component
MC74HCU04ADG
Public Made by Adomby adom
onsemi Buffers, Drivers, Receivers, Transceivers, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MC74HCU04ADG
onsemi · Buffers, Drivers, Receivers, Transceivers · SOIC-14
MC74HCU04ADG from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | input | Input of inverter 1; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 2 | Y1 | output | Output of inverter 1 (Y = A); unused outputs must be left open. |
| 3 | A2 | input | Input of inverter 2; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 4 | Y2 | output | Output of inverter 2 (Y = A); unused outputs must be left open. |
| 5 | A3 | input | Input of inverter 3; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 6 | Y3 | output | Output of inverter 3 (Y = A); unused outputs must be left open. |
| 7 | GND | power_in | Ground reference for the device; all voltages are referenced to this pin. |
| 8 | Y4 | output | Output of inverter 4 (Y = A); unused outputs must be left open. |
| 9 | A4 | input | Input of inverter 4; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 10 | Y5 | output | Output of inverter 5 (Y = A); unused outputs must be left open. |
| 11 | A5 | input | Input of inverter 5; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 12 | Y6 | output | Output of inverter 6 (Y = A); unused outputs must be left open. |
| 13 | A6 | input | Input of inverter 6; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 14 | VCC | power_in | Positive supply; recommended operating range 2.0 V to 6.0 V, absolute maximum −0.5 V to +7.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-14 |
| Category | Logic |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND) | VCC | 2 | 6 | V | 2 | ||
| DC Input Voltage, Output Voltage (Referenced to GND) | Vin, Vout | 0 | V | Maximum printed as VCC | 2 | ||
| Operating Temperature, All Package Types | TA | -55 | 125 | °C | 2 | ||
| DC Supply Voltage (Referenced to GND) | VCC | -0.5 | 7 | V | 2 | ||
| DC Input Voltage (Referenced to GND) | Vin | -0.5 | V | Maximum printed as VCC + 0.5 | 2 | ||
| DC Output Voltage (Referenced to GND) | Vout | -0.5 | V | Maximum printed as VCC + 0.5 | 2 | ||
| DC Input Current, per Pin | Iin | -20 | 20 | mA | 2 | ||
| DC Output Current, per Pin | Iout | -25 | 25 | mA | 2 | ||
| DC Supply Current, VCC and GND Pins | ICC | -50 | 50 | mA | 2 | ||
| Power Dissipation in Still Air, SOIC Package | PD | 500 | mW | SOIC package; derate -7 mW/°C from 65 to 125 °C | 2 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 2 | ||
| Lead Temperature, SOIC or TSSOP Package | TL | 260 | °C | 1 mm from case for 10 seconds | 2 | ||
| Minimum High-Level Input Voltage (VCC = 2.0 V) | VIH | 1.7 | V | 2 | |||
| Minimum High-Level Input Voltage (VCC = 3.0 V) | VIH | 2.5 | V | 2 | |||
| Minimum High-Level Input Voltage (VCC = 4.5 V) | VIH | 3.6 | V | 2 | |||
| Minimum High-Level Input Voltage (VCC = 6.0 V) | VIH | 4.8 | V | 2 | |||
| Maximum Low-Level Input Voltage (VCC = 2.0 V) | VIL | 0.3 | V | 2 | |||
| Maximum Low-Level Input Voltage (VCC = 3.0 V) | VIL | 0.5 | V | 2 | |||
| Maximum Low-Level Input Voltage (VCC = 4.5 V) | VIL | 0.8 | V | 2 | |||
| Maximum Low-Level Input Voltage (VCC = 6.0 V) | VIL | 1.1 | V | 2 | |||
| Minimum High-Level Output Voltage (VCC = 2.0 V) | VOH | 1.8 | V | Vin = GND /Iout/ ≤ 20 µA | 2 | ||
| Minimum High-Level Output Voltage (VCC = 4.5 V) | VOH | 4 | V | Vin = GND /Iout/ ≤ 20 µA | 2 | ||
| Minimum High-Level Output Voltage (VCC = 6.0 V) | VOH | 5.5 | V | Vin = GND /Iout/ ≤ 20 µA | 2 | ||
| Minimum High-Level Output Voltage (VCC = 3.0 V) | VOH | 2.2 | V | Vin = GND /Iout/ ≤ 2.4 mA | 2 | ||
| Minimum High-Level Output Voltage (VCC = 4.5 V) | VOH | 3.7 | V | Vin = GND /Iout/ ≤ 4.0 mA | 2 | ||
| Minimum High-Level Output Voltage (VCC = 6.0 V) | VOH | 5.2 | V | Vin = GND /Iout/ ≤ 5.2 mA | 2 | ||
| Maximum Low-Level Output Voltage (VCC = 2.0 V) | VOL | 0.2 | V | Vin = VCC /Iout/ ≤ 20 µA | 3 | ||
| Maximum Low-Level Output Voltage (VCC = 4.5 V) | VOL | 0.5 | V | Vin = VCC /Iout/ ≤ 20 µA | 3 | ||
| Maximum Low-Level Output Voltage (VCC = 6.0 V) | VOL | 0.5 | V | Vin = VCC /Iout/ ≤ 20 µA | 3 | ||
| Maximum Low-Level Output Voltage (VCC = 3.0 V) | VOL | 0.32 | V | Vin = VCC /Iout/ ≤ 2.4 mA | 3 | ||
| Maximum Low-Level Output Voltage (VCC = 4.5 V) | VOL | 0.37 | V | Vin = VCC /Iout/ ≤ 4.0 mA | 3 | ||
| Maximum Low-Level Output Voltage (VCC = 6.0 V) | VOL | 0.4 | V | Vin = VCC /Iout/ ≤ 5.2 mA | 3 | ||
| Maximum Input Leakage Current | Iin | -1 | 1 | µA | VCC = 6.0 V; Vin = VCC or GND | 3 | |
| Maximum Quiescent Supply Current (per Package) | ICC | 40 | µA | VCC = 6.0 V; Vin = VCC or GND; Iout = 0 µA | 3 | ||
| Maximum Input Capacitance | Cin | 10 | pF | 3 | |||
| Maximum Propagation Delay, Input A to Output Y (VCC = 2.0 V) | tPLH, tPHL | 105 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Propagation Delay, Input A to Output Y (VCC = 3.0 V) | tPLH, tPHL | 50 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Propagation Delay, Input A to Output Y (VCC = 4.5 V) | tPLH, tPHL | 21 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Propagation Delay, Input A to Output Y (VCC = 6.0 V) | tPLH, tPHL | 18 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Output Transition Time, Any Output (VCC = 2.0 V) | tTLH, tTHL | 110 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Output Transition Time, Any Output (VCC = 3.0 V) | tTLH, tTHL | 36 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Output Transition Time, Any Output (VCC = 4.5 V) | tTLH, tTHL | 22 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 | ||
| Maximum Output Transition Time, Any Output (VCC = 6.0 V) | tTLH, tTHL | 19 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
CAD (KiCad official)
- Symbol:
MC74HCU04ADG - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
mc74hcu04adg-etched.step/mc74hcu04adg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hcu04adg.step/mc74hcu04adg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
e154ad67b07920fc, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MC74HCU04ADG
**onsemi** · Buffers, Drivers, Receivers, Transceivers · SOIC-14
MC74HCU04ADG from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | input | Input of inverter 1; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 2 | Y1 | output | Output of inverter 1 (Y = A); unused outputs must be left open. |
| 3 | A2 | input | Input of inverter 2; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 4 | Y2 | output | Output of inverter 2 (Y = A); unused outputs must be left open. |
| 5 | A3 | input | Input of inverter 3; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 6 | Y3 | output | Output of inverter 3 (Y = A); unused outputs must be left open. |
| 7 | GND | power_in | Ground reference for the device; all voltages are referenced to this pin. |
| 8 | Y4 | output | Output of inverter 4 (Y = A); unused outputs must be left open. |
| 9 | A4 | input | Input of inverter 4; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 10 | Y5 | output | Output of inverter 5 (Y = A); unused outputs must be left open. |
| 11 | A5 | input | Input of inverter 5; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 12 | Y6 | output | Output of inverter 6 (Y = A); unused outputs must be left open. |
| 13 | A6 | input | Input of inverter 6; Vin must stay within GND to VCC and unused inputs must be tied to GND or VCC. |
| 14 | VCC | power_in | Positive supply; recommended operating range 2.0 V to 6.0 V, absolute maximum −0.5 V to +7.0 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-14 |
| Category | Logic |
| Pins | 14 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND) | VCC | 2 | | 6 | V | | 2 |
| DC Input Voltage, Output Voltage (Referenced to GND) | Vin, Vout | 0 | | | V | Maximum printed as VCC | 2 |
| Operating Temperature, All Package Types | TA | -55 | | 125 | °C | | 2 |
| DC Supply Voltage (Referenced to GND) | VCC | -0.5 | | 7 | V | | 2 |
| DC Input Voltage (Referenced to GND) | Vin | -0.5 | | | V | Maximum printed as VCC + 0.5 | 2 |
| DC Output Voltage (Referenced to GND) | Vout | -0.5 | | | V | Maximum printed as VCC + 0.5 | 2 |
| DC Input Current, per Pin | Iin | -20 | | 20 | mA | | 2 |
| DC Output Current, per Pin | Iout | -25 | | 25 | mA | | 2 |
| DC Supply Current, VCC and GND Pins | ICC | -50 | | 50 | mA | | 2 |
| Power Dissipation in Still Air, SOIC Package | PD | | | 500 | mW | SOIC package; derate -7 mW/°C from 65 to 125 °C | 2 |
| Storage Temperature | Tstg | -65 | | 150 | °C | | 2 |
| Lead Temperature, SOIC or TSSOP Package | TL | | | 260 | °C | 1 mm from case for 10 seconds | 2 |
| Minimum High-Level Input Voltage (VCC = 2.0 V) | VIH | 1.7 | | | V | | 2 |
| Minimum High-Level Input Voltage (VCC = 3.0 V) | VIH | 2.5 | | | V | | 2 |
| Minimum High-Level Input Voltage (VCC = 4.5 V) | VIH | 3.6 | | | V | | 2 |
| Minimum High-Level Input Voltage (VCC = 6.0 V) | VIH | 4.8 | | | V | | 2 |
| Maximum Low-Level Input Voltage (VCC = 2.0 V) | VIL | | | 0.3 | V | | 2 |
| Maximum Low-Level Input Voltage (VCC = 3.0 V) | VIL | | | 0.5 | V | | 2 |
| Maximum Low-Level Input Voltage (VCC = 4.5 V) | VIL | | | 0.8 | V | | 2 |
| Maximum Low-Level Input Voltage (VCC = 6.0 V) | VIL | | | 1.1 | V | | 2 |
| Minimum High-Level Output Voltage (VCC = 2.0 V) | VOH | 1.8 | | | V | Vin = GND /Iout/ ≤ 20 µA | 2 |
| Minimum High-Level Output Voltage (VCC = 4.5 V) | VOH | 4 | | | V | Vin = GND /Iout/ ≤ 20 µA | 2 |
| Minimum High-Level Output Voltage (VCC = 6.0 V) | VOH | 5.5 | | | V | Vin = GND /Iout/ ≤ 20 µA | 2 |
| Minimum High-Level Output Voltage (VCC = 3.0 V) | VOH | 2.2 | | | V | Vin = GND /Iout/ ≤ 2.4 mA | 2 |
| Minimum High-Level Output Voltage (VCC = 4.5 V) | VOH | 3.7 | | | V | Vin = GND /Iout/ ≤ 4.0 mA | 2 |
| Minimum High-Level Output Voltage (VCC = 6.0 V) | VOH | 5.2 | | | V | Vin = GND /Iout/ ≤ 5.2 mA | 2 |
| Maximum Low-Level Output Voltage (VCC = 2.0 V) | VOL | | | 0.2 | V | Vin = VCC /Iout/ ≤ 20 µA | 3 |
| Maximum Low-Level Output Voltage (VCC = 4.5 V) | VOL | | | 0.5 | V | Vin = VCC /Iout/ ≤ 20 µA | 3 |
| Maximum Low-Level Output Voltage (VCC = 6.0 V) | VOL | | | 0.5 | V | Vin = VCC /Iout/ ≤ 20 µA | 3 |
| Maximum Low-Level Output Voltage (VCC = 3.0 V) | VOL | | | 0.32 | V | Vin = VCC /Iout/ ≤ 2.4 mA | 3 |
| Maximum Low-Level Output Voltage (VCC = 4.5 V) | VOL | | | 0.37 | V | Vin = VCC /Iout/ ≤ 4.0 mA | 3 |
| Maximum Low-Level Output Voltage (VCC = 6.0 V) | VOL | | | 0.4 | V | Vin = VCC /Iout/ ≤ 5.2 mA | 3 |
| Maximum Input Leakage Current | Iin | -1 | | 1 | µA | VCC = 6.0 V; Vin = VCC or GND | 3 |
| Maximum Quiescent Supply Current (per Package) | ICC | | | 40 | µA | VCC = 6.0 V; Vin = VCC or GND; Iout = 0 µA | 3 |
| Maximum Input Capacitance | Cin | | | 10 | pF | | 3 |
| Maximum Propagation Delay, Input A to Output Y (VCC = 2.0 V) | tPLH, tPHL | | | 105 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Propagation Delay, Input A to Output Y (VCC = 3.0 V) | tPLH, tPHL | | | 50 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Propagation Delay, Input A to Output Y (VCC = 4.5 V) | tPLH, tPHL | | | 21 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Propagation Delay, Input A to Output Y (VCC = 6.0 V) | tPLH, tPHL | | | 18 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Output Transition Time, Any Output (VCC = 2.0 V) | tTLH, tTHL | | | 110 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Output Transition Time, Any Output (VCC = 3.0 V) | tTLH, tTHL | | | 36 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Output Transition Time, Any Output (VCC = 4.5 V) | tTLH, tTHL | | | 22 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
| Maximum Output Transition Time, Any Output (VCC = 6.0 V) | tTLH, tTHL | | | 19 | ns | CL = 50 pF, Input tr = tf = 6 ns (Figures 1 and 2) | 3 |
## CAD (KiCad official)
- Symbol: `MC74HCU04ADG`
- Footprint: `Package_SO:SOIC-14_3.9x8.7mm_P1.27mm`
- 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files: `mc74hcu04adg-etched.step` / `mc74hcu04adg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc74hcu04adg.step` / `mc74hcu04adg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590910206614724609) (9 pp, sha256 `e154ad67b07920fc`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mc74hcu04adg-datasheet.pdf)