# MC33201DR2G

**onsemi** · Operational Amplifier · SOIC-8

MC33201DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. Leave floating or tie to a convenient net; not internally bonded. |
| 2 | IN- | input | Inverting input of the op-amp. Common-mode range extends rail-to-rail (VEE to VCC). Do not exceed either supply rail by more than 500 mV; differential input voltage is internally clamped by back-to-back diodes, so use series current-limit resistors for large differential drive. |
| 3 | IN+ | input | Non-inverting input of the op-amp. Rail-to-rail common-mode range (VEE to VCC); typical input bias current 80 nA. Differential input resistance ≈ 200 kΩ, differential input capacitance ≈ 8 pF. |
| 4 | VEE | power_in | Negative supply rail (or ground in single-supply operation). Total supply (VCC - VEE) must not exceed +13 V absolute max; guaranteed operation from 1.8 V up to 12 V total supply. |
| 5 | NC | unconnected | No connection. Not internally bonded; may be left floating. |
| 6 | OUT | output | Op-amp output. Rail-to-rail swing within 50 mV of each supply (RL = 10 kΩ); short-circuit current typically 80 mA (source/sink). Capable of driving 600 Ω loads; open-loop output impedance ≈ 100 Ω at 2 MHz, AV = 10. |
| 7 | VCC | power_in | Positive supply rail. Operating range from +1.8 V (to ground) up to +12 V (to ground); absolute maximum VCC-VEE = +13 V. Typical supply current per amplifier = 0.9 mA (max 1.125 mA). |
| 8 | NC | unconnected | No connection. Not internally bonded; may be left floating. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Op-amp/Cmp |
| Pins | 8 |

## Ordering variants

- `MC33201DR2GDG`
- `MC33201DR2G`
- `MC33201DR2GVDG`
- `MC33201DR2GVDR2G`
- `MC33201DR2GPG`

## CAD (KiCad official)

- Symbol: `MC33201DR2G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `mc33201dr2g-etched.step` / `mc33201dr2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc33201dr2g.step` / `mc33201dr2g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/mc33201-d.pdf) (None pp, sha256 `511a3f1f88efb0fe`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mc33201dr2g-datasheet.pdf)