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MC74LCX74DTR2G

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onsemi Flip Flops, TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MC74LCX74DTR2G

onsemi · Flip Flops · TSSOP-14

MC74LCX74DTR2G from onsemi, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CD1 input Direct clear input for flip-flop 1; a LOW level with SD1 HIGH asynchronously forces O1 LOW and O1 HIGH, and the device is rated for 5.0 V-tolerant inputs.
2 D1 input Data input for flip-flop 1, which must meet the setup and hold time requirements (ts 2.5 ns, th 1.5 ns at VCC = 3.3 V) relative to the CP1 clock.
3 CP1 input Clock pulse input for flip-flop 1; D1 is stored on the LOW-to-HIGH transition of CP1.
4 SD1 input Direct set input for flip-flop 1; a LOW level with CD1 HIGH asynchronously forces O1 HIGH and O1-bar LOW.
5 O1 output True output of flip-flop 1, rated for 24 mA balanced sink and source capability at VCC = 3.0 V to 3.6 V.
6 /O1 output Complementary (inverted) output of flip-flop 1, which is the logical inverse of O1.
7 GND power_in Ground reference pin for the device.
8 /O2 output Complementary (inverted) output of flip-flop 2, which is the logical inverse of O2.
9 O2 output True output of flip-flop 2, rated for 24 mA balanced sink and source capability at VCC = 3.0 V to 3.6 V.
10 SD2 input Direct set input for flip-flop 2; a LOW level with CD2 HIGH asynchronously forces O2 HIGH and O2-bar LOW.
11 CP2 input Clock pulse input for flip-flop 2; D2 is stored on the LOW-to-HIGH transition of CP2.
12 D2 input Data input for flip-flop 2, which must meet the setup and hold time requirements relative to the CP2 clock.
13 CD2 input Direct clear input for flip-flop 2; a LOW level with SD2 HIGH asynchronously forces O2 LOW and O2-bar HIGH.
14 VCC power_in Supply pin; the device is designed for 2.3 V to 3.6 V VCC operation (absolute maximum 7.0 V DC supply voltage).

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (Operating) VCC 2 3.6 V Operating 3
Supply Voltage (Data Retention Only) VCC 1.5 3.6 V Data retention only 3
Input Voltage VI 0 5.5 V 3
Output Voltage (HIGH or LOW State) VO 0 V HIGH or LOW State 3
HIGH Level Output Current IOH -24 mA VCC = 3.0 V − 3.6 V 3
HIGH Level Output Current IOH -12 mA VCC = 2.7 V − 3.0 V 3
HIGH Level Output Current IOH -8 mA VCC = 2.3 V − 2.7 V 3
LOW Level Output Current IOL 24 mA VCC = 3.0 V − 3.6 V 3
LOW Level Output Current IOL 12 mA VCC = 2.7 V − 3.0 V 3
LOW Level Output Current IOL 8 mA VCC = 2.3 V − 2.7 V 3
Operating Free-Air Temperature TA -40 85 °C 3
Input Transition Rise or Fall Rate t/V 0 10 ns/V VIN from 0.8 V to 2.0 V, VCC = 3.0 V 3
DC Supply Voltage VCC -0.5 7 V 3
DC Input Voltage VI -0.5 7 V 3
DC Output Voltage VO -0.5 V Output in HIGH or LOW State (Note 1) 3
DC Input Diode Current IIK -50 mA VI < GND 3
DC Output Diode Current IOK -50 mA VO < GND 3
DC Output Diode Current IOK 50 mA VO > VCC 3
DC Output Source/Sink Current IO 50 mA 3
DC Supply Current Per Supply Pin ICC 100 mA 3
DC Ground Current Per Ground Pin IGND 100 mA 3
Storage Temperature Range TSTG -65 150 °C 3
HIGH Level Input Voltage VIH 1.7 V 2.3 V ≤ VCC ≤ 2.7 V 4
HIGH Level Input Voltage VIH 2 V 2.7 V ≤ VCC ≤ 3.6 V 4
LOW Level Input Voltage VIL 0.7 V 2.3 V ≤ VCC ≤ 2.7 V 4
LOW Level Input Voltage VIL 0.8 V 2.7 V ≤ VCC ≤ 3.6 V 4
HIGH Level Output Voltage VOH 1.8 V VCC = 2.3 V; IOH = −8 mA 4
HIGH Level Output Voltage VOH 2.2 V VCC = 2.7 V; IOH = −12 mA 4
HIGH Level Output Voltage VOH 2.4 V VCC = 3.0 V; IOH = −18 mA 4
LOW Level Output Voltage VOL 0.2 V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 µA 4
LOW Level Output Voltage VOL 0.6 V VCC = 2.3 V; IOL = 8 mA 4
LOW Level Output Voltage VOL 0.4 V VCC = 2.7 V; IOL = 12 mA 4
LOW Level Output Voltage VOL 0.55 V VCC = 3.0 V; IOL = 24 mA 4
Power Off Leakage Current IOFF 10 µA VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 4
Input Leakage Current IIN 5 µA VCC = 3.6 V, VIN = 5.5 V or GND 4
Quiescent Supply Current ICC 10 µA VCC = 3.6 V, VIN = 5.5 V or GND 4
Increase in ICC per Input ICC 500 µA 2.3 V ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 4
Clock Pulse Frequency fmax 150 MHz VCC = 3.3 V ± 0.3 V, CL = 50 pF 4
Propagation Delay CPn to On or On tPLH / tPHL 1.5 7 ns VCC = 3.3 V ± 0.3 V, CL = 50 pF; Waveform 1 4
Propagation Delay CPn to On or On tPLH / tPHL 1.5 8 ns VCC = 2.7 V, CL = 50 pF; Waveform 1 4
Propagation Delay CPn to On or On tPLH / tPHL 1.5 8.4 ns VCC = 2.5 V ± 0.2 V, CL = 30 pF; Waveform 1 4
Propagation Delay SDn or CDn to On or On tPLH / tPHL 1.5 7 ns VCC = 3.3 V ± 0.3 V, CL = 50 pF; Waveform 2 4
Propagation Delay SDn or CDn to On or On tPLH / tPHL 1.5 8 ns VCC = 2.7 V, CL = 50 pF; Waveform 2 4
Propagation Delay SDn or CDn to On or On tPLH / tPHL 1.5 8.4 ns VCC = 2.5 V ± 0.2 V, CL = 30 pF; Waveform 2 4
Setup Time, HIGH or LOW Dn to CPn ts 2.5 ns VCC = 3.3 V ± 0.3 V, CL = 50 pF; Waveform 1 4
Setup Time, HIGH or LOW Dn to CPn ts 4 ns VCC = 2.5 V ± 0.2 V, CL = 30 pF; Waveform 1 4
Hold Time, HIGH or LOW Dn to CPn th 1.5 ns VCC = 3.3 V ± 0.3 V, CL = 50 pF; Waveform 1 4
Hold Time, HIGH or LOW Dn to CPn th 2 ns VCC = 2.5 V ± 0.2 V, CL = 30 pF; Waveform 1 4
Recovery Time SDn or CDn to CPn trec 2.5 ns VCC = 3.3 V ± 0.3 V, CL = 50 pF; Waveform 3 4
Recovery Time SDn or CDn to CPn trec 3 ns VCC = 2.7 V, CL = 50 pF; Waveform 3 4
Recovery Time SDn or CDn to CPn trec 4.5 ns VCC = 2.5 V ± 0.2 V, CL = 30 pF; Waveform 3 4
Output-to-Output Skew tOSHL / tOSLH 1 ns Note 3 4

CAD (KiCad official)

  • Symbol: MC74LCX74DTR2G
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: mc74lcx74dtr2g-etched.step / mc74lcx74dtr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74lcx74dtr2g.step / mc74lcx74dtr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 ae1fd5f931dc5a67, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF