -1 0.5 V Normal Mode; -12V < V(CANH, CANL) < +12V; See Figure 2-6 (Note 3) 10
Recessive Differential Input Voltage VDIFF(R)(I) -1 0.4 V Standby Mode; -12V < V(CANH, CANL) < +12V; See Figure 2-6 (Note 3) 10
Dominant Differential Input Voltage VDIFF(D)(I) 0.9 V Normal Mode; -12V < V(CANH, CANL) < +12V; See Figure 2-6 (Note 3) 10
Dominant Differential Input Voltage VDIFF(D)(I) 1 V Standby Mode; -12V < V(CANH, CANL) < +12V; See Figure 2-6 (Note 3) 10
Differential Receiver Threshold VTH(DIFF) 0.5 0.7 0.9 V Normal Mode; -12V < V(CANH, CANL) < +12V; See Figure 2-6 (Note 3) 10
Differential Receiver Threshold VTH(DIFF) 0.4 1.15 V Standby Mode; -12V < V(CANH, CANL) < +12V; See Figure 2-6 (Note 3) 10
Differential Input Hysteresis VHYS(DIFF) 50 200 mV Normal mode, see Figure 2-6, (Note 1) 10
Common Mode Input Resistance RIN 10 30 k (Note 1) 10
Differential Input Resistance RIN(DIFF) 10 100 k (Note 1) 10
Common Mode Input Capacitance CIN(CM) 20 pF VTXD = VDD; (Note 1) 10
CANH, CANL Input Leakage ILI -5 5 µA VDD = VTXD = VSTBY = 0V. For MCP2562FD, VIO = 0V. VCANH = VCANL = 5 V. 10
Digital Input Pins Low-Level Input Voltage VIL -0.3 V 11
TXD: Low-Level Input Current IIL(TXD) -270 -150 -30 µA 11
STBY: Low-Level Input Current IIL(STBY) -30 -1 µA 11
Low-Level Output Voltage VOL 0.4 V IOL = 4 mA; typical 8 mA 11
Shutdown Junction Temperature TJ(SD) 165 175 185 °C -12V < V(CANH, CANL) < +12V, (Note 1) 11
Shutdown Temperature Hysteresis TJ(HYST) 20 30 °C -12V < V(CANH, CANL) < +12V, (Note 1) 11
Bit Time tBIT 0.2 69.44 µs 13
Bit Frequency fBIT 14.4 5000 kHz 13
Recessive bit time on RXD - 2 Mbps, Loop Delay Symmetry tBIT(RXD),2M 450 485 550 ns tBIT(TXD) = 500 ns, see Figure 2-10 13
Recessive bit time on RXD - 5 Mbps, Loop Delay Symmetry tBIT(RXD),5M 160 185 220 ns tBIT(TXD) = 200 ns, see Figure 2-10 13
Delay Bus Dominant to RXD (Standby mode) tFLTR(WAKE) 0.5 1 4 µs Standby mode 13
Delay Standby to Normal Mode tWAKE 5 25 40 µs Negative edge on STBY 13
VDD Supply Voltage Absolute Maximum VDD 7 V 8
VIO Supply Voltage Absolute Maximum VIO 7 V 8
DC Voltage at CANH, CANL and SPLIT -58 58 V 8
Transient Voltage on CANH, CANL (ISO-7637) -150 100 V See Figure 2-5 8
Storage temperature -55 150 °C 8
Specified Temperature Range TA -40 150 C H grade 16
Operating Temperature Range TA -40 150 C 16
Storage Temperature Range TA -65 155 C 16
Thermal Resistance, 8L-SOIC JA 149.5 C/W 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin P = Plastic Dual In-Line - 300 mil Body, 8-lead SN = Plastic Small Outline - Narrow, 3.90 mm Body, 29

CAD (KiCad official)

  • Symbol: MCP2562FDT-H
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mcp2562fdt-h-etched.step / mcp2562fdt-h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp2562fdt-h.step / mcp2562fdt-h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (32 pp, sha256 79321323eb3295c5, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF