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MCP1792T-5002H

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Microchip Tech Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-23A-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MCP1792T-5002H

Microchip Tech · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23A-3

MCP1792T-5002H from Microchip Tech, in a SOT-23A-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; for optimal noise and PSRR it should be tied to an electrically quiet circuit ground, and for noisy inputs it should be tied to the return of the output capacitor.
2 VOUT power_out Regulated output voltage VR; a minimum output capacitance of 2.2 µF is required for stability, and the device is stable with ceramic capacitors.
3 VIN power_in Input voltage supply pin with an input operating voltage range of 4.5V to 55V; an input capacitance of 2.2 µF to 10 µF is recommended for most applications, such as with batteries or long leads.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23A-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 4.5 55 V 3
Output Voltage Range (tolerance, TA -40°C to +85°C) VOUT -2 2 % TA of -40°C to +85°C 3
Output Voltage Range (tolerance, TA -40°C to +150°C) VOUT -3 3 % TA of -40°C to +150°C 3
Input Quiescent Current IQ 25 45 µA IOUT = 0A 3
Input Quiescent Current for SHDN Mode ISHDN 2 12 µA SHDN = GND, VIN = 55V 3
Ground Current IGND 100 150 µA IOUT = 100 mA 3
Maximum Continuous Output Current IOUT 100 mA Note 2 3
Foldback Current Corner IOUT_SC 230 370 mA VIN ≤ 55V, Note 5 3
Line Regulation VOUT/(VOUT x VIN) -0.05 0.0002 0.05 %/V 4.5V < VIN < 55V, 6.2V < VIN < 55V 4
Load Regulation (TA -40°C to +85°C) VOUT/VOUT -1 0.2 1 % IOUT = 1 mA to 100 mA, TA of -40°C to +85°C 4
Load Regulation (TA -40°C to +150°C) VOUT/VOUT -2 0.2 2 % IOUT = 1 mA to 100 mA, TA of -40°C to +150°C 4
Dropout Voltage (TA -40°C to +85°C) VDROPOUT 250 400 mV TA of -40°C to +85°C, IOUT = 100 mA 4
Dropout Voltage (TA -40°C to +150°C) VDROPOUT 250 1200 mV TA of -40°C to +150°C, IOUT = 100 mA (Note 3) 4
Shutdown Input Logic High VSHDN-HIGH 2.4 V 4
Shutdown Input Logic Low VSHDN-LOW 0 0.8 V 4
Shutdown Input Leakage Current SHDNILK 0.2 0.4 µA SHDN = GND, or SHDN = 6.2V 4
Output Voltage Delay Time TDELAY 800 1200 µs VIN = 0 to 6.2V, VOUT = GND to 10% of VR, RLOAD = 50, Note 5 4
Input Voltage to Turn On Output (UVLO high) VUVLO_High 2.7 V VR = 3.3V, VR = 5.0V, rising VIN, VIN = 0 to VIN_MIN 4
Input Voltage to Turn Off Output (UVLO low) VUVLO_Low 2.4 V VR = 3.3V, VR = 5.0V, failing VIN, VIN = VIN_MIN to 0 4
Output Rise Time TRISE 400 µs VIN = 0 to 6.2V, VOUT = 10% to 90% of VR, RLOAD = 50, Note 5 4
Output Noise eN 400 µVrms f = 10 Hz to 100 kHz, VR = 3.3V, IOUT = 10 mA (Note 5) 4
Power Supply Ripple Rejection Ratio at 100 Hz PSRR 80 dB f = 100 Hz (Note 4, Note 5) 4
Power Supply Ripple Rejection Ratio at 100 kHz PSRR 55 dB f = 100 kHz (Note 4, Note 5) 4
Foldback Current IFOLDBACK 10 mA VOUT~0V, RLOAD ≥ 0.1; VIN ≤ 55V, Note 5 3
Ground Current at low load IGND 25 µA IOUT = 1 mA 3
Thermal Shutdown TSD 175 181 °C Rising Temperature 5
Thermal Shutdown Hysteresis TSD 15 °C Falling Temperature 5
Thermal Resistance, Junction to Air, SOT-23A-3LD θJA 147 °C/W JEDEC standard 4-layer FR4 board with 1 oz. copper 5
Thermal Resistance, Junction to Case, SOT-23A-3LD θJC 115 °C/W 5
Input Voltage (absolute maximum) 70 V 3
Maximum Voltage on VOUT- VOUT- 5.5 V 3
Storage Temperature TSTG -55 175 °C 3
Maximum Junction Temperature TJ 175 °C 3
Operating Junction Temperature TJ -40 150 °C 3
ESD protection HBM 2 kV 3
ESD protection CDM 750 V 3
ESD protection MM 200 V 3

CAD (KiCad official)

  • Symbol: MCP1792T-5002H
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23A-3 (KiCad packages3D, STEP)
  • 3D model files: mcp1792t-5002h-etched.step / mcp1792t-5002h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1792t-5002h.step / mcp1792t-5002h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (34 pp, sha256 98464c4589491b9b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF