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MC33664ATL1EGR2

NXP Semicon · Interface - Specialized · SO-16

MC33664ATL1EGR2 from NXP Semicon, in a SO-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SCLK_TX input SPI transmit clock from the microcontroller to the MC33664, up to 2.0 MHz, with logic levels referenced to VIO (max VIO + 0.3 V).
2 CSB_TX input SPI transmit chip select from the microcontroller to the MC33664, with an internal 100 kΩ pull-up.
3 DATA_TX input SPI transmit data from the microcontroller to the MC33664, with an internal 100 kΩ pull-down.
4 EN input Enable control pin for the MCU to put the MC33664 into Sleep mode (EN = 0) or Normal mode (EN = 1), with an internal 100 kΩ pull-down.
5 SCLK_RX output Message receive SPI clock output to the microcontroller, up to 2.0 MHz.
6 CSB_RX output Message receive SPI chip select output to the microcontroller.
7 DATA_RX output Message receive SPI data output to the microcontroller.
8 INTB output Digital interrupt pin used to trigger MCU wake-ups, giving a 100 µs verification pulse after EN goes from LOW to HIGH.
9 VIO power_in Digital 3.3 V/5.0 V power supply to the IC, with a normal operating range of 3.1 V to 5.5 V and an absolute maximum of 7.0 V.
10 DGND power_in Digital ground, the reference for the VIO and logic pins.
11 GNDT power_in Terminate to ground.
12 GNDS power_in Substrate ground; terminate to ground.
13 RDTX- bidirectional Transformer communication bi-directional bus pin, with a ±10 V absolute maximum rating.
14 RDTX+ bidirectional Transformer communication bi-directional bus pin, with a ±10 V absolute maximum rating.
15 AGND power_in Analog ground, the reference for the VCC5 supply and bus pins.
16 VCC5 power_in 5.0 V input supply, with a fully operational range of 4.75 V to 5.5 V and an absolute maximum of 7.0 V.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package SO-16
Category Interface ICs
Pins 16

CAD (KiCad official)

  • Symbol: MC33664ATL1EGR2
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SO-16 (KiCad packages3D, STEP)
  • 3D model files: mc33664atl1egr2-etched.step / mc33664atl1egr2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc33664atl1egr2.step / mc33664atl1egr2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (15 pp, sha256 17eb8c4ae973c5ec, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF