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MC33151DR2G

onsemi · Gate Drivers · SOIC-8

MC33151DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected Not internally connected on the SOIC-8 package; the datasheet gives no function for this pin.
2 Logic Input A input Inverting logic input for channel A with about 170 mV of hysteresis, a threshold centered at 1.67 V, a signal range from ground to VCC, and an internal 30 kΩ pulldown that forces Drive Output A high when left open.
3 GND power_in Device ground reference; the logic inputs accept signals from ground up to VCC.
4 Logic Input B input Inverting logic input for channel B with about 170 mV of hysteresis, a threshold centered at 1.67 V, a signal range from ground to VCC, and an internal 30 kΩ pulldown that forces Drive Output B high when left open.
5 Drive Output B output Totem-pole gate drive output for channel B that sources and sinks up to 1.5 A; there is no overcurrent or thermal protection, so shorting the output to VCC or ground must be avoided.
6 VCC power_in Supply pin with a 6.5 V to 18 V operating range and a 20 V maximum device rating; bypass close to this pin and ground.
7 Drive Output A output Totem-pole gate drive output for channel A that sources and sinks up to 1.5 A; there is no overcurrent or thermal protection, so shorting the output to VCC or ground must be avoided.
8 N.C. unconnected Not internally connected on the SOIC-8 package; the datasheet gives no function for this pin.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Threshold Voltage (output transition high to low state) VIH 2.6 V VCC = 12 V; TA range -40 to +85 C (MC33151) 3
Input Threshold Voltage (output transition low to high state) VIL 0.8 V VCC = 12 V; TA range -40 to +85 C (MC33151) 3
Input Current - High State IIH 200 500 A VIH = 2.6 V 3
Input Current - Low State IIL 20 100 A VIL = 0.8 V 3
Output Voltage - Low State VOL 0.8 1.2 V ISink = 10 mA 3
Output Voltage - Low State VOL 1.1 1.5 V ISink = 50 mA 3
Output Voltage - Low State VOL 1.7 2.5 V ISink = 400 mA 3
Output Voltage - High State VOH 10.5 11.2 V ISource = 10 mA 3
Output Voltage - High State VOH 10.4 11.1 V ISource = 50 mA 3
Output Voltage - High State VOH 9.5 10.9 V ISource = 400 mA 3
Propagation Delay - Logic Input to Drive Output Rise tPLH(in/out) 35 100 ns 10% input to 10% output, CL = 1.0 nF 3
Propagation Delay - Logic Input to Drive Output Fall tPHL(in/out) 36 100 ns 10% input to 10% output, CL = 1.0 nF 3
Drive Output Rise Time (10% to 90%) tr 14 30 ns CL = 1.0 nF 3
Drive Output Fall Time (90% to 10%) tf 16 30 ns CL = 1.0 nF 3
Power Supply Current - Standby ICC 6 10 mA Logic inputs grounded 3
Power Supply Current - Operating ICC 10.5 15 mA CL = 1.0 nF drive outputs 1 and 2, f = 100 kHz 3
Operating Voltage VCC 6.5 18 V 3
Power Supply Voltage VCC 20 V 2
Logic Inputs (Vin) Vin -0.3 V Maximum listed as VCC; see note 1 (10 V or VCC, whichever is less, for optimum switching speed) 2
Totem Pole Sink or Source Current IO 1.5 A Drive outputs 2
Diode Clamp Current (Drive Output to VCC) IO(clamp) 1 A 2
Maximum Power Dissipation (D Suffix SOIC-8) PD 0.56 W TA = 50 C 2
Thermal Resistance, Junction-to-Air (D Suffix SOIC-8) RJA 180 C/W 2
Operating Junction Temperature TJ 150 C 2
Operating Ambient Temperature (MC33151) TA -40 85 C MC33151 grade 2
Storage Temperature Range Tstg -65 150 C 2
ESD Human Body Model ESD 2000 V HBM per JESD22-A114-F 2
ESD Machine Model ESD 200 V MM per JESD22-A115-A 2
ESD Charged Device Model ESD 1500 V CDM per JESD22-C101D 2

CAD (KiCad official)

  • Symbol: MC33151DR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mc33151dr2g-etched.step / mc33151dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc33151dr2g.step / mc33151dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (12 pp, sha256 6e505f0e76022c3c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF