component
MC74HCT365ADTR2G
Public Made by Adomby adom
onsemi Buffers, Drivers, Receivers, Transceivers, TSSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMC74HCT365ADTR2G
onsemi · Buffers, Drivers, Receivers, Transceivers · TSSOP-16
MC74HCT365ADTR2G from onsemi, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTPUT ENABLE 1 | input | Active-low output enable 1; when this enable or enable 2 is high, the buffer outputs are placed into the high-impedance state. |
| 2 | A0 | input | Data input to buffer 0; unused inputs must always be tied to an appropriate logic level such as GND or VCC. |
| 3 | Y0 | tri_state | Noninverting 3-state output of buffer 0 that is high-impedance when either output enable is high. |
| 4 | A1 | input | Data input to buffer 1; unused inputs must always be tied to an appropriate logic level such as GND or VCC. |
| 5 | Y1 | tri_state | Noninverting 3-state output of buffer 1 that is high-impedance when either output enable is high. |
| 6 | A2 | input | Data input to buffer 2; unused inputs must always be tied to an appropriate logic level such as GND or VCC. |
| 7 | Y2 | tri_state | Noninverting 3-state output of buffer 2 that is high-impedance when either output enable is high. |
| 8 | GND | power_in | Ground reference for the device (0 V). |
| 9 | Y3 | tri_state | Noninverting 3-state output of buffer 3 that is high-impedance when either output enable is high. |
| 10 | A3 | input | Data input to buffer 3; unused inputs must always be tied to an appropriate logic level such as GND or VCC. |
| 11 | Y4 | tri_state | Noninverting 3-state output of buffer 4 that is high-impedance when either output enable is high. |
| 12 | A4 | input | Data input to buffer 4; unused inputs must always be tied to an appropriate logic level such as GND or VCC. |
| 13 | Y5 | tri_state | Noninverting 3-state output of buffer 5 that is high-impedance when either output enable is high. |
| 14 | A5 | input | Data input to buffer 5; unused inputs must always be tied to an appropriate logic level such as GND or VCC. |
| 15 | OUTPUT ENABLE 2 | input | Active-low output enable 2; when this enable or enable 1 is high, the buffer outputs are placed into the high-impedance state. |
| 16 | VCC | power_in | Positive supply voltage, 4.5 V to 5.5 V referenced to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-16 |
| Category | Logic |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND) | VCC | 4.5 | 5.5 | V | 3 | ||
| DC Input Voltage, Output Voltage (Referenced to GND) | Vin, Vout | 0 | V | Referenced to GND; maximum printed as VCC | 3 | ||
| Operating Temperature Range, All Package Types | TA | -55 | 125 | C | 3 | ||
| Input Rise/Fall Time | tr, tf | 0 | 500 | ns | Figure 1 | 3 | |
| DC Supply Voltage (Referenced to GND) | VCC | -0.5 | 7 | V | Referenced to GND | 3 | |
| DC Input Voltage (Referenced to GND) | Vin | -0.5 | V | Referenced to GND; maximum printed as VCC + 0.5 V | 3 | ||
| DC Output Voltage (Referenced to GND) | Vout | -0.5 | V | Referenced to GND; maximum printed as VCC + 0.5 V | 3 | ||
| DC Input Current, per Pin | Iin | -20 | 20 | mA | per pin | 3 | |
| DC Output Current, per Pin | Iout | -25 | 25 | mA | per pin | 3 | |
| DC Supply Current, VCC and GND Pins | ICC | -50 | 50 | mA | VCC and GND pins | 3 | |
| Power Dissipation in Still Air, TSSOP Package | PD | 450 | mW | Still air, TSSOP package; derating -6.1 mW/C from 65 to 125C | 3 | ||
| Storage Temperature | Tstg | -65 | 150 | C | 3 | ||
| Minimum High-Level Input Voltage | VIH | 2 | V | VCC 4.5 to 5.5 V; Vout = VCC - 0.1 V; /Iout/ <= 20 μA; limit 2.0 at -55 to 125C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.8 | V | VCC 4.5 to 5.5 V; Vout = 0.1 V; /Iout/ <= 20 μA; limit 0.8 at -55 to 125C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 4.4 | V | VCC 4.5 V; Vin = VIH; /Iout/ <= 20 μA | 3 | ||
| Minimum High-Level Output Voltage | VOH | 3.7 | V | VCC 4.5 V; Vin = VIH; /Iout/ <= 6.0 mA; 125C value | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.1 | V | VCC 4.5 V; Vin = VIL; /Iout/ <= 20 μA | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.4 | V | VCC 4.5 V; Vin = VIL; /Iout/ <= 6.0 mA; 125C value | 3 | ||
| Maximum Input Leakage Current | Iin | -1 | 1 | μA | VCC 4.5 V; Vin = VCC or GND; 85 and 125C values | 3 | |
| Maximum Three-State Leakage Current | IOZ | -10 | 10 | μA | VCC 4.5 V; output in high-impedance state; Vin = VIL or VIH; Vout = VCC or GND; 125C value | 3 | |
| Maximum Quiescent Supply Current (per Package) | ICC | 160 | μA | VCC 4.5 V; Vin = VCC or GND; Iout = 0 μA; 125C value | 3 | ||
| Additional Quiescent Supply Current | ICC | 2.9 | mA | VCC 5.5 V; Vin = 2.4 V any one input; Vin = VCC or GND other inputs; Iout = 0 A; at -55C | 3 | ||
| Additional Quiescent Supply Current | ICC | 2.4 | mA | VCC 5.5 V; Vin = 2.4 V any one input; Vin = VCC or GND other inputs; Iout = 0 A; 25 to 125C | 3 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 36 | ns | VCC 4.5 V; CL = 50 pF; Input tr = tf = 6 ns; Figures 1 and 3; 125C value | 4 | ||
| Maximum Propagation Delay, Output Enable to Output Y | tPLZ, tPHZ | 66 | ns | VCC 4.5 V; CL = 50 pF; Input tr = tf = 6 ns; Figures 2 and 4; 125C value | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 18 | ns | VCC 4.5 V; CL = 50 pF; Input tr = tf = 6 ns; Figures 1 and 3; 125C value | 4 | ||
| Maximum Input Capacitance | Cin | 10 | pF | 4 | |||
| Maximum Three-State Output Capacitance | Cout | 15 | pF | Output in high-impedance state | 4 | ||
| Power Dissipation Capacitance (Per Buffer) | CPD | 60 | pF | Typical @ 25C, VCC = 5.0 V | 4 |
CAD (KiCad official)
- Symbol:
MC74HCT365ADTR2G - Footprint:
Package_SO:TSSOP-16_4.4x5mm_P0.65mm - 3D model: TSSOP-16 (KiCad packages3D, STEP)
- 3D model files:
mc74hct365adtr2g-etched.step/mc74hct365adtr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hct365adtr2g.step/mc74hct365adtr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (7 pp, sha256
e7bbc41e65187af7, retrieved 2026-10-20, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).