MC78L12ABDR2G
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
MC78L12ABDR2G
onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOIC-8
MC78L12ABDR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated +12 V output, 100 mA capability (min 11.4 V, typ 12.0 V, max 12.6 V). Recommended 0.1 µF ceramic capacitor to GND for transient response. |
| 2 | GND | power_in | Ground return. On this internally-modified SO-8 package, pins 2, 3, 6, 7 are electrically common to the die-attach flag for improved thermal dissipation. |
| 3 | GND | power_in | Ground return. Electrically common with pins 2, 6, 7 and die-attach flag for thermal enhancement. |
| 4 | NC | unconnected | No internal connection. Leave floating or tie to GND per board layout preference. |
| 5 | NC | unconnected | No internal connection. Leave floating or tie to GND per board layout preference. |
| 6 | GND | power_in | Ground return. Electrically common with pins 2, 3, 7 and die-attach flag for thermal enhancement. |
| 7 | GND | power_in | Ground return. Electrically common with pins 2, 3, 6 and die-attach flag for thermal enhancement. |
| 8 | VIN | power_in | Unregulated positive supply input. Operating range typically 14.5-27 V for the 12 V variant; absolute maximum 35 V. Requires 0.33 µF input capacitor if placed appreciable distance from supply filter. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | PMIC |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
MC78L12ABDR2GMC78L12ACDR2GMC78L12ABPGMC78L12ACPG
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (TJ = +25°C) | VO | 11.5 | 12 | 12.5 | Vdc | TJ = +25°C | 4 |
| Output Voltage (14.5 Vdc ≤ VI ≤ 27 Vdc, 1.0 mA ≤ IO ≤ 40 mA) | VO | 11.4 | 12.6 | Vdc | 14.5 Vdc ≤ VI ≤ 27 Vdc, 1.0 mA ≤ IO ≤ 40 mA | 4 | |
| Output Voltage (VI = 19 V, 1.0 mA ≤ IO ≤ 70 mA) | VO | 11.4 | 12.6 | Vdc | VI = 19 V, 1.0 mA ≤ IO ≤ 70 mA | 4 | |
| Line Regulation (14.5 Vdc ≤ VI ≤ 27 Vdc) | Regline | 120 | 250 | mV | TJ = +25°C, IO = 40 mA, 14.5 Vdc ≤ VI ≤ 27 Vdc | 4 | |
| Line Regulation (16 Vdc ≤ VI ≤ 27 Vdc) | Regline | 100 | 200 | mV | TJ = +25°C, IO = 40 mA, 16 Vdc ≤ VI ≤ 27 Vdc | 4 | |
| Load Regulation (1.0 mA ≤ IO ≤ 100 mA) | Regload | 20 | 100 | mV | TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA | 4 | |
| Load Regulation (1.0 mA ≤ IO ≤ 40 mA) | Regload | 10 | 50 | mV | TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA | 4 | |
| Input Bias Current (TJ = +25°C) | IIB | 4.2 | 6.5 | mA | TJ = +25°C | 4 | |
| Input Bias Current (TJ = +125°C) | IIB | 6 | mA | TJ = +125°C | 4 | ||
| Input Bias Current Change (16 Vdc ≤ VI ≤ 27 Vdc) | IIB | 1.5 | mA | 16 Vdc ≤ VI ≤ 27 Vdc | 4 | ||
| Input Bias Current Change (1.0 mA ≤ IO ≤ 40 mA) | IIB | 0.1 | mA | 1.0 mA ≤ IO ≤ 40 mA | 4 | ||
| Ripple Rejection | RR | 37 | 42 | dB | IO = 40 mA, f = 120 Hz, 15 V ≤ VI ≤ 25 V, TJ = +25°C | 4 | |
| Operating Junction Temperature (MC78LXXAB) | TJ | -40 | 125 | °C | MC78LXXAB, −40°C < TJ < +125°C | 4 | |
| Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) | Vn | 80 | V | TA = +25°C, 10 Hz ≤ f ≤ 100 kHz | 4 | ||
| Dropout Voltage (TJ = +25°C) | VI − VO | 1.7 | Vdc | TJ = +25°C | 4 | ||
| Input Voltage (12 V−18 V output devices) | VI | 35 | Vdc | Input Voltage (12 V−18 V) row | 2 | ||
| Storage Temperature Range | Tstg | -65 | 150 | °C | 2 | ||
| Maximum Junction Temperature | TJ | 150 | °C | 2 | |||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | Note 1, AEC-Q100-002 | 2 | ||
| ESD Capability, Machine Model | ESDMM | 200 | V | Note 1, AEC-Q100-003 | 2 | ||
| ESD Capability, Charged Device Model | ESDCDM | 2000 | V | Note 1, EIA/JESD22-C101 | 2 |
CAD (KiCad official)
- Symbol:
MC78L12ABDR2G - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
mc78l12abdr2g-etched.step/mc78l12abdr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc78l12abdr2g.step/mc78l12abdr2g.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
mc78l12abdr2g.step |
122 KB | You want the bare part, or you mark your own boards. |
mc78l12abdr2g-etched.step |
2.5 MB | You want the part with MC78L12ABDR2G already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 625 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (19 pp, sha256
6ff9a93de09c52e0, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).