component
MCP2021A-500E
Public Made by Adomby adom
Microchip Tech LIN Transceivers, DFN-8-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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MCP2021A-500E
Microchip Tech · LIN Transceivers · DFN-8-EP(4x4)
MCP2021A-500E from Microchip Tech, in a DFN-8-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RXD | output | Receive Data Output is a standard CMOS output that follows the state of the LBUS pin. |
| 2 | CS/LWAKE | input | Chip Select and Local Wake-up Input is a TTL-level, high-voltage-tolerant input that controls device state transitions and should not be tied directly to VREG. |
| 3 | VREG | power_out | Positive supply voltage regulator output provides +5.0 V or +3.3 V at 70 mA regulated voltage. |
| 4 | TXD | input | Transmit Data Input is a TTL-level, HV-compliant input with adaptive pull-up (about 4.2 V internal) that drives LBUS low when TXD is low and is HV-compliant up to 30 V. |
| 5 | VSS | power_in | Ground pin. |
| 6 | LBUS | bidirectional | LIN Bus pin is a bidirectional, HV open-collector output with current limitation, controlled by TXD, with controlled edge slopes to reduce emission. |
| 7 | VBB | power_in | Battery Positive Supply Voltage pin, which requires an external series diode to prevent reverse powering of the device. |
| 8 | FAULT/TXE | bidirectional | Fault Detect Output/Transmitter Enable Input is an HV-tolerant open-drain output (up to 30 V) that places the device in Transmitter Off mode when driven low, and a 10 kΩ external pull-up is recommended. |
| 9 | EP | passive | Exposed Thermal Pad, listed for the 4x4 DFN package in the pin function table; the datasheet gives no electrical function for it. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | DFN-8-EP(4x4) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Voltage on RXD and RESET (max VREG + 0.3) | VIN | -0.3 | V | 15 | |||
| DC Voltage on TXD, CS/LWAKE, FAULT/TXE | VIN | -0.3 | 40 | V | 15 | ||
| Battery Voltage, continuous, non-operating | VBB | -0.3 | 40 | V | continuous, non-operating (Note 1) | 15 | |
| Battery Voltage, non-operating | VBB | -0.3 | 43 | V | LIN bus recessive, no regulator load, t < 60s (Note 2) | 15 | |
| Battery Voltage, transient ISO 7637 Test 1 | VBB | -100 | V | ISO 7637 Test 1 | 15 | ||
| Battery Voltage, transient ISO 7637 Test 2a | VBB | 75 | V | ISO 7637 Test 2a | 15 | ||
| Battery Voltage, transient ISO 7637 Test 3a | VBB | -150 | V | ISO 7637 Test 3a | 15 | ||
| Battery Voltage, transient ISO 7637 Test 3b | VBB | 100 | V | ISO 7637 Test 3b | 15 | ||
| Bus Voltage, continuous | VLBUS | -18 | 30 | V | 15 | ||
| Bus Voltage, transient | VLBUS | -27 | 43 | V | Note 3 (ISO 7637/1 load dump, t < 500 ms) | 15 | |
| Bus Short Circuit Current Limit | ILBUS | 200 | mA | 15 | |||
| ESD protection on LIN, VBB | -15 | 15 | kV | IEC 61000-4-2 (Note 4) | 15 | ||
| Supply voltage VBB (specified range) | VBB | 6 | 18 | V | all DC/AC limits specified for VBB = 6.0V to 18.0V | 16 | |
| Specified Temperature Range | TA | -40 | 125 | C | 21 | ||
| Maximum Junction Temperature | TJ | 150 | C | 21 | |||
| Storage Temperature Range | TA | -65 | 150 | C | 21 | ||
| Short Circuit Recovery Time | tTHERM | 1.5 | 5 | ms | 21 | ||
| VBB Quiescent Operating Current | IBBQ | 200 | µA | IOUT = 0 mA; LBUS recessive; VREG = 5.0V | 16 | ||
| VBB Ready Current | IBBRD | 100 | µA | IOUT = 0 mA; LBUS recessive; VREG = 5.0V | 16 | ||
| VBB Transmitter-Off Current | IBBTO | 100 | µA | voltage regulator on, transmitter off, receiver on, FAULT/TXE = VIL, CS = VIH, VREG = 5.0V | 16 | ||
| VBB Power-Down Current | IBBPD | 4.5 | 8 | µA | voltage regulator off, receiver on and transmitter off, FAULT/TXE = VIH, TXD = VIH, CS = VIL | 16 | |
| VBB Current with VSS Floating | IBBNOGND | -1 | 1 | mA | VBB = 12V, GND to VBB, VLIN = 0, 18V | 16 | |
| High-Level Input Voltage (TXD, FAULT/TXE) (max VREG + 0.3) | VIH | 2 | V | 16 | |||
| Low-Level Input Voltage (TXD, FAULT/TXE) | VIL | -0.3 | 0.8 | V | 16 | ||
| High-Level Input Voltage (CS/LWAKE) (max VBB) | VIH | 2 | V | through a current-limiting resistor | 16 | ||
| Low-Level Input Voltage (CS/LWAKE) | VIL | -0.3 | 0.8 | V | 16 | ||
| Low-Level Output Voltage (RXD) (x VREG) | VOLRXD | 0.2 | x VREG | IOL = 2 mA | 17 | ||
| Low-Level Output Voltage (FAULT/TXE) | VOLOD | 1 | V | IOL = 4 mA | 17 | ||
| High-Level Input Voltage (LBUS) (x VBB) | VIH(LBUS) | 0.6 | x VBB | recessive state | 17 | ||
| Low-Level Input Voltage (LBUS) (max 0.4 x VBB) | VIL(LBUS) | -8 | 0.4 | V | dominant state | 17 | |
| Low-Level Output Current (LBUS) | IOL(LBUS) | 40 | 200 | mA | output voltage = 0.1 VBB, VBB = 12V | 17 | |
| Pull-Up Current on Input (LBUS) | IPU(LBUS) | -180 | -72 | µA | @ VIH(LBUS) = 0.7 VBB, VBB = 12V; ~30 k internal pull-up | 17 | |
| Short Circuit Current Limit | ISC | 50 | 200 | mA | Note 1 | 17 | |
| High-Level Output Voltage (LBUS) (x VBB) | VOH(LBUS) | 0.8 | x VBB | 17 | |||
| Driver Dominant Voltage V_HISUP | V_HISUP | 1.2 | V | VBB = 18V, RLOAD = 1000 | 17 | ||
| Wake-Up Voltage Threshold on LIN Bus | VWK(LBUS) | 3.4 | V | wake-up from Power-Down mode (Note 3) | 18 | ||
| Capacitance of Slave Node | CSLAVE | 50 | pF | Note 2 | 18 | ||
| Slave Termination | RSLAVE | 20 | 30 | 47 | k | Note 2 | 17 |
| Receiver Center Voltage (x VBB) | VBUS_CNT | 0.475 | 0.5 | 0.525 | x VBB | VBUS_CNT = (VIL(LBUS)+VIH(LBUS))/2 | 17 |
| Input Leakage Current (receiver, recessive bus level) | IBUS_PAS_REC | -20 | 20 | µA | driver off; 8V < VBB < 18V; 8V < VBUS < 18V | 17 | |
| Input Leakage Current (receiver, dominant bus level) | IBUS_PAS_DOM | -1 | mA | driver off; VBUS = 0V; VBB = 12V | 17 | ||
| Voltage Regulator 5.0V Output Voltage Range | VREG | 4.85 | 5 | 5.15 | V | 0 mA < IOUT < 70 mA | 18 |
| Voltage Regulator 5.0V Line Regulation | VOUT1 | 10 | 50 | mV | IOUT = 1 mA; 6.0V < VBB < 18V | 18 | |
| Voltage Regulator 5.0V Load Regulation | VOUT2 | 10 | 50 | mV | 5 mA < IOUT < 70 mA; 6.3V < VBB < 12V | 18 | |
| Shutdown Voltage Threshold (5.0V) | VSD | 3.5 | 4 | V | see Figure 1-5 (Note 2) | 18 | |
| Input Voltage to Turn-Off Output (5.0V) | VOFF | 3.9 | 4.5 | V | 18 | ||
| Input Voltage to Turn-On Output (5.0V) | VON | 5.25 | 6 | V | 18 | ||
| Slope Rising and Falling Edges | tSLOPE | 3.5 | 22.5 | µs | 7.3V <= VBB <= 18V | 20 | |
| Propagation Delay of Transmitter | tTRANSPD | 5 | µs | tTRANSPD = max. (tTRANSPDR or tTRANSPDF) | 20 | ||
| Propagation Delay of Receiver | tRECPD | 6 | µs | tRECPD = max. (tRECPDR or tRECPDF) | 20 | ||
| Time to Sample FAULT/TXE for Bus Conflict Reporting | tFAULT | 32.5 | µs | tFAULT = max. (tTRANSPD + tSLOPE + tRECPD) | 20 | ||
| Duty Cycle 1 @ 20.0 kbps | D1 | 0.396 | %tBIT | THREC(MAX) = 0.744 x VBB, THDOM(MAX) = 0.581 x VBB, VBB = 7.0V, 18V; tBIT = 50 µs | 20 | ||
| Duty Cycle 2 @ 20.0 kbps | D2 | 0.581 | %tBIT | THREC(MAX) = 0.284 x VBB, THDOM(MAX) = 0.422 x VBB, VBB = 7.6V, 18V; tBIT = 50 µs | 20 | ||
| Duty Cycle 3 @ 10.4 kbps | D3 | 0.417 | %tBIT | THREC(MAX) = 0.778 x VBB, THDOM(MAX) = 0.616 x VBB, VBB = 7.0V, 18V; tBIT = 96 µs | 20 | ||
| Duty Cycle 4 @ 10.4 kbps | D4 | 0.59 | %tBIT | THREC(MAX) = 0.251 x VBB, THDOM(MAX) = 0.389 x VBB, VBB = 7.6V, 18V; tBIT = 96 µs | 21 | ||
| Bus Activity to Voltage Regulator Enabled | tBACTIVE | 35 | 200 | µs | 21 | ||
| Voltage Regulator Enabled to Ready | tVEVR | 300 | 1200 | µs | Note 1: CREG = 4.7 µF, no resistor load | 21 | |
| Chip Select to Ready Mode | tCSR | 230 | µs | 21 | |||
| Short Circuit to Shutdown | tSHUTDOWN | 20 | 100 | µs | 21 | ||
| Thermal Resistance, 8L-DFN | JA | 48 | C/W | 21 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | f) MCP2021A-500E/P: 5.0V, 8-lead PDIP package g) MCP2021A-330E/SN: 3.3V, 8-lead SOIC package | 45 |
CAD (KiCad official)
- Symbol:
MCP2021A-500E - Footprint:
Package_DFN_QFN:DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm - 3D model: DFN-8-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
mcp2021a-500e-etched.step/mcp2021a-500e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp2021a-500e.step/mcp2021a-500e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (48 pp, sha256
3c5e8b3bb6f80ae5, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).