component
MC74HC1GU04DTT1G
Public Made by Adomby adom
onsemi Inverters, TSOP-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMC74HC1GU04DTT1G
onsemi · Inverters · TSOP-5
MC74HC1GU04DTT1G from onsemi, in a TSOP-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; this pin is not connected internally. |
| 2 | A | input | Inverter input; VIN is rated 0.0 V to VCC in operation and -0.5 V to VCC+0.5 V absolute maximum. |
| 3 | GND | power_in | Ground pin; DC supply current through the ground pin is limited to ±25 mA. |
| 4 | Y | output | Inverter output (Y = NOT A); output source/sink current is limited to ±12.5 mA absolute maximum. |
| 5 | VCC | power_in | Positive supply; recommended 2.0 V to 6.0 V, absolute maximum -0.5 V to +7.0 V for TSOP-5. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSOP-5 |
| Category | Logic |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage | VCC | 2 | 6 | V | 3 | ||
| DC Input Voltage | VIN | 0 | V | Maximum printed as VCC | 3 | ||
| DC Output Voltage | VOUT | 0 | V | Maximum printed as VCC | 3 | ||
| Operating Temperature Range | TA | -55 | 125 | °C | 3 | ||
| Input Rise and Fall Time (TSOP-5) | tr, tf | 0 | 1000 | ns | VCC = 2.0 V | 3 | |
| Input Rise and Fall Time (TSOP-5) | tr, tf | 0 | 600 | ns | VCC = 3.0 V | 3 | |
| Input Rise and Fall Time (TSOP-5) | tr, tf | 0 | 500 | ns | VCC = 4.5 V | 3 | |
| Input Rise and Fall Time (TSOP-5) | tr, tf | 0 | 400 | ns | VCC = 6.0 V | 3 | |
| DC Supply Voltage (TSOP-5) | VCC | -0.5 | 7 | V | TSOP-5 package | 2 | |
| DC Input Voltage | VIN | -0.5 | V | Maximum printed as VCC + 0.5 V | 2 | ||
| DC Output Voltage | VOUT | -0.5 | V | Maximum printed as VCC + 0.5 V | 2 | ||
| DC Input Diode Current | IIK | -20 | 20 | mA | 2 | ||
| DC Output Diode Current | IOK | -20 | 20 | mA | 2 | ||
| DC Output Source/Sink Current | IOUT | -12.5 | 12.5 | mA | 2 | ||
| DC Supply Current per Supply Pin or Ground Pin | ICC or IGND | -25 | 25 | mA | 2 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 2 | ||
| Lead Temperature | TL | 260 | °C | 1 mm from case for 10 seconds | 2 | ||
| Junction Temperature Under Bias | TJ | 150 | °C | 2 | |||
| Latchup Performance (TSOP-5) | ILATCHUP | -500 | 500 | mA | Tested to EIA/JESD78 Class II | 2 | |
| ESD Withstand Voltage, Human Body Model | VESD | 2000 | V | Human Body Model | 2 | ||
| ESD Withstand Voltage, Charged Device Model | VESD | 1000 | V | Charged Device Model | 2 | ||
| High-Level Input Voltage | VIH | 1.7 | V | VCC = 2.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Input Voltage | VIH | 2.45 | V | VCC = 3.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Input Voltage | VIH | 3.6 | V | VCC = 4.5 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Input Voltage | VIH | 4.8 | V | VCC = 6.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Low-Level Input Voltage | VIL | 0.3 | V | VCC = 2.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Low-Level Input Voltage | VIL | 0.5 | V | VCC = 3.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Low-Level Input Voltage | VIL | 0.9 | V | VCC = 4.5 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Low-Level Input Voltage | VIL | 1.2 | V | VCC = 6.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Output Voltage | VOH | 1.8 | V | VIN = VIH or VIL; IOH = −20 µA; VCC = 2.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Output Voltage | VOH | 2.7 | V | VIN = VIH or VIL; IOH = −20 µA; VCC = 3.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Output Voltage | VOH | 4 | V | VIN = VIH or VIL; IOH = −20 µA; VCC = 4.5 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Output Voltage | VOH | 5.5 | V | VIN = VIH or VIL; IOH = −20 µA; VCC = 6.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Output Voltage | VOH | 4.08 | V | VIN = GND; IOH = −2 mA; VCC = 4.5 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| High-Level Output Voltage | VOH | 5.58 | V | VIN = GND; IOH = −2.6 mA; VCC = 6.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Low-Level Output Voltage | VOL | 0.1 | V | VIN = VIH or VIL; IOL = 20 µA; VCC = 2.0 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Low-Level Output Voltage | VOL | 0.4 | V | VIN = VCC; IOL = 2 mA; VCC = 4.5 V; −55°C ≤ TA ≤ 125°C | 3 | ||
| Input Leakage Current | IIN | -1 | 1 | µA | VCC = 6.0 V; VIN = 6.0 V or GND; −55°C ≤ TA ≤ 125°C | 3 | |
| Quiescent Supply Current | ICC | 40 | µA | VCC = 6.0 V; VIN = VCC or GND; −55°C ≤ TA ≤ 125°C | 3 | ||
| Propagation Delay, A to Y | tPLH, tPHL | 25 | ns | VCC = 5.0 V; CL = 15 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Propagation Delay, A to Y | tPLH, tPHL | 155 | ns | VCC = 2.0 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Propagation Delay, A to Y | tPLH, tPHL | 90 | ns | VCC = 3.0 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Propagation Delay, A to Y | tPLH, tPHL | 35 | ns | VCC = 4.5 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Propagation Delay, A to Y | tPLH, tPHL | 26 | ns | VCC = 6.0 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Output Transition Time | tTLH, tTHL | 20 | ns | VCC = 5.0 V; CL = 15 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Output Transition Time | tTLH, tTHL | 200 | ns | VCC = 2.0 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Output Transition Time | tTLH, tTHL | 60 | ns | VCC = 3.0 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Output Transition Time | tTLH, tTHL | 38 | ns | VCC = 4.5 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Output Transition Time | tTLH, tTHL | 32 | ns | VCC = 6.0 V; CL = 50 pF; −55°C ≤ TA ≤ 125°C | 4 | ||
| Input Capacitance | CIN | 10 | pF | 4 |
CAD (KiCad official)
- Symbol:
MC74HC1GU04DTT1G - Footprint:
Package_SO:TSOP-5_1.65x3.05mm_P0.95mm - 3D model: TSOP-5 (KiCad packages3D, STEP)
- 3D model files:
mc74hc1gu04dtt1g-etched.step/mc74hc1gu04dtt1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hc1gu04dtt1g.step/mc74hc1gu04dtt1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (10 pp, sha256
2d66c28489db3f44, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).