# MC34151DR2G

**onsemi** · Gate Drive ICs · SOIC-8

MC34151DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N.C. | unconnected | Pin 1 is marked N.C. (no connection) in the SOIC-8 top-view pin connections. |
| 2 | Logic Input A | input | Inverting logic input with 170 mV of hysteresis centered at 1.67 V, accepting signals from ground to VCC, with a 30 kΩ internal pulldown. |
| 3 | GND | power_in | Ground reference pin for the logic inputs, drive outputs and supply. |
| 4 | Logic Input B | input | Inverting logic input with 170 mV of hysteresis centered at 1.67 V, accepting signals from ground to VCC, with a 30 kΩ internal pulldown. |
| 5 | Drive Output B | output | Totem-pole drive output capable of sourcing and sinking up to 1.5 A. |
| 6 | VCC | power_in | Supply pin with an operating voltage of 6.5 V to 18 V and a 20 V maximum power supply voltage rating. |
| 7 | Drive Output A | output | Totem-pole drive output capable of sourcing and sinking up to 1.5 A. |
| 8 | N.C. | unconnected | Pin 8 is marked N.C. (no connection) in the SOIC-8 top-view pin connections. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage | VCC |  |  | 20 | V |  | 2 |
| Logic Inputs | Vin | -0.3 |  |  | V | Upper limit is VCC | 2 |
| Totem Pole Sink or Source Current | IO |  |  | 1.5 | A |  | 2 |
| Diode Clamp Current (Drive Output to VCC) | IO(clamp) |  |  | 1 | A |  | 2 |
| Operating Ambient Temperature (MC34151) | TA | 0 |  | 70 | C | MC34151 | 2 |
| Operating Junction Temperature | TJ |  |  | 150 | C |  | 2 |
| Storage Temperature Range | Tstg | -65 |  | 150 | C |  | 2 |
| Electrostatic Discharge Sensitivity Human Body Model | ESD |  |  | 2000 | V | Human Body Model (HBM) | 2 |
| Electrostatic Discharge Sensitivity Machine Model | ESD |  |  | 200 | V | Machine Model (MM) | 2 |
| Electrostatic Discharge Sensitivity Charged Device Model | ESD |  |  | 1500 | V | Charged Device Model (CDM) | 2 |
| Maximum Power Dissipation | PD |  |  | 0.56 | W | D Suffix SOIC-8 Package, TA = 50C | 2 |
| Thermal Resistance, Junction-to-Air | RJA |  |  | 180 | C/W | D Suffix SOIC-8 Package, junction-to-air | 2 |
| Operating Voltage | VCC | 6.5 |  | 18 | V |  | 3 |
| Input Threshold Voltage - Output Transition High to Low State | VIH |  | 1.75 | 2.6 | V | Output Transition High to Low State | 3 |
| Input Threshold Voltage - Output Transition Low to High State | VIL | 0.8 | 1.58 |  | V | Output Transition Low to High State | 3 |
| Input Current - High State | IIH |  | 200 | 500 | µA | VIH = 2.6 V | 3 |
| Input Current - Low State | IIL |  | 20 | 100 | µA | VIL = 0.8 V | 3 |
| Output Voltage - Low State | VOL |  | 0.8 | 1.2 | V | ISink = 10 mA | 3 |
| Output Voltage - Low State | VOL |  | 1.1 | 1.5 | V | ISink = 50 mA | 3 |
| Output Voltage - Low State | VOL |  | 1.7 | 2.5 | V | ISink = 400 mA | 3 |
| Output Voltage - High State | VOH | 10.5 | 11.2 |  | V | ISource = 10 mA | 3 |
| Output Voltage - High State | VOH | 10.4 | 11.1 |  | V | ISource = 50 mA | 3 |
| Output Voltage - High State | VOH | 9.5 | 10.9 |  | V | ISource = 400 mA | 3 |
| Output Pulldown Resistor | RPD |  | 100 |  | k |  | 3 |
| Propagation Delay Logic Input to Drive Output Rise | tPLH(in/out) |  | 35 | 100 | ns | 10% Input to 10% Output, CL = 1.0 nF | 3 |
| Propagation Delay Logic Input to Drive Output Fall | tPHL(in/out) |  | 36 | 100 | ns | 10% Input to 10% Output, CL = 1.0 nF | 3 |
| Drive Output Rise Time (10% to 90%) | tr |  | 14 | 30 | ns | CL = 1.0 nF | 3 |
| Drive Output Rise Time (10% to 90%) | tr |  | 31 |  | ns | CL = 2.5 nF | 3 |
| Drive Output Fall Time (90% to 10%) | tf |  | 16 | 30 | ns | CL = 1.0 nF | 3 |
| Drive Output Fall Time (90% to 10%) | tf |  | 32 |  | ns | CL = 2.5 nF | 3 |
| Power Supply Current Standby | ICC |  | 6 | 10 | mA | Logic Inputs Grounded | 3 |
| Power Supply Current Operating | ICC |  | 10.5 | 15 | mA | CL = 1.0 nF Drive Outputs 1 and 2, f = 100 kHz | 3 |

## CAD (KiCad official)

- Symbol: `MC34151DR2G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `mc34151dr2g-etched.step` / `mc34151dr2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc34151dr2g.step` / `mc34151dr2g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/mc34151-d.pdf) (15 pp, sha256 `843ec04dc3338937`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `off` (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mc34151dr2g-datasheet.pdf)