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MC9S08QD4CSCR

Public Made by Adom

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NXP Semicon Pre-ordered MCUs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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PCB Footprint

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Datasheet

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Contents

README

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MC9S08QD4CSCR

NXP Semicon · Pre-ordered MCUs · SOIC-8

MC9S08QD4CSCR from NXP Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PTA5/TPM2CH0I/IRQ/RESET input Input-only port pin shared with TPM2 input capture, IRQ and RESET (RESET enabled by RSTPE with internal pullup); it has no clamp diode to VDD and must not be driven above VDD.
2 PTA4/TPM2CH0O/BKGD/MS bidirectional Output-only port pin shared with TPM2 output compare and the BKGD/MS background debug and mode-select pin, which defaults to BKGD/MS after any reset with an internal pullup.
3 VDD power_in Primary positive supply for I/O buffers, the ADC and the internal voltage regulator, with operating voltage 2.7 to 5.5 V and a 0.1 uF bypass capacitor placed close to the pin.
4 VSS power_in Ground supply pin for the MCU, also serving as the ADC analog ground and low reference.
5 PTA3/KBI1P3/TCLK2/ADC1P3 bidirectional General-purpose I/O pin shared with keyboard interrupt KBI1P3, TPM2 external clock input TCLK2 and ADC input channel ADC1P3.
6 PTA2/KBI1P2/TCLK1/ADC1P2 bidirectional General-purpose I/O pin shared with keyboard interrupt KBI1P2, TPM1 external clock input TCLK1 and ADC input channel ADC1P2.
7 PTA1/KBI1P1/TPM1CH1/ADC1P1 bidirectional General-purpose I/O pin shared with keyboard interrupt KBI1P1, TPM1 channel 1 and ADC input channel ADC1P1.
8 PTA0/KBI1P0/TPM1CH0/ADC1P0 bidirectional General-purpose I/O pin shared with keyboard interrupt KBI1P0, TPM1 channel 0 and ADC input channel ADC1P0.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package SOIC-8
Category Embedded Processors & Controllers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD -0.3 5.8 V 173
Maximum current into VDD IDD 120 mA 173
Digital input voltage VIn -0.3 V max printed as VDD + 0.3 V 173
Instantaneous maximum current single pin ID -25 25 mA applies to all port pins 173
Storage temperature range Tstg -55 150 °C 173
Supply voltage (run, wait, stop) VDD 2.7 5.5 V 176
Operating temperature range (packaged) TA -40 125 °C TL to TH, as printed in Table A-2 174
Maximum junction temperature TJMax 135 °C 174
Thermal resistance, single-layer board, 8-pin NB SOIC θJA 150 °C/W single-layer board 174
Thermal resistance, four-layer board, 8-pin NB SOIC θJA 87 °C/W four-layer board 174
POR re-arm voltage VPOR 0.9 1.4 2 V 176
Low-voltage detection threshold high range, VDD falling VLVDH 4.2 4.3 4.4 V Consumer and Industrial, VDD falling 176
Low-voltage detection threshold high range, VDD rising VLVDH 4.3 4.4 4.5 V Consumer and Industrial, VDD rising 176
Low-voltage detection threshold low range, VDD falling VLVDL 2.48 2.56 2.64 V VDD falling 176
Low-voltage detection threshold low range, VDD rising VLVDL 2.54 2.62 2.7 V VDD rising 176
Low-voltage warning threshold high range, VDD falling VLVWH 4.2 4.3 4.4 V Consumer and Industrial, VDD falling 176
Low-voltage warning threshold high range, VDD rising VLVWH 4.3 4.4 4.5 V Consumer and Industrial, VDD rising 176
Low-voltage warning threshold low range, VDD falling VLVWL 2.48 2.56 2.64 V VDD falling 176
Low-voltage warning threshold low range, VDD rising VLVWL 2.54 2.62 2.7 V VDD rising 176
Bandgap voltage reference VBG 1.19 1.2 1.21 V Consumer and Industrial, factory trimmed at VDD = 3.0V, Temp = 25°C 176
Input leakage current (per pin) /IIn/ 0.025 1 μA VIn = VDD or VSS, all input only pins 176
High impedance leakage current (per pin) /IOZ/ 0.025 1 μA VIn = VDD or VSS, all input/output 177
Internal pullup resistors RPU 17.5 52.5 kΩ VIn = VSS for pullup 177
Internal pulldown resistor (IRQ) RPD 17.5 52.5 kΩ VIn = VDD for pulldown 177
Maximum total IOH for all port pins, 5V /IOHT/ 100 mA 5V 177
Maximum total IOH for all port pins, 3V /IOHT/ 60 mA 3V 177
Maximum total IOL for all port pins, 5V IOLT 100 mA 5V 177
Maximum total IOL for all port pins, 3V IOLT 60 mA 3V 177
Input capacitance (all non-supply pins) CIn 7 pF 177
Human body model ESD VHBM 2000 V printed ± 2000 175
Machine model ESD VMM 200 V printed ± 200 175
Charge device model ESD VCDM 500 V printed ± 500 175
Latch-up current ILAT 100 mA TA = 85°C, printed ± 100 175
Run supply current, CPU 2 MHz, fBus 1 MHz, 5 V RIDD 0.95 1.54 mA VDD = 5 V 182
Run supply current, CPU 2 MHz, fBus 1 MHz, 3 V RIDD 0.9 1.5 mA VDD = 3 V 182
Wait mode supply current, 5 V WIDD 1.55 2.2 mA CPU 16 MHz, fBus 8 MHz, VDD = 5 V 182
Wait mode supply current, 3 V WIDD 1.5 2.2 mA CPU 16 MHz, fBus 8 MHz, VDD = 3 V 182
Stop2 mode supply current, 5 V S2IDD 20 μA VDD = 5 V, -40 to 125°C 182
Stop2 mode supply current, 3 V S2IDD 0.8 7 μA VDD = 3 V, -40 to 85°C 182
Stop2 mode supply current, 3 V S2IDD 15 μA VDD = 3 V, -40 to 125°C 182
Stop3 mode supply current, 5 V S3IDD 0.9 8 μA VDD = 5 V, -40 to 85°C 182
Stop3 mode supply current, 5 V S3IDD 25 μA VDD = 5 V, -40 to 125°C 182
Stop3 mode supply current, 3 V S3IDD 20 μA VDD = 3 V, -40 to 125°C 182
Average internal reference frequency - untrimmed fint_ut 25 31.25 41.66 kHz 184
DCO output frequency range - untrimmed fdco_ut 12.8 16 21.33 MHz 184
Resolution of trimmed DCO output frequency Δfdco_res_t -0.2 0.2 %fdco fixed voltage and temperature, Consumer and Industrial 184
Total deviation of trimmed DCO output frequency Δfdco_t -2 2 %fdco over voltage and temperature, Consumer and Industrial 184
Long term jitter of DCO output clock CJitter 0.6 %fdco averaged over 2 ms interval 184
Bus frequency fBus 1 8 MHz 186
Real-time interrupt internal oscillator period tRTI 700 1300 μs 186
External reset pulse width textrst 100 ns 186
IRQ pulse width, asynchronous path tILIH, tIHIL 100 ns Asynchronous path 186
Port rise and fall time, slew rate control disabled tRise, tFall 3 ns load = 50 pF, PTxSE = 0 186
Port rise and fall time, slew rate control enabled tRise, tFall 30 ns load = 50 pF, PTxSE = 1 186
BKGD/MS setup time after background debug force reset tMSSU 500 ns 186
BKGD/MS hold time after background debug force reset tMSH 100 μs 186
ADC reference voltage high VREFH 2.7 V typ and max printed as VDDAD 188
ADC conversion clock, high speed fADCK 0.4 8 MHz ADLPC = 0 188
Total unadjusted error, 10 bit mode ETUE 1.5 3.5 LSB 10 bit mode, includes quantization; typ and max printed as ± 188
Supply voltage for program/erase Vprog/erase 2.7 5.5 V -40°C to 125°C 189
Program/erase endurance 10000 cycles TL to TH = -40°C to +125°C 189

CAD (KiCad official)

  • Symbol: MC9S08QD4CSCR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mc9s08qd4cscr-etched.step / mc9s08qd4cscr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc9s08qd4cscr.step / mc9s08qd4cscr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (198 pp, sha256 d3d89f4472a1a97e, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF