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MCP1701AT-3002I

Microchip Tech · Power Management - Specialized · SOT-23A-3

MCP1701AT-3002I from Microchip Tech, in a SOT-23A-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Regulator ground; tie to the negative side of the output and input capacitors, and only the 2 µA typical LDO bias current flows out of this pin.
2 VOUT power_out Regulated voltage output that carries the DC load current; the output capacitor's positive terminal should be placed as close as possible to this pin.
3 VIN power_in Unregulated supply input carrying the DC load current plus 2 µA typical bias current; the input capacitor should be located as close as possible to this pin, and the input voltage is specified up to 10 V.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23A-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Output Current (VOUT = 3.0V) IOUTMAX 150 mA VOUT = 3.0V 3
Output Voltage Regulation (relative to VR = 3.0V) VOUT -2 2 % IOUT = 40 mA (Note 1) 3
Load Regulation (VOUT = 3.0V) ΔVOUT/VOUT -3 3 % VOUT = 3.0V, 1 mA ≤ IOUT ≤ 80 mA 3
Dropout Voltage (VR = 3.0V) VIN - VOUT 400 700 mV IOUT = 150 mA, VR = 3.0V 3
Input Quiescent Current IQ 2 4.5 µA VIN = VR + 1.0V 3
Line Regulation ΔVOUT•100/(ΔVIN•VOUT) 0.2 0.3 %/V IOUT = 40 mA, (VR +1) ≤ VIN ≤ 10.0V 3
Input Voltage (operating) VIN 10 V 3
Input Voltage (absolute maximum) VIN 12 V 3
Output Voltage (absolute maximum, relative to GND) VOUT -0.3 V Range (GND - 0.3V) to (VIN + 0.3V); minimum referenced to GND 3
Output Current (peak, absolute maximum) IOUT 500 mA 3
Continuous Power Dissipation (3-Pin SOT-23A) PD 150 mW 3-Pin SOT-23A 3
Specified Temperature Range (I) TA -40 85 °C 4
Storage Temperature Range TA -40 125 °C 4
Thermal Resistance, junction-to-ambient, 3L-SOT-23A θJA 335 °C/W Minimum trace width single layer application 4
Thermal Resistance, junction-to-ambient, 3L-SOT-23A θJA 230 °C/W Typical FR4, 4-layer application 4

CAD (KiCad official)

  • Symbol: MCP1701AT-3002I
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23A-3 (KiCad packages3D, STEP)
  • 3D model files: mcp1701at-3002i-etched.step / mcp1701at-3002i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1701at-3002i.step / mcp1701at-3002i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (22 pp, sha256 6d053cb4d8e5ca07, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF