component
MC74LCX244ADTR2G
Public Made by Adomby adom
onsemi Buffer/Driver/Transceiver, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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MC74LCX244ADTR2G
onsemi · Buffer/Driver/Transceiver · TSSOP-20
MC74LCX244ADTR2G from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1OE | input | Output Enable input for buffer bank 1; when HIGH it disables outputs 1O0 to 1O3 into a high-impedance state. |
| 2 | 1D0 | input | Data input 1D0 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 3 | 2O0 | tri_state | 3-state non-inverting output 2O0 with 24 mA balanced sink and source drive capability. |
| 4 | 1D1 | input | Data input 1D1 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 5 | 2O1 | tri_state | 3-state non-inverting output 2O1 with 24 mA balanced sink and source drive capability. |
| 6 | 1D2 | input | Data input 1D2 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 7 | 2O2 | tri_state | 3-state non-inverting output 2O2 with 24 mA balanced sink and source drive capability. |
| 8 | 1D3 | input | Data input 1D3 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 9 | 2O3 | tri_state | 3-state non-inverting output 2O3 with 24 mA balanced sink and source drive capability. |
| 10 | GND | power_in | Ground reference pin for the device at 0 V. |
| 11 | 2D3 | input | Data input 2D3 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 12 | 1O3 | tri_state | 3-state non-inverting output 1O3 with 24 mA balanced sink and source drive capability. |
| 13 | 2D2 | input | Data input 2D2 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 14 | 1O2 | tri_state | 3-state non-inverting output 1O2 with 24 mA balanced sink and source drive capability. |
| 15 | 2D1 | input | Data input 2D1 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 16 | 1O1 | tri_state | 3-state non-inverting output 1O1 with 24 mA balanced sink and source drive capability. |
| 17 | 2D0 | input | Data input 2D0 is TTL compatible, accepts up to 5.5 V, and must not be left floating. |
| 18 | 1O0 | tri_state | 3-state non-inverting output 1O0 with 24 mA balanced sink and source drive capability. |
| 19 | 2OE | input | Output Enable input for buffer bank 2; when HIGH it disables outputs 2O0 to 2O3 into a high-impedance state. |
| 20 | VCC | power_in | Supply voltage pin; the device operates from 1.65 V to 3.6 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-20 |
| Category | Logic ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage Operating | VCC | 1.65 | 3.3 | 3.6 | V | 4 | |
| Supply Voltage Data Retention Only | VCC | 1.5 | 3.3 | 3.6 | V | 4 | |
| Digital Input Voltage | VI | 0 | 5.5 | V | 4 | ||
| Output Voltage Active Mode | VO | 0 | V | Active Mode (High or Low State); max = VCC | 4 | ||
| Output Voltage Tri-State Mode | VO | 0 | 5.5 | V | Tri-State Mode | 4 | |
| Output Voltage Power Down Mode | VO | 0 | 5.5 | V | Power Down Mode (VCC = 0 V) | 4 | |
| Operating Free-Air Temperature | TA | -40 | 125 | °C | 4 | ||
| Input Transition Rise or Fall Rate | tr, tf | 0 | 10 | ns/V | VI from 0.8 V to 2.0 V, VCC = 3.0 V | 4 | |
| DC Input Voltage | VI | -0.5 | 6.5 | V | Note 1 | 4 | |
| DC Output Voltage Active Mode | VO | -0.5 | V | Active-Mode (High or Low State); max = VCC + 0.5 | 4 | ||
| DC Output Voltage Tri-State Mode | VO | -0.5 | 6.5 | V | Tri-State Mode | 4 | |
| DC Output Voltage Power-Down Mode | VO | -0.5 | 6.5 | V | Power-Down Mode (VCC = 0 V) | 4 | |
| DC Input Diode Current | IIK | -50 | mA | VIN < GND | 4 | ||
| DC Output Diode Current | IOK | -50 | mA | VOUT < GND | 4 | ||
| DC Output Source/Sink Current | IO | -50 | 50 | mA | 4 | ||
| DC Supply Current Per Supply Pin | ICC | -100 | 100 | mA | 4 | ||
| DC Supply Current Per Ground Pin | IGND | -100 | 100 | mA | 4 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 4 | ||
| ESD Withstand Voltage Human Body Model | VESD | 2000 | V | HBM; printed as > 2000 V | 4 | ||
| Latchup Performance | ILATCHUP | -100 | 100 | mA | 4 | ||
| High-Level Input Voltage | VIH | 1.7 | V | VCC 2.3 to 2.7 V; TA = -40C to +125C | 5 | ||
| High-Level Input Voltage | VIH | 2 | V | VCC 2.7 to 3.6 V; TA = -40C to +125C | 5 | ||
| Low-Level Input Voltage | VIL | 0.7 | V | VCC 2.3 to 2.7 V; TA = -40C to +125C | 5 | ||
| Low-Level Input Voltage | VIL | 0.8 | V | VCC 2.7 to 3.6 V; TA = -40C to +125C | 5 | ||
| High-Level Output Voltage | VOH | 1.2 | V | VI = VIH or VIL; IOH = -4 mA; VCC 1.65 V; TA = -40C to +125C | 5 | ||
| High-Level Output Voltage | VOH | 1.8 | V | VI = VIH or VIL; IOH = -8 mA; VCC 2.3 V; TA = -40C to +125C | 5 | ||
| High-Level Output Voltage | VOH | 2.2 | V | VI = VIH or VIL; IOH = -12 mA; VCC 2.7 V; TA = -40C to +125C | 5 | ||
| High-Level Output Voltage | VOH | 2.4 | V | VI = VIH or VIL; IOH = -16 mA; VCC 3.0 V; TA = -40C to +125C | 5 | ||
| Low-Level Output Voltage | VOL | 0.2 | V | VI = VIH or VIL; IOL = 100 A; VCC 1.65 to 3.6 V; TA = -40C to +125C | 5 | ||
| Low-Level Output Voltage | VOL | 0.45 | V | VI = VIH or VIL; IOL = 4 mA; VCC 1.65 V; TA = -40C to +125C | 5 | ||
| Low-Level Output Voltage | VOL | 0.6 | V | VI = VIH or VIL; IOL = 8 mA; VCC 2.3 V; TA = -40C to +125C | 5 | ||
| Low-Level Output Voltage | VOL | 0.4 | V | VI = VIH or VIL; IOL = 12 mA; VCC 2.7 V; TA = -40C to +125C | 5 | ||
| Input Leakage Current | II | -5 | 5 | A | VI = 0 to 5.5 V; VCC 3.6 V; TA = -40C to +125C | 5 | |
| 3-State Output Leakage Current | IOZ | -5 | 5 | A | VI = VIH or VIL; VO = 0 V to 5.5 V; VCC 3.6 V; TA = -40C to +125C | 5 | |
| Power Off Leakage Current | IOFF | 20 | A | VI = 5.5 V or VO = 5.5 V; VCC 0 V; TA = -40C to +125C | 5 | ||
| Quiescent Supply Current | ICC | 10 | A | VI = 5.5 V or GND; VCC 3.6 V; TA = -40C to +125C | 5 | ||
| Increase in ICC per Input | ΔICC | 500 | A | VIH = VCC - 0.6 V; VCC 2.3 to 3.6 V; TA = -40C to +125C | 5 | ||
| Propagation Delay D to O | tPLH, tPHL | 10.3 | ns | VCC 1.65 to 1.95 V; TA = -40C to +125C | 6 | ||
| Propagation Delay D to O | tPLH, tPHL | 7.8 | ns | VCC 2.3 to 2.7 V; TA = -40C to +125C | 6 | ||
| Propagation Delay D to O | tPLH, tPHL | 7.5 | ns | VCC 2.7 V; TA = -40C to +125C | 6 | ||
| Propagation Delay D to O | tPLH, tPHL | 6.5 | ns | VCC 3.0 to 3.6 V; TA = -40C to +125C | 6 | ||
| Output Enable Time OE to O | tPZH, tPZL | 13 | ns | VCC 1.65 to 1.95 V; TA = -40C to +125C | 6 | ||
| Output Enable Time OE to O | tPZH, tPZL | 10 | ns | VCC 2.3 to 2.7 V; TA = -40C to +125C | 6 | ||
| Output Enable Time OE to O | tPZH, tPZL | 9 | ns | VCC 2.7 V; TA = -40C to +125C | 6 | ||
| Output Enable Time OE to O | tPZH, tPZL | 8 | ns | VCC 3.0 to 3.6 V; TA = -40C to +125C | 6 | ||
| Output Disable Time OE to O | tPHZ, tPLZ | 11 | ns | VCC 1.65 to 1.95 V; TA = -40C to +125C | 6 | ||
| Output Disable Time OE to O | tPHZ, tPLZ | 8.4 | ns | VCC 2.3 to 2.7 V; TA = -40C to +125C | 6 | ||
| Output Disable Time OE to O | tPHZ, tPLZ | 8 | ns | VCC 2.7 V; TA = -40C to +125C | 6 | ||
| Output Disable Time OE to O | tPHZ, tPLZ | 7 | ns | VCC 3.0 to 3.6 V; TA = -40C to +125C | 6 | ||
| Output to Output Skew | tOSHL, tOSLH | 1 | ns | VCC 3.0 to 3.6 V; TA = -40C to +125C | 6 | ||
| Input Capacitance | CIN | 7 | pF | VCC = 3.3 V, VI = 0 V or VCC; TA = 25C | 6 | ||
| Output Capacitance | COUT | 8 | pF | VCC = 3.3 V, VI = 0 V or VCC; TA = 25C | 6 | ||
| Power Dissipation Capacitance | CPD | 25 | pF | 10 MHz, VCC = 3.3 V, VI = 0 V or VCC; TA = 25C | 6 |
CAD (KiCad official)
- Symbol:
MC74LCX244ADTR2G - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files:
mc74lcx244adtr2g-etched.step/mc74lcx244adtr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74lcx244adtr2g.step/mc74lcx244adtr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
2c1011161729bb7b, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).