component
MC74HC139ADR2G
Public Made by Adomby adom
onsemi Signal Switches, Multiplexers, Decoders, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMC74HC139ADR2G
onsemi · Signal Switches, Multiplexers, Decoders · SOIC-16
MC74HC139ADR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SELECTa | input | Active-low select input for decoder a; when low the outputs Y0a to Y3a follow the address inputs, and when high all outputs Y0a to Y3a are forced high. |
| 2 | A0a | input | Address input A0 for decoder a, which selects one of its four active-low outputs when the decoder is enabled. |
| 3 | A1a | input | Address input A1 for decoder a, which selects one of its four active-low outputs when the decoder is enabled. |
| 4 | Y0a | output | Active-low output 0 of decoder a, which goes low when addressed while SELECTa is active and remains high otherwise. |
| 5 | Y1a | output | Active-low output 1 of decoder a, which goes low when addressed while SELECTa is active and remains high otherwise. |
| 6 | Y2a | output | Active-low output 2 of decoder a, which goes low when addressed while SELECTa is active and remains high otherwise. |
| 7 | Y3a | output | Active-low output 3 of decoder a, which goes low when addressed while SELECTa is active and remains high otherwise. |
| 8 | GND | power_in | Ground pin, the 0 V reference for all voltages on the device (Figure 1, PIN 8 = GND). |
| 9 | Y3b | output | Active-low output 3 of decoder b, which goes low when addressed while SELECTb is active and remains high otherwise. |
| 10 | Y2b | output | Active-low output 2 of decoder b, which goes low when addressed while SELECTb is active and remains high otherwise. |
| 11 | Y1b | output | Active-low output 1 of decoder b, which goes low when addressed while SELECTb is active and remains high otherwise. |
| 12 | Y0b | output | Active-low output 0 of decoder b, which goes low when addressed while SELECTb is active and remains high otherwise. |
| 13 | A1b | input | Address input A1 for decoder b, which selects one of its four active-low outputs when the decoder is enabled. |
| 14 | A0b | input | Address input A0 for decoder b, which selects one of its four active-low outputs when the decoder is enabled. |
| 15 | SELECTb | input | Active-low select input for decoder b; when low the outputs Y0b to Y3b follow the address inputs, and when high all outputs Y0b to Y3b are forced high. |
| 16 | VCC | power_in | Positive supply pin; the device operating voltage range is 2.0 to 6.0 V referenced to GND (Figure 1, PIN 16 = VCC). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-16 |
| Category | Logic |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND) | VCC | -0.5 | 7 | V | Absolute maximum rating | 3 | |
| DC Input Voltage (Referenced to GND) | VIN | -1.5 | V | Referenced to GND; maximum stated as VCC | 3 | ||
| DC Output Voltage (Referenced to GND) | VOUT | -0.5 | V | Referenced to GND; maximum stated as VCC; Note 1: IO absolute maximum rating must be observed | 3 | ||
| DC Input Current, per Pin | IIN | 20 | mA | Per pin | 3 | ||
| DC Output Current, per Pin | IOUT | 25 | mA | Per pin | 3 | ||
| DC Supply Current, VCC Pin | ICC | 50 | mA | VCC pin | 3 | ||
| DC Ground Current per Ground Pin | IGND | 50 | mA | Per ground pin | 3 | ||
| Storage Temperature Range | TSTG | -65 | 150 | C | 3 | ||
| Lead Temperature | TL | 260 | C | 1 mm from case for 10 seconds | 3 | ||
| Junction Temperature Under Bias | TJ | 150 | C | Under bias | 3 | ||
| Power Dissipation in Still Air at 85C | PD | 500 | mW | SOIC package, still air at 85C | 3 | ||
| ESD Withstand Voltage Human Body Model | VESD | 2000 | V | Human Body Model (Note 2) | 3 | ||
| ESD Withstand Voltage Machine Model | VESD | 200 | V | Machine Model (Note 3) | 3 | ||
| ESD Withstand Voltage Charged Device Model | VESD | 1000 | V | Charged Device Model (Note 4) | 3 | ||
| Latchup Performance | ILATCHUP | 300 | mA | Above VCC and below GND at 85C (Note 5) | 3 | ||
| DC Supply Voltage (Referenced to GND) | VCC | 2 | 6 | V | Recommended operating | 3 | |
| DC Input Voltage, Output Voltage (Referenced to GND) | VIN, VOUT | 0 | V | Maximum stated as VCC | 3 | ||
| Operating Temperature, All Package Types | TA | -55 | 125 | C | 3 | ||
| Input Rise and Fall Time | tr, tf | 0 | 1000 | ns | VCC = 2.0 V (Figure 3) | 3 | |
| Input Rise and Fall Time | tr, tf | 0 | 500 | ns | VCC = 4.5 V (Figure 3) | 3 | |
| Input Rise and Fall Time | tr, tf | 0 | 400 | ns | VCC = 6.0 V (Figure 3) | 3 | |
| Minimum High-Level Input Voltage | VIH | 1.5 | V | VCC = 2.0 V; VOUT = 0.1 V or VCC-0.1 V; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Minimum High-Level Input Voltage | VIH | 3.15 | V | VCC = 4.5 V; VOUT = 0.1 V or VCC-0.1 V; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Minimum High-Level Input Voltage | VIH | 4.2 | V | VCC = 6.0 V; VOUT = 0.1 V or VCC-0.1 V; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Maximum Low-Level Input Voltage | VIL | 0.5 | V | VCC = 2.0 V; VOUT = 0.1 V or VCC-0.1 V; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Maximum Low-Level Input Voltage | VIL | 1.35 | V | VCC = 4.5 V; VOUT = 0.1 V or VCC-0.1 V; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Maximum Low-Level Input Voltage | VIL | 1.8 | V | VCC = 6.0 V; VOUT = 0.1 V or VCC-0.1 V; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Minimum High-Level Output Voltage | VOH | 1.9 | V | VCC = 2.0 V; VIN = VIH or VIL; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Minimum High-Level Output Voltage | VOH | 4.4 | V | VCC = 4.5 V; VIN = VIH or VIL; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Minimum High-Level Output Voltage | VOH | 5.9 | V | VCC = 6.0 V; VIN = VIH or VIL; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Minimum High-Level Output Voltage | VOH | 3.98 | V | VCC = 4.5 V; VIN = VIH or VIL; /IOUT/ <= 4.0 mA; 55C to 25C | 4 | ||
| Minimum High-Level Output Voltage | VOH | 5.48 | V | VCC = 6.0 V; VIN = VIH or VIL; /IOUT/ <= 5.2 mA; 55C to 25C | 4 | ||
| Maximum Low-Level Output Voltage | VOL | 0.1 | V | VCC = 2.0 V; VIN = VIH or VIL; /IOUT/ <= 20 uA; 55C to 25C | 4 | ||
| Maximum Low-Level Output Voltage | VOL | 0.26 | V | VCC = 4.5 V; VIN = VIH or VIL; /IOUT/ <= 4.0 mA; 55C to 25C | 4 | ||
| Maximum Input Leakage Current | IIN | 0.1 | uA | VCC = 6.0 V; VIN = VCC or GND; 55C to 25C | 4 | ||
| Maximum Quiescent Supply Current (per Package) | ICC | 4 | uA | VCC = 6.0 V; VIN = VCC or GND; IOUT = 0 A; 55C to 25C | 4 | ||
| Maximum Propagation Delay, Select to Output Y | tPLH, tPHL | 115 | ns | VCC = 2.0 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Select to Output Y | tPLH, tPHL | 23 | ns | VCC = 4.5 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Select to Output Y | tPLH, tPHL | 20 | ns | VCC = 6.0 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 115 | ns | VCC = 2.0 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 2 and 3) | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 23 | ns | VCC = 4.5 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 2 and 3) | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 20 | ns | VCC = 6.0 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 2 and 3) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 75 | ns | VCC = 2.0 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 1 and 3) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 15 | ns | VCC = 4.5 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 1 and 3) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 13 | ns | VCC = 6.0 V; CL = 50 pF; Input tr = tf = 6.0 ns; 55C to 25C (Figures 1 and 3) | 4 | ||
| Maximum Input Capacitance | Cin | 10 | pF | 55C to 25C | 4 | ||
| Power Dissipation Capacitance (Per Decoder) | CPD | 55 | pF | Typical at 25C, VCC = 5.0 V; per decoder (Note 8) | 4 | ||
| Thermal Resistance, Junction-to-Ambient, SOIC | JA | 112 | C/W | SOIC package | 3 |
CAD (KiCad official)
- Symbol:
MC74HC139ADR2G - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
mc74hc139adr2g-etched.step/mc74hc139adr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hc139adr2g.step/mc74hc139adr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (10 pp, sha256
30817e19e8448cad, retrieved 2026-10-21, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).