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MCP1793T-3302H

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Microchip Tech Power Management Specialized - PMIC, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MCP1793T-3302H

Microchip Tech · Power Management Specialized - PMIC · SOT-23-5

MCP1793T-3302H from Microchip Tech, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage supply, 4.5V to 55V operating range (70V transient); a 2.2 µF to 10 µF ceramic input capacitor is recommended.
2 GND power_in Ground; carries only ground current and should be tied to a quiet circuit ground or the return of the output capacitor for best noise and PSRR.
3 SHDN input Shutdown control input: high enables the output, low (GND) disables it and drops quiescent current to 2 µA typical; do not leave floating.
4 NC unconnected Not connected pin; should either be left floating or connected to ground.
5 VOUT power_out Regulated output voltage VR (3.3V for this variant) requiring a minimum 2.2 µF ceramic output capacitor for stability.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-5
Category Power Supply Chip
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 4.5 55 V 3
Output Voltage tolerance VOUT -2 2 % VR ±2%, TA of -40°C to +85°C 3
Output Voltage tolerance VOUT -3 3 % VR ±3%, TA of -40°C to +150°C 3
Input Quiescent Current IQ 25 45 µA IOUT = 0A 3
Input Quiescent Current for SHDN Mode ISHDN 2 12 µA SHDN = GND, VIN = 55V 3
Ground Current IGND 100 150 µA IOUT = 100 mA 3
Ground Current IGND 25 µA IOUT = 1 mA 3
Maximum Continuous Output Current IOUT 100 mA (Note 2) 3
Foldback Current Corner IOUT_SC 230 370 mA VIN ≤ 55V (Note 5) 3
Foldback Current IFOLDBACK 10 mA VOUT~0V, VIN ≤ 55V (Note 5) 3
Line Regulation ΔVOUT/(VOUT×ΔVIN) -0.05 0.0002 0.05 %/V 4.5V < VIN < 55V, 6.2V < VIN < 55V 4
Load Regulation ΔVOUT/VOUT -1 0.2 1 % IOUT = 1 mA to 100 mA, TA of -40°C to +85°C 4
Load Regulation ΔVOUT/VOUT -2 0.2 2 % IOUT = 1 mA to 100 mA, TA of -40°C to +150°C 4
Dropout Voltage VDROPOUT 250 400 mV TA of -40°C to +85°C, IOUT = 100 mA 4
Dropout Voltage VDROPOUT 250 1200 mV TA of -40°C to +150°C, IOUT = 100 mA (Note 3) 4
Input Voltage to Turn On Output VUVLO_High 2.7 V rising VIN, VIN = 0 to VIN_MIN 4
Input Voltage to Turn Off Output VUVLO_Low 2.4 V failing VIN, VIN = VIN_MIN to 0 4
Shutdown Logic High Input VSHDN-HIGH 2.4 V max is VIN 4
Shutdown Logic Low Input VSHDN-LOW 0 0.8 V 4
Shutdown Input Leakage Current SHDNILK 0.2 0.4 µA SHDN = GND, or SHDN = 6.2V 4
Output Voltage Delay Time TDELAY 800 1200 µs VIN = 0 to 6.2V, VOUT = GND to 10% of VR, RLOAD = 50Ω (Note 5) 4
Output Rise Time TRISE 400 µs VIN = 0 to 6.2V, VOUT = 10% to 90% of VR, RLOAD = 50Ω (Note 5) 4
Output Noise eN 400 µVrms f = 10 Hz to 100 kHz, VR = 3.3V, IOUT = 10 mA (Note 5) 4
Power Supply Ripple Rejection Ratio PSRR 80 dB f = 100 Hz (Note 4, Note 5) 4
Power Supply Ripple Rejection Ratio PSRR 55 dB f = 100 kHz (Note 4, Note 5) 4
Thermal Shutdown TSD 175 181 °C Rising Temperature 5
Thermal Shutdown Hysteresis TSD 15 °C Falling Temperature 5
Thermal Resistance, SOT23-5LD, junction to ambient θJA 165 °C/W JEDEC standard 4-layer FR4 board with 1 oz. copper 5
Thermal Resistance, SOT23-5LD, junction to case θJC 96 °C/W JEDEC standard 4-layer FR4 board with 1 oz. copper 5
Input Voltage VIN 70 V 3
Maximum Voltage on VIN, SHDN -0.3 V (GND, 0.3V) to (VIN + 0.3V) 3
Maximum Voltage on VOUT VOUT -0.3 5.5 V (GND, 0.3V) to 5.5V 3
Storage Temperature -55 175 °C 3
Maximum Junction Temperature TJ 175 °C 3
Operating Junction Temperature TJ -40 150 °C 3
ESD protection HBM 2 kV all pins 3
ESD protection CDM 750 V all pins 3
ESD protection MM 200 V all pins 3

CAD (KiCad official)

  • Symbol: MCP1793T-3302H
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: mcp1793t-3302h-etched.step / mcp1793t-3302h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1793t-3302h.step / mcp1793t-3302h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (34 pp, sha256 98464c4589491b9b, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF