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Contents

README

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MCP1700T-1502E

MSKSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23

MCP1700T-1502E from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; the datasheet's pin table lists it only as the ground connection, and the input and output capacitor grounds must return to this pin with short, wide copper.
2 VOUT power_out Regulated output; VOUT to GND is rated -0.3 V to 6 V (absolute maximum), and output current is limited to 600 mA typical, with a 1 uF to 22 uF output capacitor (ESR above 1 mΩ) placed close to VOUT and GND.
3 VIN power_in Power input; the input voltage range is 1.2 V to 5.5 V, VIN to GND is rated -0.3 V to 7 V (absolute maximum), and an input capacitor of 1 uF or larger should be placed close to VIN and GND.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy -2 2 % ILOAD = 0.1mA 7
Input voltage VIN 1.2 5.5 V 7
Over-temperature shutdown temperature TSD 155 °C ILOAD = 10mA 7
Over-temperature shutdown hysteresis ΔTSD 15 °C 7
Discharge resistance RDC 30 Ω EN = 0V, VOUT = 0.1V 7
Input voltage (recommended) VIN 1.2 5.5 V 6
Application junction temperature range -40 125 °C 6
Application ambient temperature range -40 85 °C 6
VIN to GND -0.3 7 V 6
VOUT, EN to GND -0.3 6 V 6
VOUT to VIN -6 0.3 V 6
Junction temperature 150 °C 6
Storage temperature range -60 150 °C 6
Soldering temperature 260 °C 10 sec 6
ESD HBM HBM 2 KV 6
ESD MM MM 200 V 6
ESD CDM CDM 2 KV 6
Package thermal resistance junction-to-ambient θJA 250 °C/W TA = 25°C, EVB board 6

CAD (KiCad official)

  • Symbol: MCP1700T-1502E
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mcp1700t-1502e-etched.step / mcp1700t-1502e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1700t-1502e.step / mcp1700t-1502e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (13 pp, sha256 5eab501db03ec28d, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF