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MC34152DR2G

onsemi · Gate Drivers · SOIC-8

MC34152DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected Listed as N.C. (no connection) in the SOIC-8 pin connections, and the datasheet gives no function or limit for this pin.
2 Logic Input A input Channel A logic input has 170 mV hysteresis around a 1.67 V threshold, accepts signals from ground to VCC, and has a 30 kΩ pulldown so an open input drives Drive Output A low; for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less.
3 GND power_in Ground reference pin for the device; the datasheet gives no separate electrical limit for this pin beyond its use as the ground return for the drive outputs and logic inputs.
4 Logic Input B input Channel B logic input has 170 mV hysteresis around a 1.67 V threshold, accepts signals from ground to VCC, and has a 30 kΩ pulldown so an open input drives Drive Output B low; for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less.
5 Drive Output B output Channel B totem-pole drive output sources and sinks up to 1.5 A, has a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V, and has no overcurrent or thermal protection so shorting it to VCC or ground must be avoided.
6 VCC power_in Supply pin with an operating voltage of 6.1 V to 18 V and a device maximum of 20 V, requiring proper bypassing when operating at 18 V to keep output ringing below the rating.
7 Drive Output A output Channel A totem-pole drive output sources and sinks up to 1.5 A, has a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V, and has no overcurrent or thermal protection so shorting it to VCC or ground must be avoided.
8 N.C. unconnected Listed as N.C. (no connection) in the SOIC-8 pin connections, and the datasheet gives no function or limit for this pin.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Current, High State IIH 100 300 µA VIH = 2.6 V 3
Input Current, Low State IIL 20 100 µA VIL = 0.8 V 3
Input Threshold Voltage, Output Transition Low-to-High State VIH 1.75 2.6 V 3
Input Threshold Voltage, Output Transition High-to-Low State VIL 0.8 1.58 V 3
Output Voltage Low State VOL 0.8 1.2 V Isink = 10 mA 3
Output Voltage Low State VOL 1.1 1.5 V Isink = 50 mA 3
Output Voltage Low State VOL 1.8 2.5 V Isink = 400 mA 3
Output Voltage High State VOH 10.5 11.2 V Isource = 10 mA 3
Output Voltage High State VOH 10.4 11.1 V Isource = 50 mA 3
Output Voltage High State VOH 10 10.8 V Isource = 400 mA 3
Propagation Delay, Logic Input to Drive Output Rise tPLH (IN/OUT) 55 120 ns CL = 1.0 nF; 10% input to 10% output 3
Propagation Delay, Logic Input to Drive Output Fall tPHL (IN/OUT) 40 120 ns CL = 1.0 nF; 90% input to 90% output 3
Drive Output Rise Time (10% to 90%) tr 14 30 ns CL = 1.0 nF 3
Drive Output Rise Time (10% to 90%) tr 36 ns CL = 2.5 nF 3
Drive Output Fall Time (90% to 10%) tf 15 30 ns CL = 1.0 nF 3
Drive Output Fall Time (90% to 10%) tf 32 ns CL = 2.5 nF 3
Power Supply Current, Standby ICC 6 8 mA Logic inputs grounded 3
Power Supply Current, Operating ICC 10.5 15 mA CL = 1.0 nF drive outputs 1 and 2, f = 100 kHz 3
Operating Voltage VCC 6.1 18 V 3
Undervoltage Lockout Startup Threshold Vth 5.8 6.1 V 3
Power Supply Voltage VCC 20 V 2
Logic Inputs Vin -0.3 V Maximum +VCC; limit to 10 V or VCC, whichever is less, for optimum switching speed (Note 1) 2
Drive Output Totem Pole Sink or Source Current IO 1.5 A 2
Drive Output Diode Clamp Current (Drive Output to VCC) IO(clamp) 1 A 2
Maximum Power Dissipation, D Suffix SOIC-8 PD 0.56 W TA = 50°C 2
Thermal Resistance, Junction-to-Air, D Suffix SOIC-8 RJA 180 °C/W 2
Operating Junction Temperature TJ 150 °C 2
Operating Ambient Temperature, MC34152 TA 0 70 °C MC34152 2
Storage Temperature Range Tstg -65 150 °C 2
Electrostatic Discharge, Human Body Model ESD 2000 V HBM per JESD22-A114-F 2
Electrostatic Discharge, Machine Model ESD 200 V MM per JESD22-A115-A 2
Electrostatic Discharge, Charged Device Model ESD 1500 V CDM per JESD22-C101D 2

CAD (KiCad official)

  • Symbol: MC34152DR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mc34152dr2g-etched.step / mc34152dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc34152dr2g.step / mc34152dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (14 pp, sha256 76fb12e26f4786c2, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF