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MC74HC32ADG

Public Made by Adom

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onsemi Flip Flops, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MC74HC32ADG

onsemi · Flip Flops · SOIC-14

MC74HC32ADG from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Gate 1 input A; unused inputs must be tied to GND or VCC.
2 B1 input Gate 1 input B; unused inputs must be tied to GND or VCC.
3 Y1 output Gate 1 output (Y = A+B), drives 10 LSTTL loads; unused outputs must be left open.
4 A2 input Gate 2 input A; unused inputs must be tied to GND or VCC.
5 B2 input Gate 2 input B; unused inputs must be tied to GND or VCC.
6 Y2 output Gate 2 output (Y = A+B), drives 10 LSTTL loads; unused outputs must be left open.
7 GND power_in Ground pin (0 V reference).
8 Y3 output Gate 3 output (Y = A+B), drives 10 LSTTL loads; unused outputs must be left open.
9 A3 input Gate 3 input A; unused inputs must be tied to GND or VCC.
10 B3 input Gate 3 input B; unused inputs must be tied to GND or VCC.
11 Y4 output Gate 4 output (Y = A+B), drives 10 LSTTL loads; unused outputs must be left open.
12 A4 input Gate 4 input A; unused inputs must be tied to GND or VCC.
13 B4 input Gate 4 input B; unused inputs must be tied to GND or VCC.
14 VCC power_in Positive supply, 2.0 to 6.0 V for MC74HC32A (absolute max -0.5 to +6.5 V).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Logic ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage VCC 2 6 V MC74HC, referenced to GND 2
DC Input/Output Voltage VIN, VOUT 0 V Max = VCC, referenced to GND 2
Operating Free-Air Temperature TA -55 125 °C MC74HC 2
Input Rise or Fall Time tr, tf 0 1000 ns VCC = 2.0 V 2
Input Rise or Fall Time tr, tf 0 500 ns VCC = 4.5 V 2
Input Rise or Fall Time tr, tf 0 400 ns VCC = 6.0 V 2
DC Supply Voltage VCC -0.5 6.5 V 2
DC Input Voltage VIN -0.5 V -0.5 to VCC + 0.5 V 2
DC Output Voltage VOUT -0.5 V -0.5 to VCC + 0.5 V 2
DC Input Current, per Pin IIN -20 20 mA 2
DC Output Current, per Pin IOUT -25 25 mA 2
DC Supply Current, VCC and GND Pins ICC -50 50 mA 2
Input Clamp Current IIK -20 20 mA VIN < 0 or VIN > VCC 2
Output Clamp Current IOK -20 20 mA VOUT < 0 or VOUT > VCC 2
Storage Temperature TSTG -65 150 °C 2
Lead Temperature TL 260 °C 1 mm from case for 10 seconds 2
Junction Temperature Under Bias TJ -150 150 °C 2
Thermal Resistance θJA 116 °C/W SOIC-14 NB 2
Power Dissipation in Still Air PD 1077 mW SOIC-14 NB, at 25 °C 2
ESD Withstand Voltage, Human Body Model VESD 2000 V HBM, >2000 2
Minimum High-Level Input Voltage VIH 1.5 V VCC = 2.0 V, Vout = 0.1V or VCC −0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Input Voltage VIH 2.1 V VCC = 3.0 V, Vout = 0.1V or VCC −0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Input Voltage VIH 3.15 V VCC = 4.5 V, Vout = 0.1V or VCC −0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Input Voltage VIH 4.2 V VCC = 6.0 V, Vout = 0.1V or VCC −0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Maximum Low-Level Input Voltage VIL 0.5 V VCC = 2.0 V, Vout = 0.1V or VCC − 0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Maximum Low-Level Input Voltage VIL 0.9 V VCC = 3.0 V, Vout = 0.1V or VCC − 0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Maximum Low-Level Input Voltage VIL 1.35 V VCC = 4.5 V, Vout = 0.1V or VCC − 0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Maximum Low-Level Input Voltage VIL 1.8 V VCC = 6.0 V, Vout = 0.1V or VCC − 0.1V, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Output Voltage VOH 1.9 V VCC = 2.0 V, Vin = VIH or VIL, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Output Voltage VOH 4.4 V VCC = 4.5 V, Vin = VIH or VIL, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Output Voltage VOH 5.9 V VCC = 6.0 V, Vin = VIH or VIL, /Iout/ ≤ 20µA, −55 to 25 °C 3
Minimum High-Level Output Voltage VOH 2.48 V VCC = 3.0 V, Vin = VIH or VIL, /Iout/ ≤ 2.4mA, −55 to 25 °C 3
Minimum High-Level Output Voltage VOH 3.98 V VCC = 4.5 V, Vin = VIH or VIL, /Iout/ ≤ 4.0mA, −55 to 25 °C 3
Minimum High-Level Output Voltage VOH 5.48 V VCC = 6.0 V, Vin = VIH or VIL, /Iout/ ≤ 5.2mA, −55 to 25 °C 3
Maximum Low-Level Output Voltage VOL 0.1 V VCC = 2.0 V, Vin = VIH or VIL, /Iout/ ≤ 20µA, −55 to 25 °C 3
Maximum Low-Level Output Voltage VOL 0.26 V VCC = 3.0 V, Vin = VIH or VIL, /Iout/ ≤ 2.4mA, −55 to 25 °C 3
Maximum Input Leakage Current Iin -0.1 0.1 µA Vin = VCC or GND, VCC = 6.0 V, −55 to 25 °C 3
Maximum Input Leakage Current Iin -1 1 µA Vin = VCC or GND, VCC = 6.0 V, ≤85 °C 3
Maximum Quiescent Supply Current (per Package) ICC 1 µA Vin = VCC or GND, Iout = 0µA, VCC = 6.0 V, −55 to 25 °C 3
Maximum Quiescent Supply Current (per Package) ICC 10 µA Vin = VCC or GND, Iout = 0µA, VCC = 6.0 V, ≤85 °C 3
Maximum Quiescent Supply Current (per Package) ICC 40 µA Vin = VCC or GND, Iout = 0µA, VCC = 6.0 V, ≤125 °C 3
Maximum Propagation Delay, (A or B) to Y tPLH, tPHL 75 ns VCC = 2.0 V, −55 to 25 °C 3
Maximum Propagation Delay, (A or B) to Y tPLH, tPHL 30 ns VCC = 3.0 V, −55 to 25 °C 3
Maximum Propagation Delay, (A or B) to Y tPLH, tPHL 15 ns VCC = 4.5 V, −55 to 25 °C 3
Maximum Propagation Delay, (A or B) to Y tPLH, tPHL 13 ns VCC = 6.0 V, −55 to 25 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 75 ns VCC = 2.0 V, −55 to 25 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 27 ns VCC = 3.0 V, −55 to 25 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 15 ns VCC = 4.5 V, −55 to 25 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 13 ns VCC = 6.0 V, −55 to 25 °C 3
Maximum Input Capacitance Cin 10 pF −55 to 25 °C 3
Power Dissipation Capacitance (Per Buffer) CPD 20 pF Typical @ 25 °C, VCC = 5.0 V, VEE = 0 V 3

CAD (KiCad official)

  • Symbol: MC74HC32ADG
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mc74hc32adg-etched.step / mc74hc32adg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hc32adg.step / mc74hc32adg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (11 pp, sha256 a2a71019f03fc227, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF