component
MC78M08CDTRKG
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, DPAK-3. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownMC78M08CDTRKG
onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · DPAK-3
MC78M08CDTRKG from onsemi, in a DPAK-3. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Unregulated positive input voltage. For the 8 V (M08) variant, VI operates from 10.5 V to 25 V (absolute maximum 35 V). A ≥0.33 µF bypass capacitor to ground is recommended when the device is located far from the supply filter capacitor. |
| 2 | GND | power_in | Common ground return for input and output. In the DPAK (DT/Case 369C) package this pin is electrically connected to the exposed heatsink tab (terminal 4), so the tab is also at ground potential. |
| 3 | VOUT | power_out | Regulated +8.0 V output, up to 500 mA (700 mA peak) with adequate heatsinking. Output tolerance is ±4% (MC78M08C) / ±2% (MC78M08AC). A ≥0.1 µF output capacitor is recommended to improve transient response. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | DPAK-3 |
| Category | PMIC |
| Pins | 3 |
Ordering variants
Same part, different packaging or reel option.
MC78M08CDTRKGMC78M08CDTRKGTG
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (TJ = 25C) | VO | 7.7 | 8 | 8.3 | Vdc | TJ = 25C, VI = 14 V, IO = 350 mA (MC78M08B/MC78M08C/NCV78M08B row) | 3 |
| Output Voltage Variation | VO | 7.6 | 8.4 | Vdc | 10.5 Vdc ≤ VI ≤ 23 Vdc, 5.0 mA ≤ IO ≤ 350 mA (MC78M08B/MC78M08C/NCV78M08B row) | 3 | |
| Line Regulation | Regline | 6 | 50 | mV | TJ = 25C, 10.5 Vdc ≤ VI ≤ 25 Vdc, IO = 200 mA | 3 | |
| Load Regulation | Regload | 160 | mV | TJ = 25C, 5.0 mA ≤ IO ≤ 500 mA | 3 | ||
| Load Regulation | Regload | 80 | mV | TJ = 25C, 5.0 mA ≤ IO ≤ 200 mA | 3 | ||
| Input Bias Current | IIB | 3.2 | 6 | mA | TJ = 25C | 3 | |
| Quiescent Current Change | IIB | 0.8 | mA | 10.5 Vdc ≤ VI ≤ 25 Vdc, IO = 200 mA | 3 | ||
| Quiescent Current Change | IIB | 0.5 | mA | 5.0 mA ≤ IO ≤ 350 mA | 3 | ||
| Output Noise Voltage | Vn | 52 | V | TA = 25C, 10 Hz ≤ f ≤ 100 kHz | 3 | ||
| Ripple Rejection | RR | 56 | dB | IO = 100 mA, f = 120 Hz, 11.5 V ≤ VI ≤ 21.5 V | 3 | ||
| Ripple Rejection | RR | 56 | 80 | dB | IO = 300 mA, f = 120 Hz, 11.5 V ≤ VI ≤ 21.5 V, TJ = 25C | 3 | |
| Dropout Voltage | VI−VO | 2 | Vdc | TJ = 25C | 3 | ||
| Short Circuit Current Limit | IOS | 350 | mA | TJ = 25C, VI = 35 V | 3 | ||
| Average Temperature Coefficient of Output Voltage | VO/T | 0.2 | mV/C | IO = 5.0 mA | 3 | ||
| Peak Output Current | IO | 700 | mA | TJ = 25C | 3 | ||
| Input Voltage (5.0 V−18 V output options) | VI | 35 | Vdc | Maximum Ratings, TA = 25C; applies to the 5.0 V−18 V output options (includes 8.0 V) | 2 | ||
| Operating Junction Temperature Range | TJ | 150 | C | Maximum Ratings | 2 | ||
| Storage Temperature Range | Tstg | -65 | 150 | C | Maximum Ratings | 2 | |
| Junction Temperature Range (C grade, Tlow to Thigh) | TJ | 0 | 125 | C | Ordering information for MC78M08CDTRKG, TJ = 0 to +125C | 11 | |
| Thermal Resistance, Junction-to-Air (DT suffix, DPAK-3) | θJA | 92 | C/W | Plastic Package, DT Suffix, TA = 25C | 2 | ||
| Thermal Resistance, Junction-to-Case (DT suffix, DPAK-3) | θJC | 5 | C/W | Plastic Package, DT Suffix | 2 |
CAD (KiCad official)
- Symbol:
MC78M08CDTRKG - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: DPAK-3 (KiCad packages3D, STEP)
- 3D model files:
mc78m08cdtrkg-etched.step/mc78m08cdtrkg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc78m08cdtrkg.step/mc78m08cdtrkg.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
mc78m08cdtrkg.step |
119 KB | You want the bare part, or you mark your own boards. |
mc78m08cdtrkg-etched.step |
2.2 MB | You want the part with MC78M08CDTRKG already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 560 faces against 83 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (15 pp, sha256
4ae6cd4978cb4cd9, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).