# MC33202DR2G

**onsemi** · Operational Amplifier · SOIC-8

MC33202DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT1 | output | Output of amplifier 1. Rail-to-rail output swings within 50 mV of VCC and VEE with 10 kΩ load; capable of ±80 mA short-circuit source/sink; drives loads down to 600 Ω. |
| 2 | IN1- | input | Inverting input of amplifier 1. High impedance (~200 kΩ differential, 8 pF), typical input bias current 80 nA. Common-mode range extends from VEE to VCC. |
| 3 | IN1+ | input | Non-inverting input of amplifier 1. High impedance, rail-to-rail common-mode range (VEE to VCC), inputs may be driven 200 mV beyond the rails without phase reversal. |
| 4 | VEE | power_in | Negative supply / ground. Total supply (VCC−VEE) up to +13 V absolute max; typical single-supply operation with VEE = GND, or split supply down to −6 V. |
| 5 | IN2+ | input | Non-inverting input of amplifier 2. High impedance, rail-to-rail common-mode range (VEE to VCC), inputs may be driven 200 mV beyond the rails without phase reversal. |
| 6 | IN2- | input | Inverting input of amplifier 2. High impedance (~200 kΩ differential, 8 pF), typical input bias current 80 nA. Common-mode range extends from VEE to VCC. |
| 7 | OUT2 | output | Output of amplifier 2. Rail-to-rail output swings within 50 mV of VCC and VEE with 10 kΩ load; capable of ±80 mA short-circuit source/sink; drives loads down to 600 Ω. |
| 8 | VCC | power_in | Positive supply. Single-supply range +1.8 V to +12 V (or split up to +6 V); absolute maximum VCC−VEE = +13 V. Bypass with a local ceramic decoupling capacitor to VEE. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Op-amp/Cmp |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `MC33202DR2GD`
- `MC33202DR2GVD`
- `MC33202DR2G`
- `MC33202DR2GDG`
- `MC33202DR2GVDR2G`
- `MC33202DR2GP`
- `MC33202DR2GVP`
- `MC33202DR2GDM`

## CAD (KiCad official)

- Symbol: `MC33202DR2G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `mc33202dr2g-etched.step` / `mc33202dr2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc33202dr2g.step` / `mc33202dr2g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/mc33202-d.pdf) (17 pp, sha256 `511a3f1f88efb0fe`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mc33202dr2g-datasheet.pdf)