component
MC74VHC245DTR2G
Public Made by Adomby adom
onsemi Buffers / Drivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMC74VHC245DTR2G
onsemi · Buffers / Drivers · TSSOP-20
MC74VHC245DTR2G from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DIR | input | Direction control input: a low level transmits data from bus B to bus A and a high level transmits data from bus A to bus B, and inputs must stay within GND to VCC. |
| 2 | A1 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 3 | A2 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 4 | A3 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 5 | A4 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 6 | A5 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 7 | A6 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 8 | A7 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 9 | A8 | bidirectional | Bus A data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 10 | GND | power_in | Ground reference; inputs and outputs are constrained to the range GND to VCC for proper operation. |
| 11 | B8 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 12 | B7 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 13 | B6 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 14 | B5 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 15 | B4 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 16 | B3 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 17 | B2 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 18 | B1 | bidirectional | Bus B data port, which transmits or receives depending on DIR and goes to high impedance when OE is high. |
| 19 | OE | input | Output enable input: a high level isolates both buses in the high-impedance state, and unused inputs must be tied to GND or VCC. |
| 20 | VCC | power_in | Positive supply pin; the device is designed for the 2.0 V to 5.5 V operating range. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-20 |
| Category | Logic ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage | VCC | 2 | 5.5 | V | 3 | ||
| DC Input Voltage | Vin | 0 | 5.5 | V | 3 | ||
| DC Output Voltage | Vout | 0 | V | max = VCC | 3 | ||
| Operating Temperature | TA | -40 | 85 | °C | 3 | ||
| Input Rise and Fall Time | tr, tf | 0 | 100 | ns/V | VCC = 3.3V ±0.3V | 3 | |
| Input Rise and Fall Time | tr, tf | 0 | 20 | ns/V | VCC = 5.0V ±0.5V | 3 | |
| DC Supply Voltage (abs max) | VCC | -0.5 | 7 | V | 3 | ||
| DC Input Voltage (abs max) | Vin | -0.5 | 7 | V | 3 | ||
| DC Output Voltage (abs max) | Vout | -0.5 | V | max = VCC + 0.5 | 3 | ||
| Input Diode Current | IIK | -20 | mA | 3 | |||
| Output Diode Current | IOK | -20 | 20 | mA | 3 | ||
| DC Output Current, per Pin | Iout | -25 | 25 | mA | 3 | ||
| DC Supply Current, VCC and GND Pins | ICC | -75 | 75 | mA | 3 | ||
| Power Dissipation in Still Air, TSSOP | PD | 450 | mW | TSSOP Package; derate -6.1 mW/C from 65 to 125C | 3 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 3 | ||
| Minimum High-Level Input Voltage | VIH | 1.5 | V | VCC = 2.0 V, TA = 25°C and -40 to 85°C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.5 | V | VCC = 2.0 V, TA = 25°C and -40 to 85°C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 1.9 | 2 | V | Vin = VIH or VIL, IOH = -50μA, VCC = 2.0 V, TA = 25°C | 3 | |
| Minimum High-Level Output Voltage | VOH | 2.9 | 3 | V | Vin = VIH or VIL, IOH = -50μA, VCC = 3.0 V, TA = 25°C | 3 | |
| Minimum High-Level Output Voltage | VOH | 4.4 | 4.5 | V | Vin = VIH or VIL, IOH = -50μA, VCC = 4.5 V, TA = 25°C | 3 | |
| Minimum High-Level Output Voltage | VOH | 2.58 | V | Vin = VIH or VIL, IOH = -4mA, VCC = 3.0 V, TA = 25°C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 3.94 | V | Vin = VIH or VIL, IOH = -8mA, VCC = 4.5 V, TA = 25°C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 2.48 | V | Vin = VIH or VIL, IOH = -4mA, VCC = 3.0 V, TA = -40 to 85°C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 3.8 | V | Vin = VIH or VIL, IOH = -8mA, VCC = 4.5 V, TA = -40 to 85°C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0 | 0.1 | V | Vin = VIH or VIL, IOL = 50μA, VCC = 2.0/3.0/4.5 V, TA = 25°C | 3 | |
| Maximum Low-Level Output Voltage | VOL | 0.36 | V | Vin = VIH or VIL, IOL = 4mA (3.0 V) / 8mA (4.5 V), TA = 25°C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.44 | V | Vin = VIH or VIL, IOL = 4mA (3.0 V) / 8mA (4.5 V), TA = -40 to 85°C | 3 | ||
| Maximum Input Leakage Current | Iin | -0.1 | 0.1 | μA | Vin = 5.5 V or GND (DIR, OE), VCC = 0 to 5.5 V, TA = 25°C | 3 | |
| Maximum Input Leakage Current | Iin | -1 | 1 | μA | Vin = 5.5 V or GND (DIR, OE), VCC = 0 to 5.5 V, TA = -40 to 85°C | 3 | |
| Maximum Three-State Leakage Current | IOZ | -0.25 | 0.25 | μA | Vin = VIL or VIH, Vout = VCC or GND, VCC = 5.5 V, TA = 25°C | 4 | |
| Maximum Three-State Leakage Current | IOZ | -2.5 | 2.5 | μA | Vin = VIL or VIH, Vout = VCC or GND, VCC = 5.5 V, TA = -40 to 85°C | 4 | |
| Maximum Quiescent Supply Current | ICC | 4 | μA | Vin = VCC or GND, VCC = 5.5 V, TA = 25°C | 4 | ||
| Maximum Quiescent Supply Current | ICC | 40 | μA | Vin = VCC or GND, VCC = 5.5 V, TA = -40 to 85°C | 4 | ||
| Propagation Delay A to B or B to A | tPLH, tPHL | 5.8 | 8.4 | ns | VCC = 3.3 ± 0.3V, CL = 15pF, TA = 25°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 8.3 | 11.9 | ns | VCC = 3.3 ± 0.3V, CL = 50pF, TA = 25°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 1 | 10 | ns | VCC = 3.3 ± 0.3V, CL = 15pF, TA = -40 to 85°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 1 | 13.5 | ns | VCC = 3.3 ± 0.3V, CL = 50pF, TA = -40 to 85°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 4 | 5.5 | ns | VCC = 5.0 ± 0.5V, CL = 15pF, TA = 25°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 5.5 | 7.5 | ns | VCC = 5.0 ± 0.5V, CL = 50pF, TA = 25°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 1 | 6.5 | ns | VCC = 5.0 ± 0.5V, CL = 15pF, TA = -40 to 85°C | 4 | |
| Propagation Delay A to B or B to A | tPLH, tPHL | 1 | 8.5 | ns | VCC = 5.0 ± 0.5V, CL = 50pF, TA = -40 to 85°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 8.5 | 13.2 | ns | VCC = 3.3 ± 0.3V, CL = 15pF, RL = 1 kΩ, TA = 25°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 11 | 16.7 | ns | VCC = 3.3 ± 0.3V, CL = 50pF, RL = 1 kΩ, TA = 25°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 1 | 15.5 | ns | VCC = 3.3 ± 0.3V, CL = 15pF, RL = 1 kΩ, TA = -40 to 85°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 1 | 19 | ns | VCC = 3.3 ± 0.3V, CL = 50pF, RL = 1 kΩ, TA = -40 to 85°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 5.8 | 8.5 | ns | VCC = 5.0 ± 0.5V, CL = 15pF, RL = 1 kΩ, TA = 25°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 7.3 | 10.6 | ns | VCC = 5.0 ± 0.5V, CL = 50pF, RL = 1 kΩ, TA = 25°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 1 | 10 | ns | VCC = 5.0 ± 0.5V, CL = 15pF, RL = 1 kΩ, TA = -40 to 85°C | 4 | |
| Output Enable Time OE to A or B | tPZL, tPZH | 1 | 12 | ns | VCC = 5.0 ± 0.5V, CL = 50pF, RL = 1 kΩ, TA = -40 to 85°C | 4 | |
| Output Disable Time OE to A or B | tPLZ, tPHZ | 11.5 | 15.8 | ns | VCC = 3.3 ± 0.3V, CL = 50pF, RL = 1 kΩ, TA = 25°C | 4 | |
| Output Disable Time OE to A or B | tPLZ, tPHZ | 1 | 18 | ns | VCC = 3.3 ± 0.3V, CL = 50pF, RL = 1 kΩ, TA = -40 to 85°C | 4 | |
| Output Disable Time OE to A or B | tPLZ, tPHZ | 7 | 9.7 | ns | VCC = 5.0 ± 0.5V, CL = 50pF, RL = 1 kΩ, TA = 25°C | 4 | |
| Output Disable Time OE to A or B | tPLZ, tPHZ | 1 | 11 | ns | VCC = 5.0 ± 0.5V, CL = 50pF, RL = 1 kΩ, TA = -40 to 85°C | 4 | |
| Output to Output Skew | tOSLH, tOSHL | 1.5 | ns | VCC = 3.3 ± 0.3V, CL = 50pF (Note 1) | 4 | ||
| Output to Output Skew | tOSLH, tOSHL | 1 | ns | VCC = 5.0 ± 0.5V, CL = 50pF (Note 1) | 4 | ||
| Maximum Input Capacitance DIR, OE | Cin | 4 | 10 | pF | TA = 25°C | 4 | |
| Maximum Three-State I/O Capacitance | CI/O | 8 | pF | 4 | |||
| Power Dissipation Capacitance | CPD | 21 | pF | Typical @ 25°C, VCC = 5.0V | 4 | ||
| Quiet Output Maximum Dynamic VOL | VOLP | 0.9 | 1.2 | V | VCC = 5.0V, CL = 50pF, TA = 25°C | 4 | |
| Quiet Output Minimum Dynamic VOL | VOLV | -1.2 | -0.9 | V | VCC = 5.0V, CL = 50pF, TA = 25°C | 4 | |
| Minimum High Level Dynamic Input Voltage | VIHD | 3.5 | V | VCC = 5.0V, CL = 50pF, TA = 25°C | 4 | ||
| Maximum Low Level Dynamic Input Voltage | VILD | 1.5 | V | VCC = 5.0V, CL = 50pF, TA = 25°C | 4 |
CAD (KiCad official)
- Symbol:
MC74VHC245DTR2G - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files:
mc74vhc245dtr2g-etched.step/mc74vhc245dtr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74vhc245dtr2g.step/mc74vhc245dtr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
434ade239f60233b, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).