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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs mc33074dr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
mc33074dr2g-etched.fit.json mc33074dr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
mc33074dr2g-etched.glb mc33074dr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
mc33074dr2g-etched.step mc33074dr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
mc33074dr2g.glb Publish 0.1.0 · Ray 1mo ago
mc33074dr2g.kicad_mod Publish 0.1.0 · Ray 1mo ago
mc33074dr2g.kicad_sym Publish 0.1.0 · Ray 1mo ago
mc33074dr2g.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect and oval pad as a SQUARE EAGLE smd; this carries the real pad shape across (0 -> 14 rounded pads) and stops dropping geometry drawn on KiCad User.N layers. Attributes, connects, pads and the pin-1 marker are gated against decreasing and are unchanged. · Ray 1mo ago
mc33074dr2g.step Publish 0.1.0 · Ray 1mo ago
package.json Publish 0.2.0 · Ray 1mo ago
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
page.json Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout") · Ray 7d ago
README.md mc33074dr2g: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 14d ago

MC33074DR2G

onsemi · Operational Amplifier · SOIC-14

MC33074DR2G from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Output 1 output Output of amplifier 1. All-NPN output stage with no deadband crossover distortion; swings from approximately VEE+0.1 V to VCC-0.9 V into a 2 kOhm load. Short-circuit current typ 30 mA source/sink.
2 Input 1- input Inverting input of amplifier 1. High-impedance Darlington input; typ input bias current 100 nA, differential input resistance 150 MOhm. Common-mode range VEE to VCC-1.8 V.
3 Input 1+ input Non-inverting input of amplifier 1. High-impedance Darlington input; typ input bias current 100 nA. Common-mode range includes ground (VEE to VCC-1.8 V).
4 VCC power_in Positive supply rail. Operates from 3.0 V single supply up to 44 V total (from VEE to VCC). Supply current per amplifier typ 1.9 mA at +/-15 V.
5 Input 2+ input Non-inverting input of amplifier 2. Darlington input stage; common-mode range includes ground (VEE to VCC-1.8 V).
6 Input 2- input Inverting input of amplifier 2. Darlington input stage; typ input bias current 100 nA.
7 Output 2 output Output of amplifier 2. All-NPN output stage; typ short-circuit current 30 mA source/sink; drives capacitive loads up to 10,000 pF.
8 Output 3 output Output of amplifier 3. All-NPN output stage; typ short-circuit current 30 mA source/sink.
9 Input 3- input Inverting input of amplifier 3. Darlington input stage; typ input bias current 100 nA.
10 Input 3+ input Non-inverting input of amplifier 3. Darlington input stage; common-mode range includes ground.
11 VEE power_in Negative supply rail (or GND in single-supply operation). Supply-voltage range 3.0 V to 44 V total (VCC-VEE). Tie to ground for single-supply operation.
12 Input 4+ input Non-inverting input of amplifier 4. Darlington input stage; common-mode range includes ground.
13 Input 4- input Inverting input of amplifier 4. Darlington input stage; typ input bias current 100 nA.
14 Output 4 output Output of amplifier 4. All-NPN output stage; typ short-circuit current 30 mA source/sink; drives capacitive loads up to 10,000 pF.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Op-amp/Cmp
Pins 14

Ordering variants

Same part, different packaging or reel option.

  • MC33074DR2GD
  • MC33074DR2G
  • MC33074DR2GDG
  • MC33074DR2GP
  • MC33074DR2GPG
  • MC33074DR2GDTB
  • MC33074DR2GDTBG
  • MC33074DR2GDTBR2G
  • MC33074DR2GMT
  • MC33074DR2GMTTBG

CAD (KiCad official)

  • Symbol: MC33074DR2G
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mc33074dr2g-etched.step / mc33074dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc33074dr2g.step / mc33074dr2g.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
mc33074dr2g.step 195 KB You want the bare part, or you mark your own boards.
mc33074dr2g-etched.step 2.7 MB You want the part with MC33074DR2G already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 677 faces against 237 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (26 pp, sha256 bac1389f1389705f, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF