Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

MC74VHCT126ADR2G

onsemi · Logic ICs · SOIC-14

MC74VHCT126ADR2G from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE1 input Active-high output enable for buffer 1; when driven Low, output Y1 is placed in high impedance.
2 A1 input Data input of buffer 1, TTL-compatible (VIL max 0.8 V, VIH min 2.0 V at 4.5 to 5.5 V) and tolerant of voltages up to 7.0 V.
3 Y1 tri_state Three-state output of buffer 1, high impedance when OE1 is Low.
4 OE2 input Active-high output enable for buffer 2; when driven Low, output Y2 is placed in high impedance.
5 A2 input Data input of buffer 2, TTL-compatible (VIL max 0.8 V, VIH min 2.0 V at 4.5 to 5.5 V) and tolerant of voltages up to 7.0 V.
6 Y2 tri_state Three-state output of buffer 2, high impedance when OE2 is Low.
7 GND power_in Ground reference pin for the device.
8 Y3 tri_state Three-state output of buffer 3, high impedance when OE3 is Low.
9 A3 input Data input of buffer 3, TTL-compatible (VIL max 0.8 V, VIH min 2.0 V at 4.5 to 5.5 V) and tolerant of voltages up to 7.0 V.
10 OE3 input Active-high output enable for buffer 3; when driven Low, output Y3 is placed in high impedance.
11 Y4 tri_state Three-state output of buffer 4, high impedance when OE4 is Low.
12 A4 input Data input of buffer 4, TTL-compatible (VIL max 0.8 V, VIH min 2.0 V at 4.5 to 5.5 V) and tolerant of voltages up to 7.0 V.
13 OE4 input Active-high output enable for buffer 4; when driven Low, output Y4 is placed in high impedance.
14 VCC power_in Positive supply; recommended DC supply 4.5 V to 5.5 V within the 2.0 V to 5.5 V operating range.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Logic ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage VCC 4.5 5.5 V 2
DC Input Voltage Vin 0 5.5 V 2
DC Output Voltage, output in 3-State Vout 0 5.5 V Output in 3-State 2
DC Output Voltage, output high or low state Vout 0 V Output in High or Low State; max = VCC 2
Operating Temperature TA -40 85 °C 2
Input Rise and Fall Time tr, tf 0 20 ns/V VCC = 5.0 V ±0.5 V 2
DC Supply Voltage VCC -0.5 7 V 2
DC Input Voltage Vin -0.5 7 V 2
DC Output Voltage, output in 3-State Vout -0.5 7 V Output in 3-State 2
DC Output Voltage, output high or low state Vout -0.5 V Output in High or Low State; max = VCC + 0.5 2
Input Diode Current IIK -20 mA 2
Output Diode Current IOK -20 20 mA VOUT < GND; VOUT > VCC 2
DC Output Current, per pin Iout -25 25 mA 2
DC Supply Current, VCC and GND Pins ICC -75 75 mA 2
Power Dissipation in Still Air, SOIC Packages PD 500 mW SOIC package, still air 2
Storage Temperature Tstg -65 150 °C 2
Minimum High-Level Input Voltage VIH 1.2 V VCC = 3.0 V; TA = 25°C 3
Minimum High-Level Input Voltage VIH 2 V VCC = 4.5 V; TA = 25°C 3
Maximum Low-Level Input Voltage VIL 0.53 V VCC = 3.0 V; TA = 25°C 3
Maximum Low-Level Input Voltage VIL 0.8 V VCC = 4.5 V; TA = 25°C 3
Minimum High-Level Output Voltage VOH 2.9 V VIN = VIH or VIL; IOH = −50 µA; VCC = 3.0 V; TA = 25°C 3
Minimum High-Level Output Voltage VOH 4.4 V VIN = VIH or VIL; IOH = −50 µA; VCC = 4.5 V; TA = 25°C 3
Minimum High-Level Output Voltage VOH 2.58 V VIN = VIH or VIL; IOH = −4.0 mA; VCC = 3.0 V; TA = 25°C 3
Minimum High-Level Output Voltage VOH 2.34 V VIN = VIH or VIL; IOH = −4.0 mA; VCC = 3.0 V; TA = 125°C 3
Minimum High-Level Output Voltage VOH 3.94 V VIN = VIH or VIL; IOH = −8.0 mA; VCC = 4.5 V; TA = 25°C 3
Minimum High-Level Output Voltage VOH 3.66 V VIN = VIH or VIL; IOH = −8.0 mA; VCC = 4.5 V; TA = 125°C 3
Maximum Low-Level Output Voltage VOL 0.1 V VIN = VIH or VIL; IOL = 50 µA; VCC = 3.0 V; TA = 25°C 3
Maximum Low-Level Output Voltage VOL 0.36 V VIN = VIH or VIL; IOL = 4.0 mA; VCC = 3.0 V; TA = 25°C 3
Maximum Low-Level Output Voltage VOL 0.52 V VIN = VIH or VIL; IOL = 4.0 mA; VCC = 3.0 V; TA = 125°C 3
Maximum Input Leakage Current IIN -0.1 0.1 µA VIN = 5.5 V or GND; VCC = 0 to 5.5 V; TA = 25°C 3
Maximum Input Leakage Current IIN -1 1 µA VIN = 5.5 V or GND; VCC = 0 to 5.5 V; TA = 125°C 3
Maximum Quiescent Supply Current ICC 2 µA VIN = VCC or GND; VCC = 5.5 V; TA = 25°C 3
Maximum Quiescent Supply Current ICC 40 µA VIN = VCC or GND; VCC = 5.5 V; TA = 125°C 3
Quiescent Supply Current ICCT 1.35 mA Input VIN = 3.4 V; VCC = 5.5 V; TA = 25°C 3
Quiescent Supply Current ICCT 1.65 mA Input VIN = 3.4 V; VCC = 5.5 V; TA = 125°C 3
Maximum 3-State Leakage Current IOZ -2.5 2.5 µA VIN = VIH or VIL; VOUT = VCC or GND; VCC = 5.5 V; TA = 125°C 3
Output Leakage Current IOPD 0.5 µA VOUT = 5.5 V; VCC = 0.0 V; TA = 25°C 3
Output Leakage Current IOPD 10 µA VOUT = 5.5 V; VCC = 0.0 V; TA = 125°C 3
Maximum Propagation Delay, A to Y tPLH, tPHL 5.5 7.5 ns VCC = 5.0 ± 0.5 V; CL = 50 pF; TA = 25°C 3
Maximum Propagation Delay, A to Y tPLH, tPHL 10.5 ns VCC = 5.0 ± 0.5 V; CL = 50 pF; TA ≤ 125°C 3
Quiet Output Maximum Dynamic VOL VOLP 0.3 0.8 V Input tr = tf = 3.0 ns; CL = 50 pF; VCC = 5.0 V; TA = 25°C 4
Quiet Output Minimum Dynamic VOL VOLV -0.3 -0.8 V Input tr = tf = 3.0 ns; CL = 50 pF; VCC = 5.0 V; TA = 25°C 4
Minimum High Level Dynamic Input Voltage VIHD 3.5 V Input tr = tf = 3.0 ns; CL = 50 pF; VCC = 5.0 V; TA = 25°C 4
Maximum Low Level Dynamic Input Voltage VILD 1.5 V Input tr = tf = 3.0 ns; CL = 50 pF; VCC = 5.0 V; TA = 25°C 4

CAD (KiCad official)

  • Symbol: MC74VHCT126ADR2G
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mc74vhct126adr2g-etched.step / mc74vhct126adr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74vhct126adr2g.step / mc74vhct126adr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 05111954ed25f5a7, retrieved 2026-10-18, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF