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MCP23009T-E

Public Made by Adom

by adom

Microchip Tech I/O Expanders, SSOP-20-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MCP23009T-E

Microchip Tech · I/O Expanders · SSOP-20-208mil

MCP23009T-E from Microchip Tech, in a SSOP-20-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Power supply pin; the device operates from 1.8V to 5.5V per the datasheet features list.
2 NC unconnected Not connected.
3 SCL input Serial clock input for the I2C interface (MCP23009).
4 SDA bidirectional Serial data I/O for the I2C interface (MCP23009).
5 ADDR input Hardware address pin that allows up to eight slave devices on the bus.
6 RESET input Hardware reset input.
7 INT output Interrupt output for the port; can be configured as active-high, active-low or open-drain.
8 GP0 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
9 GP1 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
10 NC unconnected Not connected.
11 NC unconnected Not connected.
12 GP2 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
13 GP3 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
14 GP4 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
15 GP5 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
16 GP6 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
17 GP7 bidirectional Bidirectional I/O pin with 5.5V tolerant inputs and open-drain outputs; can be enabled for interrupt-on-change and/or internal pull-up resistor.
18 NC unconnected Not connected.
19 NC unconnected Not connected.
20 VSS power_in Ground reference pin.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SSOP-20-208mil
Category Interface
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature under bias -40 125 °C 29
Storage temperature -65 150 °C 29
Voltage on VDD with respect to VSS -0.3 7 V 29
Voltage on RESET with respect to VSS -0.3 14 V 29
Voltage on GPIO pins -0.6 5.5 V 29
Maximum current into VDD pin 125 mA 29
Input clamp current IIK 20 mA VI < 0 or VI > VDD 29
Maximum output current sunk by any output pin 25 mA 29
ESD protection on all pins (HBM) 4 kV 29
Supply Voltage VDD 1.8 5.5 V 30
Supply Current IDD 1 mA SCL/SCK = 1 MHz 30
Standby (Idle) current IDDS 1 µA -40°C ≤ TA ≤ +85°C 30
Standby (Idle) current IDDS 6 µA +85°C ≤ TA ≤ +125°C 30
Input Leakage Current (I/O port pins) IIL -1 1 µA VSS ≤ VPIN ≤ VDD 30
Output Leakage Current (I/O port pins) ILO -1 1 µA VSS ≤ VPIN ≤ VDD 30
GPIO Input High-Voltage VIH 5.5 V 30
Output Low-Voltage (GPIO, open-drain) VOL 0.6 V IOL = 8.5 mA, VDD = 4.5V (open-drain) 30
Output Low-Voltage (INT) VOL 0.6 V IOL = 1.6 mA, VDD = 4.5V 30
Output Low-Voltage (SO, SDA) VOL 0.6 V IOL = 3.0 mA, VDD = 1.8V 30
Output Low-Voltage (SDA) VOL 0.8 V IOL = 3.0 mA, VDD = 4.5V 30
Capacitive Loading (SDA) CB 400 pF 30
RESET Pulse Width (low) TRSTL 1 µs VDD = 5.0V 31
Serial data to output valid tGPOV 500 ns 32
Interrupt pin disable time tINTD 600 ns 32
IOC event to INT active tGPINT 600 ns 32
Clock High Time (100 kHz mode) THIGH 4 µs 1.8V, 5.5V 35
Clock High Time (400 kHz mode) THIGH 0.6 µs 1.8V, 5.5V 35
Clock High Time (3.4 MHz mode) THIGH 0.06 µs 2.7V, 5.5V 35
Clock Low Time (100 kHz mode) TLOW 4.7 µs 1.8V, 5.5V 35
Clock Low Time (400 kHz mode) TLOW 1.3 µs 1.8V, 5.5V 35
Clock Low Time (3.4 MHz mode) TLOW 0.16 µs 2.7V, 5.5V 35
SDA and SCL Rise Time (100 kHz mode) TR 1000 ns 1.8V, 5.5V 35
SDA and SCL Rise Time (400 kHz mode) TR 300 ns 1.8V, 5.5V 35
SDA and SCL Rise Time (3.4 MHz mode) TR 10 80 ns 2.7V, 5.5V 35
SDA and SCL Fall Time (100 kHz mode) TF 300 ns 1.8V, 5.5V 35
SDA and SCL Fall Time (400 kHz mode) TF 300 ns 1.8V, 5.5V 35
SDA and SCL Fall Time (3.4 MHz mode) TF 10 80 ns 2.7V, 5.5V 35
Start Condition Setup Time (100 kHz mode) TSU:STA 4.7 µs 1.8V, 5.5V 35
Start Condition Setup Time (400 kHz mode) TSU:STA 0.6 µs 1.8V, 5.5V 35
Start Condition Setup Time (3.4 MHz mode) TSU:STA 0.16 µs 2.7V, 5.5V 35
Start Condition Hold Time (100 kHz mode) THD:STA 4 µs 1.8V, 5.5V 35
Start Condition Hold Time (400 kHz mode) THD:STA 0.6 µs 1.8V, 5.5V 35
Start Condition Hold Time (3.4 MHz mode) THD:STA 0.16 µs 2.7V, 5.5V 35
Data Input Hold Time (100 kHz mode) THD:DAT 0 3.45 µs 1.8V, 5.5V 35
Data Input Hold Time (400 kHz mode) THD:DAT 0 0.9 µs 1.8V, 5.5V 35
Data Input Hold Time (3.4 MHz mode) THD:DAT 0 0.07 µs 2.7V, 5.5V 35
Data Input Setup Time (100 kHz mode) TSU:DAT 250 ns 1.8V, 5.5V 35
Data Input Setup Time (400 kHz mode) TSU:DAT 100 ns 1.8V, 5.5V 35
Data Input Setup Time (3.4 MHz mode) TSU:DAT 0.01 µs 2.7V, 5.5V 35
Stop Condition Setup Time (100 kHz mode) TSU:STO 4 µs 1.8V, 5.5V 35
Stop Condition Setup Time (400 kHz mode) TSU:STO 0.6 µs 1.8V, 5.5V 35
Stop Condition Setup Time (3.4 MHz mode) TSU:STO 0.16 µs 2.7V, 5.5V 35
Output Valid From Clock (100 kHz mode) TAA 3.45 µs 1.8V, 5.5V 36
Output Valid From Clock (400 kHz mode) TAA 0.9 µs 1.8V, 5.5V 36
Output Valid From Clock (3.4 MHz mode) TAA 0.18 µs 2.7V, 5.5V 36
Bus Capacitive Loading (100 kHz and 400 kHz) CB 400 pF 100 kHz and 400 kHz 36
Bus Capacitive Loading (3.4 MHz) CB 100 pF 3.4 MHz 36

CAD (KiCad official)

  • Symbol: MCP23009T-E
  • Footprint: Package_SO:SSOP-20_5.3x7.2mm_P0.65mm
  • 3D model: SSOP-20-208mil (KiCad packages3D, STEP)
  • 3D model files: mcp23009t-e-etched.step / mcp23009t-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp23009t-e.step / mcp23009t-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (52 pp, sha256 70744ea2313e65a6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF