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MC74AC163DR2G

onsemi · Counters, Dividers · SOIC-16

MC74AC163DR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SR input Synchronous Reset input (MR on the '161 variant); a LOW overrides counting and parallel loading and lets all outputs go LOW on the next rising CP edge.
2 CP input Clock pulse input; all Q outputs change only on the LOW-to-HIGH transition of CP.
3 P0 input Parallel data input 0, loaded into flip-flop Q0 on the rising CP edge when PE is LOW.
4 P1 input Parallel data input 1, loaded into flip-flop Q1 on the rising CP edge when PE is LOW.
5 P2 input Parallel data input 2, loaded into flip-flop Q2 on the rising CP edge when PE is LOW.
6 P3 input Parallel data input 3, loaded into flip-flop Q3 on the rising CP edge when PE is LOW.
7 CEP input Count Enable Parallel input; counting requires CEP and CET both HIGH, and a LOW on CEP inhibits counting.
8 GND power_in Ground reference for the device.
9 PE input Parallel Enable input; a LOW overrides counting and loads the Pn data into the flip-flops on the next rising CP edge.
10 CET input Count Enable Trickle input; counting requires CET HIGH, and a LOW inhibits counting and holds the TC output low.
11 Q3 output Flip-flop output Q3 (binary MSB), capable of sourcing and sinking 24 mA.
12 Q2 output Flip-flop output Q2, capable of sourcing and sinking 24 mA.
13 Q1 output Flip-flop output Q1, capable of sourcing and sinking 24 mA.
14 Q0 output Flip-flop output Q0 (binary LSB), capable of sourcing and sinking 24 mA.
15 TC output Terminal Count output, HIGH when CET is HIGH and the counter is in state 15; it is subject to decoding spikes and is not recommended as a clock or asynchronous reset.
16 VCC power_in Supply voltage; 2.0 to 6.0 V for the AC family, 4.5 to 5.5 V for the ACT family, per the recommended operating conditions.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Logic
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (′AC devices) VCC 2 5 6 V ′AC devices 4
DC Input Voltage, Output Voltage (Ref. to GND) VIN, VOUT 0 V Referenced to GND; maximum printed as VCC 4
Input Rise and Fall Time (′AC except Schmitt inputs) tr, tf 150 ns/V VCC @ 3.0 V 4
Input Rise and Fall Time (′AC except Schmitt inputs) tr, tf 40 ns/V VCC @ 4.5 V 4
Input Rise and Fall Time (′AC except Schmitt inputs) tr, tf 25 ns/V VCC @ 5.5 V 4
Operating Ambient Temperature Range TA -40 25 85 °C 4
Output Current − High IOH -24 mA 4
Output Current − Low IOL 24 mA 4
DC Supply Voltage VCC -0.5 7 V 3
DC Input Voltage VI -0.5 V Upper limit printed as VCC + 0.5 V (symbols garbled in text) 3
DC Output Voltage (Note 1) VO -0.5 V Upper limit printed as VCC + 0.5 V (symbols garbled in text) 3
DC Input Diode Current IIK 20 mA 3
DC Output Diode Current IOK 50 mA 3
DC Output Sink/Source Current IO 50 mA 3
DC Supply Current per Output Pin ICC 50 mA 3
DC Ground Current per Output Pin IGND 50 mA 3
Storage Temperature Range TSTG -65 150 °C 3
Junction temperature under Bias TJ 150 °C 3
Thermal Resistance JA 69.1 °C/W Per JESD51-7 (Note 2) 3
Power Dissipation in Still Air PD 500 mW At 65°C; derate to 300 mW at 85°C (Note 3) 3
ESD Withstand Voltage, Human Body Model VESD 2000 V HBM, printed > 2000 (Note 4) 3
Minimum High Level Input Voltage VIH 2.1 1.5 V VCC 3.0 V; VOUT = 0.1 V or VCC − 0.1 V; TA −40°C to +85°C 4
Minimum High Level Input Voltage VIH 3.15 2.25 V VCC 4.5 V; VOUT = 0.1 V or VCC − 0.1 V; TA −40°C to +85°C 4
Minimum High Level Input Voltage VIH 3.85 2.75 V VCC 5.5 V; VOUT = 0.1 V or VCC − 0.1 V; TA −40°C to +85°C 4
Maximum Low Level Input Voltage VIL 1.5 0.9 V VCC 3.0 V; VOUT = 0.1 V or VCC − 0.1 V; TA −40°C to +85°C 4
Maximum Low Level Input Voltage VIL 2.25 1.35 V VCC 4.5 V; VOUT = 0.1 V or VCC − 0.1 V; TA −40°C to +85°C 4
Maximum Low Level Input Voltage VIL 2.75 1.65 V VCC 5.5 V; VOUT = 0.1 V or VCC − 0.1 V; TA −40°C to +85°C 4
Minimum High Level Output Voltage VOH 2.9 2.99 V VCC 3.0 V; IOUT = −50 µA; TA −40°C to +85°C 4
Minimum High Level Output Voltage VOH 4.4 4.49 V VCC 4.5 V; IOUT = −50 µA; TA −40°C to +85°C 4
Minimum High Level Output Voltage VOH 5.4 5.49 V VCC 5.5 V; IOUT = −50 µA; TA −40°C to +85°C 4
Minimum High Level Output Voltage VOH 2.46 V VCC 3.0 V; VIN = VIL or VIH; IOH = −12 mA; TA −40°C to +85°C 4
Minimum High Level Output Voltage VOH 3.76 V VCC 4.5 V; VIN = VIL or VIH; IOH = −24 mA; TA −40°C to +85°C 4
Minimum High Level Output Voltage VOH 4.76 V VCC 5.5 V; VIN = VIL or VIH; IOH = −24 mA; TA −40°C to +85°C 4
Maximum Low Level Output Voltage VOL 0.002 0.1 V VCC 3.0 V; IOUT = 50 µA; TA −40°C to +85°C 4
Maximum Low Level Output Voltage VOL 0.001 0.1 V VCC 4.5 V; IOUT = 50 µA; TA −40°C to +85°C 4
Maximum Low Level Output Voltage VOL 0.44 V VCC 3.0 V; VIN = VIL or VIH; IOL = 12 mA; TA −40°C to +85°C 4
Maximum Input Leakage Current IIN -1 1 µA VCC 5.5 V; VI = VCC, GND; TA −40°C to +85°C 4
Minimum Dynamic Output Current IOLD 75 mA VCC 5.5 V; VOLD = 1.65 V Max 4
Minimum Dynamic Output Current IOHD -75 mA VCC 5.5 V; VOHD = 3.85 V Min 4
Maximum Quiescent Supply Current ICC 80 µA VCC 5.5 V; VIN = VCC or GND; TA −40°C to +85°C 4
Maximum Count Frequency fmax 95 140 MHz VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Propagation Delay CP to Qn (PE HIGH or LOW) tPLH 1 5.5 9.5 ns VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Propagation Delay CP to Qn (PE HIGH or LOW) tPHL 1.5 6 10 ns VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Propagation Delay CP to TC tPLH 1.5 7 11.5 ns VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Propagation Delay CP to TC tPHL 2 8 11.5 ns VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Propagation Delay CET to TC tPLH 1 5.5 7.5 ns VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Propagation Delay CET to TC tPHL 1.5 6 9.5 ns VCC 5.0 V ±0.5 V; CL = 50 pF; TA −40°C to +85°C 5
Setup Time Pn to CP (HIGH or LOW) ts 10.5 4 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Hold Time Pn to CP (HIGH or LOW) th 0 -5 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Setup Time SR to CP (HIGH or LOW) ts 11 4 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Hold Time SR to CP (HIGH or LOW) th 0 -5.5 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Setup Time PE to CP (HIGH or LOW) ts 8.5 4 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Hold Time PE to CP (HIGH or LOW) th 0 -5 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Setup Time CEP or CET to CP (HIGH or LOW) ts 5 2.5 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Hold Time CEP or CET to CP (HIGH or LOW) th 0.5 -3 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Clock Pulse Width (Load) HIGH or LOW tw 3 2 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7
Clock Pulse Width (Count) HIGH or LOW tw 3.5 2 ns VCC 5.0 V ±0.5 V; TA −40°C to +85°C 7

CAD (KiCad official)

  • Symbol: MC74AC163DR2G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: mc74ac163dr2g-etched.step / mc74ac163dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74ac163dr2g.step / mc74ac163dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (13 pp, sha256 5bacfa2bf29bd96b, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF