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MCP25625T-E
Public Made by Adomby adom
Microchip Tech CAN Transceivers, QFN-28-EP(6x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMCP25625T-E
Microchip Tech · CAN Transceivers · QFN-28-EP(6x6)
MCP25625T-E from Microchip Tech, in a QFN-28-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | SPI Chip Select input for the CAN controller interface. |
| 2 | RESET | input | Hardware Reset input; a low level resets the device, and an RC network can hold it in Reset for at least 2 µs after VDD reaches its operating voltage. |
| 3 | VDD | power_in | Power supply for the CAN controller, 2.7 V to 5.5 V. |
| 4 | TxCAN | output | Transmit output from the CAN controller to the TXD input of the CAN transceiver. |
| 5 | RXCAN | input | Receive input from the CAN transceiver RXD output. |
| 6 | CLKOUT | output | Clock output (also SOF) with internal prescaler dividing FOSC by 1, 2, 4 or 8, 25 MHz maximum, high-impedance when disabled. |
| 7 | Tx0RTS | input | Request-to-send input for transmit buffer TXB0; can be configured as a general purpose I/O. |
| 8 | Tx1RTS | input | Request-to-send input for transmit buffer TXB1; can be configured as a general purpose I/O. |
| 9 | Tx2RTS | input | Request-to-send input for transmit buffer TXB2; can be configured as a general purpose I/O. |
| 10 | RXD | output | CMOS-compatible receive data output from the CAN transceiver, supplied by VIO; high when the bus is recessive and low when dominant. |
| 11 | VIO | power_in | Supply for the CAN transceiver digital I/O pins, digital supply range 2.7 V to 5.5 V. |
| 12 | CANL | bidirectional | CAN low-level high-voltage I/O; disconnected from the bus when VDDA is not powered. |
| 13 | CANH | bidirectional | CAN high-level high-voltage I/O; disconnected from the bus when VDDA is not powered. |
| 14 | NC | unconnected | No connection. |
| 15 | STBY | input | Standby mode input selecting Normal or Standby mode of the CAN transceiver; internally pulled up to VIO. |
| 16 | TXD | input | Transmit data input from the CAN controller; low drives the bus dominant, with an internal pull-up of nominal 33 kΩ to VIO. |
| 17 | NC | unconnected | No connection. |
| 18 | VSS | power_in | Ground supply pin for the CAN transceiver. |
| 19 | VDDA | power_in | Positive supply for the CAN transceiver and wake-up receiver, 4.5 V to 5.5 V. |
| 20 | OSC2 | output | Crystal/ceramic resonator output for the internal oscillator (parallel cut crystal required). |
| 21 | OSC1 | input | Crystal/ceramic resonator input, or external clock input to the oscillator. |
| 22 | GND | power_in | Ground for the CAN controller. |
| 23 | Rx1BF | output | RxB1 buffer-full output; can be configured as an interrupt pin or general purpose output. |
| 24 | Rx0BF | output | RxB0 buffer-full output; can be configured as an interrupt pin or general purpose output. |
| 25 | INT | output | Interrupt output to the microcontroller; interrupts are cleared through SPI. |
| 26 | SCK | input | SPI clock input, up to 10 MHz. |
| 27 | SI | input | SPI data input. |
| 28 | SO | output | SPI data output. |
| 29 | EP | passive | Exposed thermal pad; recommended to connect to VSS to enhance electromagnetic immunity and thermal resistance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-28-EP(6x6) |
| Category | Interface |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage VDD | VDD | 7 | V | 67 | |||
| Supply Voltage VDDA | VDDA | 7 | V | 67 | |||
| Supply Voltage VIO | VIO | 7 | V | 67 | |||
| DC Voltage at CANH, CANL | -58 | 58 | V | 67 | |||
| DC Voltage at TXD, RXD, STBY w.r.t VSS | -0.3 | V | max VIO + 0.3 V | 67 | |||
| DC Voltage at All Other I/Os w.r.t GND | -0.3 | V | max VDD + 0.3 V | 67 | |||
| Transient Voltage on CANH, CANL (ISO-7637) | -150 | 100 | V | ISO-7637 Figure 7-5 | 67 | ||
| Storage temperature | -55 | 150 | °C | 67 | |||
| Operating Ambient Temperature | -40 | 125 | °C | 67 | |||
| Virtual Junction Temperature (IEC60747-1) | TVJ | -40 | 150 | °C | 67 | ||
| Soldering Temperature of Leads (10 seconds) | 300 | °C | 67 | ||||
| VDD Supply Voltage | VDD | 2.7 | 5.5 | V | 68 | ||
| Register Retention Voltage | VRET | 2.4 | V | 68 | |||
| Low-Level Input Voltage RxCAN, TxnRTS (VIL) | VIL | -0.3 | V | 68 | |||
| Low-Level Input Voltage SCK, CS, SI (VIL) | VIL | -0.3 | V | 68 | |||
| Low-Level Output Voltage TxCAN | VOL | 0.6 | V | IOL = +6.0 mA, VDD = 4.5V | 68 | ||
| Low-Level Output Voltage RxnBF Pins | VOL | 0.6 | V | IOL = +8.5 mA, VDD = 4.5V | 68 | ||
| Low-Level Output Voltage SO, CLKOUT | VOL | 0.6 | V | IOL = +2.1 mA, VDD = 4.5V | 68 | ||
| Low-Level Output Voltage INT | VOL | 0.6 | V | IOL = +1.6 mA, VDD = 4.5V | 68 | ||
| Input Leakage Current, All I/Os except OSC1 and TxnRTS Pins | ILI | -1 | 1 | µA | CS = RESET = VDD, VIN = VSS to VDD | 68 | |
| Input Leakage Current, OSC1 Pin | ILI | -5 | 5 | µA | 68 | ||
| Internal Capacitance (all inputs and outputs) | CINT | 7 | pF | TAMB = +25°C, fC = 1.0 MHz, VDD = 0V | 68 | ||
| Operating Current | IDD | 10 | mA | VDD = 5.5V, FOSC = 25 MHz, FCLK = 1 MHz, SO = Open | 68 | ||
| Standby Current (Sleep mode) | IDDS | 8 | µA | CS, TxnRTS = VDD, Inputs tied to VDD or VSS, -40°C to +125°C | 68 | ||
| Clock In Frequency | FOSC | 1 | 25 | MHz | 68 | ||
| Clock In Period | TOSC | 40 | 1000 | ns | 68 | ||
| Duty Cycle (External Clock input) | tDUTY | 0.45 | 0.55 | , | TOSH/(TOSH + TOSL) | 68 | |
| Wake-up Noise Filter | tWF | 100 | ns | 69 | |||
| RESET Pin Low Time | tRL | 2 | µs | 69 | |||
| Clock Frequency (SPI) | FCLK | 10 | MHz | 70 | |||
| Data Setup Time | tSU | 10 | ns | 70 | |||
| Supply Voltage Range VDDA | VDDA | 4.5 | 5.5 | V | 71 | ||
| Supply Current VDDA (Recessive) | IDD | 5 | 10 | mA | Recessive; VTXD = VDDA | 71 | |
| Supply Current VDDA (Dominant) | IDD | 45 | 70 | mA | Dominant; VTXD = 0V | 71 | |
| Standby Current VDDA | IDDS | 5 | 15 | µA | Includes IIO | 71 | |
| High Level of the POR Comparator | VPORH | 3.8 | 4.3 | V | 71 | ||
| Low Level of the POR Comparator | VPORL | 3.4 | 4 | V | 71 | ||
| Hysteresis of POR Comparator | VPORD | 0.3 | 0.8 | V | 71 | ||
| Digital Supply Voltage Range VIO | VIO | 2.7 | 5.5 | V | 71 | ||
| Supply Current on VIO (Recessive) | IIO | 4 | 30 | µA | Recessive; VTXD = VIO | 71 | |
| Supply Current on VIO (Dominant) | IIO | 85 | 500 | µA | Dominant; VTXD = 0V | 71 | |
| Standby Current VIO | IDDS | 0.3 | 1 | µA | 71 | ||
| CANH, CANL: Recessive Bus Output Voltage | VO(R) | 2 | 3 | V | VTXD = VDDA; No load | 71 | |
| CANH, CANL: Bus Output Voltage in Standby | VO(S) | -0.1 | 0 | 0.1 | V | STBY = VTXD = VDDA; No load | 71 |
| Recessive Output Current | IO(R) | -5 | 5 | mA | -24V < VCAN < +24V | 71 | |
| CANH: Dominant Output Voltage | VO(D) | 2.75 | 3.5 | 4.5 | V | TXD = 0; RL = 50 to 65 | 71 |
| CANL: Dominant Output Voltage | VO(D) | 0.5 | 1.5 | 2.25 | V | RL = 50 to 65 | 71 |
| Symmetry of Dominant Output Voltage (VDD, VCANH, VCANL) | VO(D)(M) | -400 | 0 | 400 | mV | VTXD = VSS | 71 |
| Dominant: Differential Output Voltage | VO(DIFF) | 1.5 | 2 | 3 | V | VTXD = VSS; RL = 50 to 65 | 71 |
| Recessive: Differential Output Voltage | VO(DIFF) | -120 | 0 | 12 | mV | VTXD = VDDA | 71 |
| Recessive Differential Input Voltage | VDIFF(R)(I) | -1 | 0.5 | V | Normal mode; -12V < V(CANH, CANL) < +12V | 72 | |
| Dominant Differential Input Voltage | VDIFF(D)(I) | 0.9 | V | Normal mode; -12V < V(CANH, CANL) < +12V | 72 | ||
| Differential Receiver Threshold | VTH(DIFF) | 0.5 | 0.7 | 0.9 | V | Normal mode; -12V < V(CANH, CANL) < +12V | 72 |
| Differential Input Hysteresis | VHYS(DIFF) | 50 | 200 | mV | Normal mode; see Figure 7-6 | 72 | |
| Common-Mode Input Resistance | RIN | 10 | 30 | k | 72 | ||
| Shutdown Junction Temperature | TJ(SD) | 165 | 175 | 185 | °C | -12V < V(CANH, CANL) < +12V | 72 |
| Shutdown Temperature Hysteresis | TJ(HYST) | 20 | 30 | °C | -12V < V(CANH, CANL) < +12V | 72 | |
| Operating Temperature Range | TA | -40 | 125 | °C | 77 | ||
| Storage Temperature Range | TA | -65 | 150 | °C | 77 | ||
| Thermal Resistance, 28L-QFN 6x6 mm | JA | 32.8 | C/W | 77 |
CAD (KiCad official)
- Symbol:
MCP25625T-E - Footprint:
Package_DFN_QFN:QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm - 3D model: QFN-28-EP(6x6) (KiCad packages3D, STEP)
- 3D model files:
mcp25625t-e-etched.step/mcp25625t-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp25625t-e.step/mcp25625t-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (90 pp, sha256
b668c3cd8762638d, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).