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Ray Publish 0.1.0 710f705 8d ago

MCP1259T-E

Microchip Tech · DC-DC Converters · MSOP-10

MCP1259T-E from Microchip Tech, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LBO output Low-battery indication open-drain output that is asserted low when VIN falls below the low-battery threshold, remains low until VIN exceeds the threshold plus hysteresis, and is high impedance when SHDN or BYPASS is low.
2 BYPASS input Active-low BYPASS mode input; a logic low connects the input supply VIN directly to VOUT, with the rest of the device shut down.
3 C2- passive Flying capacitor negative terminal; a 1 µF ceramic flying capacitor is recommended.
4 C1+ passive Flying capacitor positive terminal; a 1 µF ceramic flying capacitor is recommended.
5 VOUT power_out Regulated 3.3 V output, which should be bypassed to GND with a minimum of 2.2 µF.
6 C2+ passive Flying capacitor positive terminal; a 1 µF ceramic flying capacitor is recommended.
7 VIN power_in Power supply input, recommended at 1.8 V to 3.6 V, to be bypassed to GND with a minimum of 1 µF.
8 C1- passive Flying capacitor negative terminal; a 1 µF ceramic flying capacitor is recommended.
9 GND power_in 0 V reference, to be connected to the negative terminal of the input supply.
10 SHDN input Active-low shutdown input; a logic low disables the device and a logic high allows normal operation.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package MSOP-10
Category Power Management ICs
Pins 10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VIN 1.8 3.6 V 3
Output Voltage Accuracy VOUT -3 0.5 3 % IOUT = 10 mA to IOUT(MAX) 3
Output Current IOUT(MAX) 30 mA 1.8V < VIN < 2.0V 3
Output Current IOUT(MAX) 70 mA 2.0V < VIN < 2.2V 3
Output Current IOUT(MAX) 100 mA 2.2V < VIN < 3.6V 3
SHDN Input Voltage Low VIL(SHDN) 0.4 V 3
SHDN Input Voltage High VIH(SHDN) 1.4 V 3
SHDN Input Leakage Current ILK(SHDN) 0.001 0.1 µA 3
SHDN Quiescent Current IQ 0.25 2 µA VSHDN = 0V, TJ = +25°C 3
BYPASS Input Voltage Low VIL(BYPASS) 0.4 V 4
BYPASS Input Voltage High VIH(BYPASS) 1.4 V 4
BYPASS Input Leakage Current ILK(BYPASS) 0.001 0.1 µA 4
BYPASS Quiescent Current IQ 0.25 2 µA VBYPASS = 0V, IOUT = 0 mA, TJ = +25°C 4
LBO Output Low Voltage VOL 25 100 mV ISINK = 0.5 mA, VIN = 1.8V 4
LBO Input Leakage Current ILK(LBO) 0.02 1 µA VLBO = VIN 4
Voltage on Any Pin w.r.t. GND -0.3 V Upper limit printed as VIN+0.3V (not a fixed number) 3
Storage Temperature Range TS -65 150 °C 3
Ambient Temperature with Power Applied TA -55 125 °C 3
Maximum Junction Temperature TJ 150 °C 3
ESD Human Body Model 2 kV 1.5 kΩ in series with 100 pF 3
ESD Machine Model 200 V 200 pF, no series resistance 3
Specified Temperature Range TJ -40 125 °C 5
Operating Temperature Range TJ -40 125 °C 5
Thermal Resistance, 10-Lead MSOP JA 200 °C/W 4-Layer JC51-7 Standard Board, Natural Convection 5

CAD (KiCad official)

  • Symbol: MCP1259T-E
  • Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
  • 3D model: MSOP-10 (KiCad packages3D, STEP)
  • 3D model files: mcp1259t-e-etched.step / mcp1259t-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1259t-e.step / mcp1259t-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (24 pp, sha256 3a0b2d1cabc1160d, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF