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MCP1725T-3302E

Public Made by Adom

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Microchip Tech Power Management Specialized - PMIC, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MCP1725T-3302E

Microchip Tech · Power Management Specialized - PMIC · SOIC-8

MCP1725T-3302E from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage supply, operating range 2.3V to 6.0V; a 1 µF to 10 µF input capacitor is recommended if the source is far away or a battery.
2 VIN power_in Second input voltage supply pin, operating range 2.3V to 6.0V, connected to the same input source as pin 1.
3 SHDN input Shutdown control input: logic-high enables the LDO output, logic-low disables it and PWRGD goes low, with typical shutdown quiescent current of 0.1 µA.
4 GND power_in Ground, connect to a quiet circuit ground; it only conducts the LDO quiescent current (typically 120 µA).
5 PWRGD tri_state Open-drain power good output that indicates the output is within 92% (typical) of nominal regulation, with 2% typical hysteresis and a delay set by CDELAY.
6 CDELAY passive Power good delay set-point input; a capacitor to ground adjusts the PWRGD delay from 200 µs (no capacitor) to 300 ms (0.1 µF).
7 Sense input Voltage sense input on the fixed-output version, providing output voltage feedback to the internal circuitry and improving load regulation.
8 VOUT power_out Regulated output voltage, requires a minimum 1.0 µF output capacitance for stability.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Power Supply Chip
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 2.3 6 V Note 1 5
Input Quiescent Current Iq 120 220 µA IL = 0 mA, VIN = Note 1, VOUT = 0.8V to 5.0V 5
Input Quiescent Current for SHDN Mode ISHDN 0.1 3 µA SHDN = GND 5
Maximum Output Current IOUT 500 mA VIN = 2.3V to 6.0V, VR = 0.8V to 5.0V, Note 1 5
Line Regulation ΔVOUT/(VOUT x ΔVIN) -0.16 0.05 0.16 %/V (Note 1) ≤ VIN ≤ 6V 5
Load Regulation ΔVOUT/VOUT -1 0.5 1 % IOUT = 1 mA to 500 mA, (Note 4) 5
Output Short Circuit Current IOUT_SC 1.2 A RLOAD < 0.1Ω, Peak Current 5
Fixed Output Voltage Tolerance VOUT -2.5 0.5 2.5 % VR = 3.3V nominal; printed VR - 2.5% to VR + 2.5%, typ VR ±0.5%; Note 2 5
Dropout Voltage VIN-VOUT 210 350 mV IOUT = 500 mA, (Note 5) VIN(MIN) = 2.3V 6
PWRGD Input Voltage Operating Range VPWRGD_VIN 1 6 V TA = +25°C 6
PWRGD Input Voltage Operating Range VPWRGD_VIN 1.2 6 V TA = -40°C to +125°C 6
PWRGD Threshold Voltage VPWRGD_TH 89 92 95 %VOUT Falling Edge, VOUT < 2.5V Fixed, VOUT = Adj. 6
PWRGD Threshold Voltage VPWRGD_TH 90 92 94 %VOUT Falling Edge, VOUT >= 2.5V Fixed 6
PWRGD Threshold Hysteresis VPWRGD_HYS 1 2 3 %VOUT 6
PWRGD Output Voltage Low VPWRGD_L 0.2 0.4 V IPWRGD SINK = 1.2 mA, ADJ = 0V, SENSE = 0V 6
PWRGD Time Delay TPG 10 30 55 ms Rising Edge, RPULLUP = 10 kΩ, ICDELAY = 140 nA (Typ), CDELAY = 0.01 µF 6
Shutdown Logic High Input VSHDN-HIGH 45 %VIN VIN = 2.3V to 6.0V 6
Shutdown Logic Low Input VSHDN-LOW 15 %VIN VIN = 2.3V to 6.0V 6
SHDN Input Leakage Current SHDNILK -0.1 0.001 0.1 µA VIN = 6V, SHDN = VIN, SHDN = GND 6
Operating Junction Temperature Range TJ -40 125 °C Steady State 7
Maximum Junction Temperature (transient) TJ 150 °C Transient 7
Storage Temperature Range TA -65 150 °C 7
Absolute Max Junction Temperature TJ 150 °C 5
Absolute Max Storage Temperature -65 150 °C 5
ESD Protection HBM 2 kV all pins, ≥ 2 kV 5
ESD Protection MM 200 V all pins, ≥ 200V 5
Thermal Resistance, 8LD SOIC junction to ambient θJA 163 °C/W 4-Layer JC51-7 Standard Board 7
Thermal Resistance, 8LD SOIC junction to case θJC 38.8 °C/W 4-Layer JC51-7 Standard Board 7
PWRGD Leakage PWRGD_LK 1 nA VPWRGD = VIN = 6.0V 6
PWRGD Time Delay TPG 200 µs CDELAY = OPEN 6
PWRGD Time Delay TPG 300 ms CDELAY = 0.1 µF 6
Detect Threshold to PWRGD Active Time Delay TVDET-PWRGD 200 µs VADJ or VSENSE = VPWRGD_TH + 20 mV to VPWRGD_TH - 20 mV 6
Output Delay From SHDN TOR 100 µs SHDN = GND to VIN, VOUT = GND to 95% VR 7
Output Noise eN 2 µV/√Hz IOUT = 200 mA, f = 1 kHz, COUT = 10 µF (X7R Ceramic), VOUT = 2.5V 7
Power Supply Ripple Rejection Ratio PSRR 60 dB f = 100 Hz, COUT = 10 µF, IOUT = 10 mA, VINAC = 30 mV pk-pk, CIN = 0 µF 7
Thermal Shutdown Temperature TSD 150 °C IOUT = 100 µA, VOUT = 1.8V, VIN = 2.8V 7
Thermal Shutdown Hysteresis ΔTSD 10 °C IOUT = 100 µA, VOUT = 1.8V, VIN = 2.8V 7

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Package Type: MC = Plastic Dual Flat No Lead (DFN) (2x3 Body), 8-lead SN = Plastic Small Outline (150 mil Body), 8-lead 29

CAD (KiCad official)

  • Symbol: MCP1725T-3302E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mcp1725t-3302e-etched.step / mcp1725t-3302e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1725t-3302e.step / mcp1725t-3302e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (32 pp, sha256 280bae2ee8a97ab3, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF