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Ray Publish 0.1.0 3e1a84d 17d ago

MCP1700T-1802E

MSKSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23

MCP1700T-1802E from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection; the input and output capacitor ground connections must be returned to this pin using short, wide copper traces.
2 VOUT power_out Regulated voltage output; an output capacitor of 1uF to 22uF with ESR above 1mΩ should be placed close to the VOUT and GND pins, and the device limits output current to 600mA typical under short-circuit.
3 VIN power_in Power input with an operating range of 1.2V to 5.5V (absolute maximum VIN to GND is -0.3V to 7V); a 1uF or larger input capacitor should be placed close to the VIN and GND pins.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 1.2 5.5 V 7
Output voltage accuracy -2 2 % ILOAD =0.1mA 7
Output current limit ILIM 301 600 mA VOUT = 0V 7
VIN to GND (absolute maximum) VIN -0.3 7 V 6
VOUT, EN to GND (absolute maximum) VOUT, EN -0.3 6 V 6
VOUT to VIN (absolute maximum) VOUT-VIN -6 0.3 V 6
Junction temperature (absolute maximum) 150 °C 6
Storage temperature range -60 150 °C 6
Lead soldering temperature 260 °C Soldering, 10 sec. 6
ESD HBM 2 KV 6
ESD MM 200 V 6
ESD CDM 2 KV 6
Recommended input voltage VIN 1.2 5.5 V 6
Application junction temperature range -40 125 °C 6
Application ambient temperature range -40 85 °C 6
Junction-to-ambient thermal resistance θJA 250 °C/W TA = 25°C, EVB board (Note 2) 6

CAD (KiCad official)

  • Symbol: MCP1700T-1802E
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mcp1700t-1802e-etched.step / mcp1700t-1802e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1700t-1802e.step / mcp1700t-1802e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (13 pp, sha256 5eab501db03ec28d, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF