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Contents

README

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MCP1703A-5002E

Microchip Tech · Power Management - Specialized · SOT-223-3

MCP1703A-5002E from Microchip Tech, in a SOT-223-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Unregulated input supply; connect to the input source, which needs low source impedance, and about 1 µF of capacitance ensures stable operation in most applications, with an input operating range of 2.7V to 16.0V.
2 GND power_in Regulator ground, tied to the negative side of the output and input capacitors; only the 2.0 µA typical LDO bias current flows out of this pin, and the tab is internally connected to this pin.
3 VOUT power_out Regulated output voltage that carries the full DC load current and should be connected to the load and the positive terminal of the output capacitor, which is stable with 1.0 µF to 22 µF ceramic capacitance.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-223-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 2.7 16 V Note 1 3
Maximum Output Current (VR ≥ 2.5V) IOUT 250 mA For VR ≥ 2.5V 3
Output Voltage Regulation (2.0% tolerance option, -2) VOUT -2 0.4 2 % Note 2; IOUT = 100 µA 3
Input Quiescent Current Iq 2 5 µA IL = 0 mA 3
Line Regulation ΔVOUT/(VOUT×ΔVIN) -0.3 0.1 0.3 %/V (VOUT(MAX) + VDROPOUT(MAX)) ≤ VIN ≤ 16V, Note 1 3
Load Regulation ΔVOUT/VOUT -2.5 1 2.5 % IL = 1.0 mA to 250 mA for VR ≥ 2.5V; VIN = 3.65V, Note 4 3
Dropout Voltage (VR = 5.0V) VDROPOUT 330 650 mV IL = 250 mA, VR = 5.0V 4
Maximum supply voltage (absolute maximum) VDD 18 V 3
Storage Temperature Range TA -65 150 °C 4
Maximum Junction Temperature TJ 150 °C Transient 4
Operating Junction Temperature Range TJ -40 125 °C Steady State 4
ESD protection (HBM) 4 kV HBM 3
ESD protection (MM) 400 V MM 3
Thermal Resistance, junction to ambient, 3LD SOT-223 θJA 62 °C/W EIA/JEDEC JESD51-7, FR-4 0.063 4-Layer Board 4
Thermal Resistance, junction to case, 3LD SOT-223 θJC 15 °C/W EIA/JEDEC JESD51-7, FR-4 0.063 4-Layer Board 4

CAD (KiCad official)

  • Symbol: MCP1703A-5002E
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223-3 (KiCad packages3D, STEP)
  • 3D model files: mcp1703a-5002e-etched.step / mcp1703a-5002e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1703a-5002e.step / mcp1703a-5002e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (31 pp, sha256 ee4e9c3b0b2c09bb, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF