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MCP2021AT-500E

Microchip Tech · LIN Transceivers · DFN-8-EP(4x4)

MCP2021AT-500E from Microchip Tech, in a DFN-8-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RXD output Receive Data Output, a standard CMOS output that follows the state of the LBUS pin.
2 CS/LWAKE input Chip Select and Local Wake-up Input (TTL level, high-voltage tolerant) that controls device state transitions, with internal pull-down of ~600 kΩ when high and ~300 kΩ when low.
3 VREG power_out Voltage regulator output giving +5.0V or +3.3V at 70 mA regulated voltage.
4 TXD input Transmit Data Input (TTL level, HV-compliant up to 30V, adaptive pull-up to ~4.2V) that drives the LBUS pin low (dominant) when low.
5 VSS power_in Ground pin.
6 LBUS bidirectional LIN Bus pin, a bidirectional open-collector interface with current limitation and controlled slopes, controlled by TXD.
7 VBB power_in Battery positive supply voltage pin, with an external series diode to prevent reverse powering.
8 FAULT/TXE bidirectional Fault Detect Output (HV-tolerant open-drain up to 30V) / Transmitter Enable Input, with Transmitter Off mode entered when low; a 10 kΩ external pull-up is recommended.
9 EP passive Exposed thermal pad.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package DFN-8-EP(4x4)
Category Communication Interface Chip/UART/485/232
Pins 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin f) MCP2021A-500E/P: 5.0V, 8-lead PDIP package g) MCP2021A-330E/SN: 3.3V, 8-lead SOIC package 45

CAD (KiCad official)

  • Symbol: MCP2021AT-500E
  • Footprint: Package_DFN_QFN:DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
  • 3D model: DFN-8-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: mcp2021at-500e-etched.step / mcp2021at-500e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp2021at-500e.step / mcp2021at-500e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (48 pp, sha256 3c5e8b3bb6f80ae5, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF