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Ray Publish 0.1.0 1f57161 14h ago

MCP1824ST-3302E

Microchip Tech · Power Management Specialized - PMIC · SOT-223-3

MCP1824ST-3302E from Microchip Tech, in a SOT-223-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage supply with an operating range of 2.1V to 6.0V, where a 1 µF to 10 µF input capacitor is recommended for battery or remote sources.
2 GND power_in Ground pin that should be tied to a quiet circuit ground and carries only the LDO ground current.
3 VOUT power_out Regulated output voltage that requires a minimum of 1.0 µF output capacitance for stability.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-223-3
Category Power Supply Chip
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 2.1 6 V 7
Output Voltage Range VOUT 0.8 5 V 7
Input Quiescent Current Iq 120 220 µA IL = 0 mA, VOUT = 0.8V to 5.0V 7
Maximum Continuous Output Current IOUT 300 mA VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V 7
Line Regulation ΔVOUT/(VOUT x ΔVIN) -0.17 0.05 0.17 %/V (Note 1) ≤ VIN ≤ 6V 7
Load Regulation ΔVOUT/VOUT -1 0.5 1 % IOUT = 1 mA to 300 mA, (Note 4) 7
Dropout Voltage VDROPOUT 200 320 mV Note 5, IOUT = 300 mA, VIN(MIN) = 2.1V 7
Maximum Pulsed Output Duty Cycle IPULSE_DUTY 60 % VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V, IOUT = 500 mA, Period < 10 ms 8
Maximum Pulsed Output Period IPULSE_PERIOD 10 ms VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V, IOUT = 500 mA 8
Storage Temperature Range TA -65 150 °C 10
Operating Junction Temperature Range TJ -40 125 °C Steady State 10
Maximum Junction Temperature TJ 150 °C Transient 10
Thermal Resistance, 3LD SOT-223, junction to ambient θJA 62 °C/W EIA/JEDEC JESD51-751-7, 4 Layer Board 10
Thermal Resistance, 3LD SOT-223, junction to case θJC 15 °C/W EIA/JEDEC JESD51-751-7, 4 Layer Board 10

CAD (KiCad official)

  • Symbol: MCP1824ST-3302E
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223-3 (KiCad packages3D, STEP)
  • 3D model files: mcp1824st-3302e-etched.step / mcp1824st-3302e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1824st-3302e.step / mcp1824st-3302e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (34 pp, sha256 dda3986a6bed8be8, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF