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MC74AC245DTR2G

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onsemi Buffers, Drivers, Receivers, Transceivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MC74AC245DTR2G

onsemi · Buffers, Drivers, Receivers, Transceivers · TSSOP-20

MC74AC245DTR2G from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 T/R input Transmit/Receive input sets the data direction: HIGH enables data from A ports to B ports (transmit), and LOW enables data from B ports to A ports (receive).
2 A0 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
3 A1 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
4 A2 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
5 A3 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
6 A4 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
7 A5 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
8 A6 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
9 A7 bidirectional Side A 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
10 GND power_in Ground reference; all DC input and output voltages are referenced to GND.
11 B7 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
12 B6 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
13 B5 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
14 B4 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
15 B3 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
16 B2 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
17 B1 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
18 B0 bidirectional Side B 3-state input or 3-state output, rated for 24 mA sink/source at the A and B ports (IOL = 24 mA, IOH = −24 mA).
19 OE input Output Enable input; when HIGH it disables both A and B ports by placing them in a High Z condition.
20 VCC power_in Supply voltage: 2.0 V to 6.0 V for ′AC devices and 4.5 V to 5.5 V for ′ACT devices, referenced to GND (absolute maximum −0.5 V to +7.0 V).

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-20
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (′AC devices) VCC 2 5 6 V ′AC devices 2
Output Current − High IOH -24 mA 2
Output Current − Low IOL 24 mA 2
Operating Ambient Temperature Range TA -40 25 85 °C 2
DC Input Voltage, Output Voltage (Ref. to GND) VIN, VOUT 0 V 2
DC Supply Voltage (Referenced to GND) VCC -0.5 7 V Referenced to GND 2
DC Input Voltage (Referenced to GND) VIN -0.5 V Referenced to GND 2
DC Output Voltage (Referenced to GND) VOUT -0.5 V Referenced to GND; see Note 1 2
DC Input Diode Current IIK -20 20 mA 2
DC Output Diode Current IOK -50 50 mA 2
DC Output Sink/Source Current IOUT -50 50 mA 2
DC Supply Current, per Output Pin ICC -50 50 mA 2
DC Ground Current, per Output Pin IGND -100 100 mA 2
Storage Temperature Range TSTG 150 °C 2
Lead Temperature TL 260 °C 1 mm from case for 10 seconds 2
Junction Temperature Under Bias TJ 140 °C Under bias 2
ESD Withstand Voltage, Human Body Model VESD 2000 V EIA/JESD22-A114-A; printed as > 2000 2
ESD Withstand Voltage, Machine Model VESD 200 V EIA/JESD22-A115-A; printed as > 200 2
ESD Withstand Voltage, Charged Device Model VESD 1000 V JESD22-C101-A; printed as > 1000 2
Latchup Performance ILatchup -100 100 mA Above VCC and below GND at 85C 2
Minimum High Level Input Voltage, VCC 3.0 V VIH 2.1 1.5 V TA −40°C to +85°C column; VOUT = 0.1 V or VCC − 0.1 V 3
Minimum High Level Input Voltage, VCC 4.5 V VIH 3.15 2.25 V TA −40°C to +85°C column; VOUT = 0.1 V or VCC − 0.1 V 3
Minimum High Level Input Voltage, VCC 5.5 V VIH 3.85 2.75 V TA −40°C to +85°C column; VOUT = 0.1 V or VCC − 0.1 V 3
Maximum Low Level Input Voltage, VCC 3.0 V VIL 1.5 0.9 V TA −40°C to +85°C column; VOUT = 0.1 V or VCC − 0.1 V 3
Maximum Low Level Input Voltage, VCC 4.5 V VIL 2.25 1.35 V TA −40°C to +85°C column; VOUT = 0.1 V or VCC − 0.1 V 3
Maximum Low Level Input Voltage, VCC 5.5 V VIL 2.75 1.65 V TA −40°C to +85°C column; VOUT = 0.1 V or VCC − 0.1 V 3
Minimum High Level Output Voltage, VCC 3.0 V VOH 2.9 2.99 V IOUT = −50 µA 3
Minimum High Level Output Voltage, VCC 4.5 V VOH 4.4 4.49 V IOUT = −50 µA 3
Minimum High Level Output Voltage, VCC 5.5 V VOH 5.4 5.49 V IOUT = −50 µA 3
Minimum High Level Output Voltage, VCC 3.0 V VOH 2.46 V VIN = VIL or VIH; IOH = −12 mA 3
Minimum High Level Output Voltage, VCC 4.5 V VOH 3.76 V VIN = VIL or VIH; IOH = −24 mA 3
Minimum High Level Output Voltage, VCC 5.5 V VOH 4.76 V VIN = VIL or VIH; IOH = −24 mA 3
Maximum Low Level Output Voltage, VCC 3.0 V VOL 0.002 0.1 V IOUT = 50 µA 3
Maximum Low Level Output Voltage, VCC 4.5 V VOL 0.001 0.1 V IOUT = 50 µA 3
Maximum Low Level Output Voltage, VCC 5.5 V VOL 0.001 0.1 V IOUT = 50 µA 3
Maximum Low Level Output Voltage, VCC 3.0 V VOL 0.44 V VIN = VIL or VIH; IOL = 12 mA 3
Maximum Low Level Output Voltage, VCC 4.5 V VOL 0.44 V VIN = VIL or VIH; IOL = 24 mA 3
Maximum Low Level Output Voltage, VCC 5.5 V VOL 0.44 V VIN = VIL or VIH; IOL = 24 mA 3
Maximum Input Leakage Current, VCC 5.5 V IIN -1 1 µA VI = VCC, GND 3
Maximum 3-State Current, VCC 5.5 V IOZT -6 6 µA VI (OE) = VIL, VIH; VI = VCC, GND; VO = VCC, GND 3
Minimum Dynamic Output Current, VCC 5.5 V IOLD 75 mA VOLD = 1.65 V Max; max test duration 2.0 ms, one output loaded at a time 3
Minimum Dynamic Output Current, VCC 5.5 V IOHD -75 mA VOHD = 3.85 V Min; max test duration 2.0 ms, one output loaded at a time 3
Maximum Quiescent Supply Current, VCC 5.5 V ICC 8 80 µA VIN = VCC or GND 3
Propagation Delay An to Bn or Bn to An (tPLH), VCC 3.3 V tPLH 1 5 9 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−5 4
Propagation Delay An to Bn or Bn to An (tPHL), VCC 3.3 V tPHL 1 5 9 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−5 4
Output Enable Time (tPZH), VCC 3.3 V tPZH 2 7 12.5 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−7 4
Output Enable Time (tPZL), VCC 3.3 V tPZL 2 7.5 13.5 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−8 4
Output Disable Time (tPHZ), VCC 3.3 V tPHZ 1 6.5 12.5 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−7 4
Output Disable Time (tPLZ), VCC 3.3 V tPLZ 1.5 7 13 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−8 4
Propagation Delay An to Bn or Bn to An (tPLH), VCC 5.0 V tPLH 1 3.5 7 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−5 4
Propagation Delay An to Bn or Bn to An (tPHL), VCC 5.0 V tPHL 1 3.5 7 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−5 4
Output Enable Time (tPZH), VCC 5.0 V tPZH 1 5 9 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−7 4
Output Enable Time (tPZL), VCC 5.0 V tPZL 1 5.5 9.5 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−8 4
Output Disable Time (tPHZ), VCC 5.0 V tPHZ 1 5.5 10 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−7 4
Output Disable Time (tPLZ), VCC 5.0 V tPLZ 1 5.5 10 ns CL = 50 pF; TA −40°C to +85°C; Fig. 3−8 4
Input Rise and Fall Time, ′AC except Schmitt Inputs, VCC 3.0 V tr, tf 150 ns/V VCC = 3.0 V; VIN from 30% to 70% VCC 2
Input Rise and Fall Time, ′AC except Schmitt Inputs, VCC 4.5 V tr, tf 40 ns/V VCC = 4.5 V; VIN from 30% to 70% VCC 2
Input Rise and Fall Time, ′AC except Schmitt Inputs, VCC 5.5 V tr, tf 25 ns/V VCC = 5.5 V; VIN from 30% to 70% VCC 2
Thermal Resistance, Junction-to-Ambient (TSSOP) JA 110.7 °C/W TSSOP package; calculated per JESD 51-7 (Note 2) 2

CAD (KiCad official)

  • Symbol: MC74AC245DTR2G
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: mc74ac245dtr2g-etched.step / mc74ac245dtr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74ac245dtr2g.step / mc74ac245dtr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 a28a6cb76feeacd2, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF