component
MC74HC244ADTR2G
Public Made by Adomby adom
onsemi Buffers, Drivers, Receivers, Transceivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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PCB Footprint
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Datasheet
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README
markdownMC74HC244ADTR2G
onsemi · Buffers, Drivers, Receivers, Transceivers · TSSOP-20
MC74HC244ADTR2G from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Enable A | input | Active-low output enable; when low, the YA1-YA4 outputs act as noninverting buffers, and when high they assume the high-impedance state. |
| 2 | A1 | input | Data input whose noninverted value appears on YA1 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 3 | YB4 | tri_state | Noninverting three-state device output, high impedance when the Enable B pin is high. |
| 4 | A2 | input | Data input whose noninverted value appears on YA2 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 5 | YB3 | tri_state | Noninverting three-state device output, high impedance when the Enable B pin is high. |
| 6 | A3 | input | Data input whose noninverted value appears on YA3 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 7 | YB2 | tri_state | Noninverting three-state device output, high impedance when the Enable B pin is high. |
| 8 | A4 | input | Data input whose noninverted value appears on YA4 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 9 | YB1 | tri_state | Noninverting three-state device output, high impedance when the Enable B pin is high. |
| 10 | GND | power_in | Ground reference for the device (PIN 10 = GND per the logic diagram); all voltages are referenced to this pin. |
| 11 | B1 | input | Data input whose noninverted value appears on YB1 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 12 | YA4 | tri_state | Noninverting three-state device output, high impedance when the Enable A pin is high. |
| 13 | B2 | input | Data input whose noninverted value appears on YB2 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 14 | YA3 | tri_state | Noninverting three-state device output, high impedance when the Enable A pin is high. |
| 15 | B3 | input | Data input whose noninverted value appears on YB3 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 16 | YA2 | tri_state | Noninverting three-state device output, high impedance when the Enable A pin is high. |
| 17 | B4 | input | Data input whose noninverted value appears on YB4 when the outputs are enabled; unused inputs must be tied to GND or VCC. |
| 18 | YA1 | tri_state | Noninverting three-state device output, high impedance when the Enable A pin is high. |
| 19 | Enable B | input | Active-low output enable; when low, the YB1-YB4 outputs act as noninverting buffers, and when high they assume the high-impedance state. |
| 20 | VCC | power_in | Positive supply; the recommended DC supply range is 2.0 V to 6.0 V referenced to GND, with absolute maximum of 7.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-20 |
| Category | Logic |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND), absolute maximum | VCC | -0.5 | 7 | V | 2 | ||
| DC Input Voltage (Referenced to GND), absolute maximum | Vin | -0.5 | V | 2 | |||
| DC Output Voltage (Referenced to GND), absolute maximum | Vout | -0.5 | V | 2 | |||
| DC Input Current, per Pin | Iin | -20 | 20 | mA | per pin | 2 | |
| DC Output Current, per Pin | Iout | -35 | 35 | mA | per pin | 2 | |
| DC Supply Current, VCC and GND Pins | ICC | -75 | 75 | mA | VCC and GND pins | 2 | |
| Input Clamp Current | IIK | -20 | 20 | mA | VI < 0 or VI > VCC | 2 | |
| Output Clamp Current | IOK | -20 | 20 | mA | VO < 0 or VO > VCC | 2 | |
| Power Dissipation in Still Air, TSSOP Package | PD | 450 | mW | Still air, TSSOP package | 2 | ||
| Storage Temperature | Tstg | -65 | 150 | C | 2 | ||
| Lead Temperature | TL | 260 | C | 1 mm from case for 10 seconds (SOIC, SSOP or TSSOP package) | 2 | ||
| DC Supply Voltage (Referenced to GND), recommended | VCC | 2 | 6 | V | 2 | ||
| DC Input Voltage, Output Voltage (Referenced to GND), recommended | Vin, Vout | 0 | V | 2 | |||
| Operating Temperature, All Package Types | TA | -55 | 125 | C | 2 | ||
| Input Rise and Fall Time | tr, tf | 0 | 1000 | ns | VCC = 2.0 V (Figure 1) | 2 | |
| Input Rise and Fall Time | tr, tf | 0 | 500 | ns | VCC = 4.5 V | 2 | |
| Input Rise and Fall Time | tr, tf | 0 | 400 | ns | VCC = 6.0 V | 2 | |
| Minimum High-Level Input Voltage | VIH | 1.5 | V | Vout = VCC, 0.1 V; /Iout/ ≤ 20 µA; VCC = 2.0 V | 3 | ||
| Minimum High-Level Input Voltage | VIH | 2.1 | V | Vout = VCC, 0.1 V; /Iout/ ≤ 20 µA; VCC = 3.0 V | 3 | ||
| Minimum High-Level Input Voltage | VIH | 3.15 | V | Vout = VCC, 0.1 V; /Iout/ ≤ 20 µA; VCC = 4.5 V | 3 | ||
| Minimum High-Level Input Voltage | VIH | 4.2 | V | Vout = VCC, 0.1 V; /Iout/ ≤ 20 µA; VCC = 6.0 V | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.5 | V | Vout = 0.1 V; /Iout/ ≤ 20 µA; VCC = 2.0 V | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.9 | V | Vout = 0.1 V; /Iout/ ≤ 20 µA; VCC = 3.0 V | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 1.35 | V | Vout = 0.1 V; /Iout/ ≤ 20 µA; VCC = 4.5 V | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 1.8 | V | Vout = 0.1 V; /Iout/ ≤ 20 µA; VCC = 6.0 V | 3 | ||
| Minimum High-Level Output Voltage | VOH | 1.9 | V | Vin = VIH; /Iout/ ≤ 20 µA; VCC = 2.0 V | 3 | ||
| Minimum High-Level Output Voltage | VOH | 4.4 | V | Vin = VIH; /Iout/ ≤ 20 µA; VCC = 4.5 V | 3 | ||
| Minimum High-Level Output Voltage | VOH | 5.9 | V | Vin = VIH; /Iout/ ≤ 20 µA; VCC = 6.0 V | 3 | ||
| Minimum High-Level Output Voltage | VOH | 2.2 | V | Vin = VIH; /Iout/ ≤ 2.4 mA; VCC = 3.0 V | 3 | ||
| Minimum High-Level Output Voltage | VOH | 3.7 | V | Vin = VIH; /Iout/ ≤ 6.0 mA; VCC = 4.5 V | 3 | ||
| Minimum High-Level Output Voltage | VOH | 5.2 | V | Vin = VIH; /Iout/ ≤ 7.8 mA; VCC = 6.0 V | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.1 | V | Vin = VIL; /Iout/ ≤ 20 µA; VCC = 2.0 V | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.4 | V | Vin = VIL; /Iout/ ≤ 2.4 mA; VCC = 3.0 V | 3 | ||
| Maximum Input Leakage Current | Iin | -1 | 1 | µA | Vin = VCC or GND; VCC = 6.0 V | 3 | |
| Maximum Three-State Leakage Current | IOZ | -10 | 10 | µA | Output in high-impedance state; Vin = VIL or VIH; Vout = VCC or GND; VCC = 6.0 V | 3 | |
| Maximum Quiescent Supply Current (per Package) | ICC | 160 | µA | Vin = VCC or GND; Iout = 0 µA; VCC = 6.0 V | 3 | ||
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 135 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V | 3 | ||
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 70 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V | 3 | ||
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 27 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V | 3 | ||
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 23 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V | 3 | ||
| Maximum Propagation Delay, Output Enable to YA or YB | tPLZ, tPHZ | 165 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V | 3 | ||
| Maximum Propagation Delay, Output Enable to YA or YB | tPLZ, tPHZ | 80 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V | 3 | ||
| Maximum Propagation Delay, Output Enable to YA or YB | tPLZ, tPHZ | 33 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V | 3 | ||
| Maximum Propagation Delay, Output Enable to YA or YB | tPLZ, tPHZ | 28 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 90 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 32 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 18 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 15 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V | 3 | ||
| Maximum Input Capacitance | Cin | 10 | pF | 3 | |||
| Maximum Three-State Output Capacitance | Cout | 15 | pF | Output in high-impedance state | 3 |
CAD (KiCad official)
- Symbol:
MC74HC244ADTR2G - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files:
mc74hc244adtr2g-etched.step/mc74hc244adtr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hc244adtr2g.step/mc74hc244adtr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (7 pp, sha256
79898eb99ce51700, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).